Integrated and Compact CAN FD system basis chip solution from Microchip

The increase in connected applications in the automotive and industrial markets is driving demand for wired connectivity solutions with higher bandwidth, lower latency and enhanced security. Reliable and secure communication networking solutions are vital for transmitting and processing data as intended. Microchip has announced the new family of ATA650x CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5V Low-Drop Voltage Regulator (LDO) available in compact 8-, 10- and 14-pin space-saving packages.

The ATA650x CAN FD SBCs offer a tiny footprint of 2 mm × 3 mm for the VDFN8 package, 3 mm × 3 mm for the VDFN10 package and 3 mm × 4.5 mm for the VDFN14 package. With a built-in high-speed CAN FD transceiver, the SBCs support data transmit and receive rates of up to 5 Mbps.

A solution for space and power-constrained applications, these SBCs exhibit very low power consumption, with a typical sleep current of just 15 μA. The ATA650x SBCs enable control of the VCC supply voltage by the bus signals, which reduces the current consumption of automotive Electronic Control Units (ECUs). To further reduce power consumption, the SBCs can disable the microcontroller supply by switching off LDOs during sleep mode.

The safety features available in the ATA650x device include fail safe, protection and diagnostic functions to provide reliable bus communication in advanced networks. Designed to withstand Electrostatic Discharge (ESD) and equipped with Electromagnetic Compatibility (EMC) performance, the ATA650x devices are robust solutions for applications operating in harsh environments.

The integrated SBC solution is Functional Safety ready to help customers achieve an ISO 26262 safety certification or the desired ASIL level. Additionally, the SBCs are AEC-Q100 qualified with a Grade 0 rating and are designed to operate in temperatures ranging from −40°C to +150°C.

https://www.microchip.com

> Read More

Microchip expands PolarFire FPGA and SoC solution stacks

The rise of IoT, industrial automation and smart robotics, along with the proliferation of medical imaging solutions to the intelligent edge, has made designing these types of power and thermally constrained applications more complex than ever before. To address the critical challenges of accelerating product development cycles and easing complicated development processes, Microchip has released PolarFire FPGA and SoC solution stacks for smart robotics and medical imaging. These new releases build upon Microchip’s smart embedded vision, industrial edge and intelligent edge communications stacks already available.

The solution stacks include firmware and IP cores for AI-assisted 4K60 computer vision, a diverse set of ready-to-use sensor and camera interfaces and integrated hardware for high-speed Ethernet protocols. Real-time ROS-2 compatible cores facilitate robotics tasks for perception and coordinate transformation. The stacks offer time-sensitive industrial networking protocols for OPC/UA, rich operating systems support and asymmetric processing commonly used in industrial automation. Software design kits allow for a high-level of customisation and support diverse development environments centred around C/C++, RTL and popular machine learning frameworks, including the SmartHLS IDE, VectorBlox Accelerator SDK and the and Libero SoC Design Suite which has been certified for applications needing IEC61503 SIL 3 functional safety. The solution stacks bring together the industry’s most power-efficient and secure mid-range PolarFire FPGAs and PolarFire SoC FPGAs, a rich mix of hardware and software solutions with cyber security protections that allow system designers the freedom to innovate in medical imaging and robotics applications.

One example of Microchip’s innovative solution stacks can be found in its recently announced PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform. With its ability to bridge real-time sensor data to NVIDIA Holoscan and the NVIDIA IGX and NVIDIA Jetson platforms for edge AI and robotics, the Sensor Bridge unlocks new edge-to-cloud applications, enables AI/ML inferencing and facilitates the adoption of AI in medical, industrial and automotive markets.

https://www.microchip.com

> Read More

Sfera Labs Strato Pi Max is now powered by the Raspberry Pi compute module 5

Sfera Labs has announced the latest evolution of its Strato Pi Max platform, incorporating the latest Raspberry Pi Compute Module 5 (CM5).

Strato Pi Max is a versatile Raspberry Pi Controller and features a modular design, a hybrid CPU/MCU architecture, and extensive customisation options. This adaptability enables the Strato Pi Max to support bespoke requirements of all industrial automation projects, as well as to evolve with them.

Housed in a compact, 9- or 6-module DIN-Rail case, Strato Pi Max features two Ethernet ports, SSD, eMMC and dual SD card storage options, as well as two USB 2.0 type-A ports, with individual power control and fault detection. The platform also incorporates a slate of robust reliability and security features, including redundant storage, secure element chip, tamper detection, and hardware watchdog.

The Strato Pi Max can be easily expanded via its X2-Series expansion boards in order to meet the specific needs of industrial automation projects. These expansion boards can add up to 16 RS-485 or RS-422 ports, 4 CAN V2.0B ports, digital and analog I/O, UPS, and LTE to provide a flexible, scalable and future-proof solution.

Strato Pi Max is designed to adapt to unique requirements, offering the flexibility to create hardware tailored to specific needs. Its modular design supports both standard expansion boards and custom-built boards, enabling the integration of specialised sensors or the development of application-specific interfaces. This ensures full control over automation projects.

Additionally, Sfera Labs provides custom provisioning services, including preloaded OS images, firmware, and branding, delivering ready-to-deploy devices to customers.

https://sferalabs.cc/strato-pi-max/

> Read More

ST introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm

ST has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST’s powerful STM32 ecosystem and Qualcomm Technologies’ leading wireless connectivity solutions.

The first of these modules, the ST67W611M1, contains a Qualcomm® QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo, made easy to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU). The module will support Matter protocol over Wi-Fi for future-proof connectivity, making the STM32 portfolio seamlessly accessible to the Matter ecosystem. Aiding the system integration, the module also contains 4Mbyte Flash for code and data storage, and a 40MHz crystal. There is also an integrated PCB antenna or micro RF (uFL) connector for an external antenna.

“Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group (MDRF) at STMicroelectronics. “Qualcomm’s expertise in highly influential and widely used wireless connectivity technologies is now at product developers’ fingertips and combines with the powerful software, tools, features and project acceleration offered by the STM32 development ecosystem.”

“This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications,” said Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit, Qualcomm Technologies, Inc. “We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G and more.”

Advanced hardware security is built in, with hardware cryptographic accelerators, as well as services including secure boot and secure debug, reaching PSA Certified Level 1 protection. The module is self-contained and pre-certified according to mandatory specifications, requiring no RF design expertise from the user to create a working solution. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. AI enhancements include the recently introduced STM32N6 MCUs, which contain ST’s Neural-ART Accelerator, and the ST Edge AI Suite that provides an AI Model Zoo and STM32Cube.AI and NanoEdge AI optimisation tools.

The modules are designed to be quickly and seamlessly integrated with any STM32 microcontroller or STM32 microprocessor, which offer flexible options for performance, price, and power across a broad spectrum. The MCUs available range from cost- and power-sensitive devices containing the Arm® Cortex®-M0+ core to devices containing high performing cores such as Cortex-M4 and Cortex-A7 in the STM32MP1/2 MPUs.

Samples of the ST67W611M1 are available, with OEM availability in Q1 2025, with broader availability in Q2 2025.

https://www.st.com/st67w

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration