Nvidia prepares for AI infrastructure with Hopper architecture

At GTC 2022, Nvidia announced its next generation accelerated computing platform “to power the next wave of AI data centres”. The Hopper architecture succeeds the Ampere architecture, launched in 2020.

The company also announced its first Hopper-based GPU, the NVIDIA H100, equipped with 80 billion transistors. Described as the world’s largest and most powerful accelerator, the H100 has a Transformer Engine and a scalable NVLink interconnect for advancing gigantic AI language models, deep recommender systems, genomics and complex digital twins. 

The Nvidia H100 GPU features major advances to accelerate AI, HPC, memory bandwidth, interconnect and communication, including nearly 5Tbytes per second of external connectivity. H100 is the first GPU to support PCIe Gen5 and the first to utilise HBM3, enabling 3Tbytes per second of memory bandwidth, claimed Nvidia. 

According to Jensen Huang, CEO, 20 H100 GPUs can sustain the equivalent of the entire world’s internet traffic, making it possible for customers to deliver advanced recommender systems and large language models running inference on data in real time. 

The Transformer Engine is built to speed up these networks as much as six times compared with the previous generation without losing accuracy. 

MIG technology allows a single GPU to be partitioned into seven smaller, fully isolated instances to handle different types of jobs. The Hopper architecture extends MIG capabilities by up to a factor of seven over the previous generation by offering secure multi-tenant configurations in cloud environments across each GPU instance.

According to the company, H100 is the first accelerator with confidential computing capabilities to protect AI models and customer data while they are being processed. Customers can also apply confidential computing to federated learning for privacy-sensitive industries like healthcare and financial services, as well as on shared cloud infrastructures. 

To accelerate the largest AI models, NVLink combines with an external NVLink Switch to extend NVLink as a scale-up network beyond the server, connecting up to 256 H100 GPUs at nine times higher bandwidth versus the previous generation using NVIDIA HDR Quantum InfiniBand. 

New DPX instructions accelerate dynamic programming by up to 40 times compared with CPUs and up to a factor of seven compared with previous generation GPUs, said Nvidia. This includes, for example, the Floyd-Warshall algorithm to find optimal routes for autonomous robot fleets and the Smith-Waterman algorithm used in sequence alignment for DNA and protein classification and folding. Availability NVIDIA H100 will be available starting in Q3. 

https://www.nvidia.com

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AMD implements 3D die stacking for data centre CPU 

Claimed to be the world’s first data centre CPU using 3D die stacking, the third generation AMD EPYC processors with AMD 3D V-Cache technology (codenamed Milan-X) has been released. AMD built the CPU family on the Zen 3 core architecture and can deliver up to 66 per cent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked third gen AMD EPYC processors, reported the company.

The new processors are also claimed to feature the industry’s largest L3 cache, delivering the same socket, software compatibility and modern security features as third gen EPYC CPUs but with features for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis, used in testing and validating designs.

“Building upon our momentum in the data centre . . .  [third generation] AMD EPYC processors with AMD 3D V-Cache technology . . . offer the industry’s first workload-tailored server processor with 3D die stacking technology,” said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. “Our latest processors with AMD 3D V-Cache technology provide breakthrough performance for mission-critical technical computing workloads leading to better designed products and faster time to market,” he added.

Technical computing workloads relying heavily on large data sets. These workloads benefit from increased cache size, however 2D chip designs have physical limitations on the amount of cache that can effectively be built on the CPU. AMD 3D V-Cache technology solves these physical challenges by bonding the AMD Zen 3 core to the cache module, increasing the amount of L3 while minimising latency and increasing throughput, according to AMD. This represents a step forward in CPU design and packaging and enables breakthrough performance in targeted technical computing workloads, commented the company.

The third generation AMD EPYC processors with AMD 3D V-Cache technology deliver faster time-to-results on targeted workloads. For example, the 16-core, AMD EPYC 7373X CPU can deliver up to 66 per cent faster simulations on Synopsys VCS, when compared to the EPYC 73F3 CPU. 

The 64-core AMD EPYC 7773X processor can deliver, on average, 44 per cent more performance on Altair Radioss simulation applications compared to the competition’s top of stack processor, claimed AMD. In a third comparison, AMD reported the 32-core AMD EPYC 7573X processor can solve an average of 88 per cent more computational flow dynamic (CFD) problems per day than a comparable competitive 32-core count processor, while running Ansys CFX.

These performance capabilities enable customers to deploy fewer servers and reduce power consumption in the data centre, helping to lower total cost of ownership (TCO), reduce carbon footprint and address environmental sustainability goals, said AMD. 

The third generation AMD EPYC processors with AMD 3D V-Cache technology are available today from OEM partners, including, Atos, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo, QCT, and Supermicro.

Third generation AMD EPYC processors with AMD 3D V-Cache technology are also broadly supported by AMD software ecosystem partners, including, Altair, Ansys, Cadence, Dassault Systèmes, Siemens, and Synopsys.

Microsoft Azure HBv3 virtual machines (VMs) have now been fully upgraded to third generation AMD EPYC with AMD 3D V-Cache technology. 

http://www.amd.com

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RF amplifier spaces 380MHz to 6GHz for single amp testing

Broadband RF amplifiers in the R&S BBA300 family span a wide frequency range between 380MHz to 6GHz continuously within a single amplifier. Rohde & Schwarz claimed that they are the widest band, most flexible broadband RF amplifiers available.

The BBA300 family provides a single amplifier that eliminates the need to switch instruments or bands during a test, making automotive and wide band wireless communication radios testing easier, said Rohde & Schwarz. 

The continuous wide frequency range is believed to be an industry first. It addresses the requirements of EMC test centres, RF component designers and product design and validation. 

Two models are initially available: the BBA300-DE operates from 1.0 to 6.0GHz and the BBA300-CDE has a capability of 380MHz to 6.0GHz. 

The BBA300 family’s design and manufacture provide linearity and noise power density as low as -110dBm/Hz. It is also claimed to ensure excellent harmonic performance (down to -25dBc). Intelligent protection features ensure high availability, even in the event of component failure. Self-protection is built-in to ensure the instruments are robust against RF mismatch up to VSWR of 6:1. 

The BBA300 models have smart settings and activation functions which adapt instruments’ settings and behaviour according to the application. The amplifier design offers the ability to realise a broad array of customer system set ups for flexible, scalable working, with upgradable frequency and power. 

The R&S BBA300-DE and R&S BBA300-CDE models are available now from Rohde & Schwarz and selected distribution partners.

The Rohde & Schwarz technology group provides products for test and measurement, technology systems, networks and cybersecurity. The group was founded more than 85 years ago and is headquartered in Munich, Germany.

http://www.rohde-schwarz.com 

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Moxa unveils series of 68 industrial Ethernet switches

According to Moxa, the EDS-4000/G4000 series of industrial Ethernet switches help to futureproof industrial automation. The EDS-4000/G4000 series includes 68 models designed to help developers strengthen operational resilience in industrial spaces such as power, transportation, maritime, and factory automation.

“Recently, we have observed that our customers find it more challenging to connect their devices while fulfilling a variety of requirements for critical infrastructure,” said Gary Chang, product manager at Moxa Networking. “Critical infrastructure requires advanced networking solutions that strengthen operational resilience and futureproof networks,” he continued, adding that the EDS-4000/G4000 portfolio of switches provides networking capabilities for “secure, reliable, and high-bandwidth industrial networks”.

Operational technology (OT) and IT convergence is accelerating, putting network security, high performance, strong reliability, and advanced usability into sharp focus in the construction of industrial networks that strengthen operational resilience.

Switches in the EDS-4000/G4000 series are claimed to be the world’s first IEC 62443-4-2-certified Ethernet switches. Integral hardened security was developed by following the stringent software development lifecycle described in the standard, said Moxa. 

The number of connected devices in industrial operations is growing exponentially, therefore the EDS-4000/G4000 series provides multiple interface combinations with up to 14 ports and a range of options including fast Ethernet, Gigabit, 2.5GbE uplinks, SFP (small form factor pluggable) interface and IEEE 802.3bt PoE connectivity. This enables customers to connect more devices especially in applications such as intelligent transportation systems that require high power and high bandwidth networking.

The EDS-4000/G4000 Series is certified for NEMA TS2, EN 50121-4, IEC 61850-3/IEEE 16132, DNV2, ATEX Zone 23, Class I Division 23. The switches also feature Turbo Ring and Turbo Chain fast network recovery to ensure smooth operation.

Moxa has included an improved web GUI (graphical user interface) for a more intuitive way for users to perform configurations and network management. The rotatable power module offers flexibility to field engineers when they are installing devices and maintaining the network. LED indicators on two sides of the device help engineers easily identify the status of networking devices.

http://www.moxa.com

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