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Innodisk unveils DDR5 6400 64GB DRAM series to empower Edge AI

Fri, Nov 01, 2024

This 6400 series is purpose-built for data-intensive applications in AI, telehealth, and edge computing, where high performance at the edge is crucial. Available in versatile form factors, including CUDIMM, CSODIMM, and RDIMM, the series delivers speed, stability, and capacity to meet the rigorous demands of modern edge AI and industrial applications.

The DDR5 6400 series delivers a data transfer rate of 6400 MT/s, offering a 14% boost in speed over previous generations and doubling the maximum capacity to 64GB. These enhancements make it an optimal choice for applications like Large Language Models (LLMs), generative AI, autonomous vehicles, and mixed reality, which require high-speed, reliable data processing in real time.

Innodisk’s DDR5 6400 series integrates several advanced technologies to ensure stable, uninterrupted performance:

• Client Clock Driver (CKD): Enhances signal integrity by buffering clock signals, which is essential for minimising noise and ensuring accuracy during high-frequency data transfers.
• Transient Voltage Suppressor (TVS): Offers robust protection against voltage fluctuations, safeguarding sensitive components.
• eFuse Circuit Protection (RDIMM): Designed to interrupt the circuit in case of overvoltage, preventing damage to components in server systems with higher voltage requirements.
• Wide Industrial Temperature Range: The DDR5 6400 series is designed to operate in temperatures from 0°C to 95°C (Tc) and will soon support an extended range of -40°C to 95°C (Tc), making it ideal for challenging industrial environments.
• Anti-Sulfuration Protection: 30μ” gold plating protects against sulfurisation, ensuring long-term durability.

The DDR5 6400 series is fully compatible with the latest Intel and AMD processors and supports a range of options—CUDIMM, CSODIMM, ECC CUDIMM, ECC CSODIMM, and RDIMM—with capacities from 8GB to 64GB, giving users flexible configurations for varied use cases.

Beyond cloud-based AI, Innodisk’s DDR5 6400 memory modules are ideal for next-generation edge AI applications, where real-time responsiveness and enhanced security are crucial. For instance, smart factories can leverage LLMs to consolidate and manage complex production data instantly, supporting swift decision-making. In remote healthcare, high-resolution 3D imaging and real-time data analysis empower precise, remote surgical procedures for patients. In releasing the DDR5 6400 series, Innodisk reinforces its commitment to delivering innovative memory solutions that drive advancements in AI, telehealth, and industrial automation.

For more information, please visit https://www.innodisk.com

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Mouser is now shipping the new MCX W series MCUs from NXP Semiconductors

Tue, Oct 29, 2024

The MCX W series are compact, secure, wireless MCUs designed to enable interoperable, scalable and innovative designs for the next generation of smart and secure connected devices in edge, IoT, smart home, building automation and controls, and smart energy applications.

The NXP Semiconductors MCX W series is based on the Arm Cortex-M33 core, offering a unified range of pin-compatible multiprotocol wireless MCUs for Matter, Thread, Bluetooth Low Energy and Zigbee. The MCX W series includes the industry’s first wireless MCU to support the new Bluetooth Channel Sounding standard, which improves the accuracy and security of distance measurement compared to traditional Bluetooth technology for a wide range of applications, such as secure access, asset tracking and indoor wayfinding. With NXP’s Trimension portfolio of ultra-wideband (UWB) secure radar and fine-ranging products, The MCX W series enhances a broad range of market segments and applications in ambient computing. The MCX W series supports both standalone or hosted architectures and is pin- and software-compatible, allowing developers to easily migrate to the part that best fits their use case. The MCX W series is supported by the MCUXpresso Developer Experience.

Also available is the NXP FRDM-MCXW71 development board. The FRDM-MCXW71 is a compact and scalable multiprotocol board for rapid prototyping and easy evaluation of the MCXW71 wireless MCU, with wireless support for Bluetooth LE, Zigbee, Thread, and Matter. This board includes an onboard MCU-Link debugger, industry-standard headers for easy access to the MCU’s I/Os, an accelerometer, a light sensor, and external SPI flash memory.

https://eu.mouser.com

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Renesas introduces new RX261/RX260 group of MCUs

Wed, Oct 23, 2024

Renesas has introduced the RX261 and RX260 microcontroller (MCU) Groups. The new 64 MHz MCUs deliver power efficiency of only 69μA/MHz during active operation and 1μA in standby mode. They also enable designers to easily implement water-resistant capacitive touch sensors and deliver robust security. This combination of performance and features position the RX261/RX260 Group MCUs for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

The RX261/RX260 Group MCUs are based on Renesas’ RXv3 CPU core, enabling 355CoreMark at 64MHz. This score is 2.5 times higher than competing 64-MHz class MCUs. Compared to other 64-MHz class MCUs, the RX261/RX260 also delivers 25 percent lower active current and 87 percent lower standby current. This outstanding power efficiency minimises current consumption during intermittent operation. These low power features help customers meet strict energy regulations for home appliances and extend the operating time of battery-powered applications.

Renesas’ third-generation capacitive touch IP (CTSU2SL) delivers high noise immunity and water resistance, allowing users to implement touch sensors in kitchen appliances and outdoor equipment such as smart locks. The automatic judgement function reduces current consumption during intermittent operation by enabling touch detections even in standby state. The QE for Capacitive Touch tuning tool, design guides, and sample programs ease the implementation of touch sensors in multiple applications.

Today, many consumer and industrial systems offer wireless connectivity features such as Bluetooth and/or Wi-Fi to enable smartphone controls or to download new firmware from cloud servers. By implementing security features with the Renesas Secure IP (RSIP-E11A) and flash protection functions, users can protect their applications from unauthorised use such as data falsification and eavesdropping by attackers. Sample programs help users to implement secure boot and secure firmware update functions quickly and easily.

The RX261 Group MCUs provide a wide range of features, including a Full Speed USB function controller with a high-speed on-chip oscillator (HOCO) that eliminates the need for external crystals to generate an accurate USB clock. A CAN FD module is also included to enable fast and reliable communication. Unlike some other MCUs, the RX261/RX260 Group MCUs include 8 KB data flash enabling customers to eliminate the need for an external EEPROM.

https://www.renesas.com/RX261

https://www.renesas.com/RX260

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ST adds network-ready convenience and dual-wireless resilience to IoT module

Mon, Oct 21, 2024

ST is making large-scale IoT deployments easier to connect and manage with new enhancements to its cellular data-communications module, accelerating the adoption of sustainable smart grids and smart industry.

The ST87M01 module platform is NB-IoT certified, with an optional state-of-the-art ST4SIM embedded SIM (eSIM) for accessing connectivity services. Furthermore, the modules now come pre-loaded with a Vodafone profile so customers can have quick and easy access to Vodafone’s extensive global connectivity footprint.

Also, ST has added wireless Meter-Bus (wM-Bus) connectivity in the same module, that provides an additional standardised channel, backing up the cellular connection, for collecting data such as household utility consumption. Using wM-Bus can provide cover in case of a cellular network outage and gives flexibility for drive-in and work-in meter readings.

Central to this module’s flexibility is the software-defined radio that ST has specially designed for this device, which enables dynamic switching between cellular NB-IoT and sub-GHz wM-Bus communication modes. This lets the module support a wide variety of use cases and adapt to specific needs including using wM-Bus as backup communication for extra resilience. Further flexibility comes from letting users embed their own code directly in the module for simple applications or connect to a separate host microcontroller in more sophisticated use cases.

In addition, the Vodafone profile is available in the ST87M01 variant that integrates NB-IoT with a multi-constellation GNSS receiver to enable location-based applications such as safety monitoring for remote workers, asset tracking, and general intelligent logistics. The embedded GNSS receiver saves power by operating during NB-IoT sleep time slots. All the ST87M01 module variants are industrial-grade qualified and come with a 10.6mm x 12.8mm package enabling designers to create reliable and cost-effective products with an ultra-compact overall form factor.

By combining location and multi-connectivity options on the same module, the ST87M01 platform can be used for industrial condition monitoring, factory automation, smart agriculture, environmental monitoring, and in smart buildings, smart cities, and smart infrastructure.

The module itself and all the internal components are entirely conceived, designed, and industrialised by ST, which ensures the complete control and management of the bill of materials and supply chain. This represents a unique market offer in terms of product quality, security, and longevity.

The ST87M01 platform is in production now and only available directly from ST. Please contact your local ST sales office for pricing and sample options.

https://www.st.com/st87m01

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Innodisk unveils DDR5 6400 64GB DRAM series to empower Edge AI

Mouser is now shipping the new MCX W series MCUs from NXP Semiconductors

Renesas introduces new RX261/RX260 group of MCUs

ST adds network-ready convenience and dual-wireless resilience to IoT module

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