Virtual development environment for accelerates automotive development

A virtual development environment announced by Renesas Electronics enables  development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). 

The environment includes a virtual turnkey platform, which allows engineers to develop application software before devices or evaluation boards are available. There is also a multi-core debug and trace tool, which enables users to analyse and evaluate software as if running on an actual chip. 

“With the evolution of E/E architecture, there is an increasing demand for software design that can maximise performance at a system level,” explains Hiroshi Kawaguchi, vice president, Automotive Software Development division at Renesas. At the same time, the increasing time and cost associated with software development have become a big challenge. “Our integrated software development environment that can be used across gateway systems, ADAS, and xEV development, enables customers to benefit from the scalability of Renesas products such as R-Car and the RH850 family for both software and hardware development.”

 The virtual turnkey platform application software development environment consists of the R-Car Virtual Platform (R-Car VPF) development environment and a software development kit (R-Car SDK) that includes pre-tested software libraries and sample code. R-Car VPF is based on Virtualizer Development Kits (VDKs) from Synopsys, and integrates virtual models of IP specific to R-Car to customise for R-Car devices. By overlaying the R-Car SDK engineers can immediately start development of application software virtually. The platform accurately recreates the behaviour of the chip and eliminates the need to build up a development environment with a physical evaluation board. Multiple users can also develop software simultaneously on separate PCs or servers.

The next step is to integrate the software and verify that it runs on a single chip. Software components share resources such as the multiple CPUs and IPs on R-Car SoCs. If operational problems are detected after the software components are integrated, it requires a tremendous amount of work to analyse and solve them, explains Renesas. The Multicore Debug and Trace tool analyses and identifies the causes of errors occurring from the interaction of the multiple hardware resources in R-Car SoCs. This enables synchronous and simultaneous debugging of the entire heterogeneous architecture of R-Car without using the actual device.

The development environment is available for the R-Car S4 SoC for automotive gateways. Renesas has plans to support the R-Car V4H as well as future versions of R-Car products and RH850 automotive MCUs.

https://www.renesas.com

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Cadence completes Ethernet subsystem with controller IP

High speed Ethernet controller IP released by Cadence enables complete Ethernet subsystem solutions up to 800G. Optimised for power, performance and area (PPA), the low latency, high speed controller IP expands Cadence’s Ethernet controller IP portfolio and supports aggregated bandwidths for 100G, 200G, 400G and 800G Ethernet.

It also offers support for both single- and multi-Ethernet channel solutions and complies with IEEE 802.3 and Ethernet Technology Consortium specifications. 

The IP provides full-featured media access control (MAC), physical coding sub-layer (PCS), forward error correction (FEC) and physical medium attachment (PMA) blocks, for a complete architecture, says Cadence.

The integrated RS(528,514), RS(544,514), Firecode and Ethernet Technology Consortium Low Latency RS FEC support allows customers to choose the best option for an application’s requirements.

“The exploding bandwidth demand from cloud, AI / ML and 5G has driven Ethernet protocols to evolve and has accelerated 800G market adoption,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. The company also supplies 112G / 56G and other Ethernet SerDes PHY IP for a sub-system with integrated PHY and controller that enable customers to integrate and streamline SoC designs. 

Cadence has more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP. Cadence’s customers develop electronic products from chips to boards to systems for consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. 

http://www.cadence.com

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Amphenol RF releases Wi-Fi 6-capable cable assemblies

Miniature cable assemblies from Amphenol RF have been supplemented with the introduction of SMA to AMC configurations on micro-coax cable types, capable of Wi-Fi 6 performance. 

The additional SMA to AMC configurations are on 1.13 and 1.32mm micro-coax cables. The configurations offer more efficient bandwidth sharing and RF performance up to 9.0GHz. According to Amphenol, the versatile SMA connector is coupled with the small footprint AMC connector, making the assemblies suitable for IoT, antenna and Wi-Fi 6 applications.

SMA connectors are a popular choice for designs that require vibration resistant capabilities because the threaded coupling mechanism ensures a secure connection. The front mount SMA bulkhead jacks are constructed with gold plated brass bodies and gold plated phosphor bronze contacts. The AMC connectors are compatible with the industry standard U.FL for miniature connectors. In addition to saving space, the AMC connectors introduced by Amphenol RF have a user friendly tactile lock which guarantees a reliable connection, says the company. These right-angle connectors are engineered with either gold plated black PBT (polybutylene terephthalate) or silver plated phosphor bronze bodies and gold plated phosphor bronze contact. Flexible micro-coax cables complete this assembly design; they are also designed for applications where space is limited. The 1.32mm version is also double shielded to ensure low signal loss.

These 50 Ohm SMA to AMC cable assemblies join Amphenol RF’s collection of existing miniature cable assemblies. They feature an extended frequency range that allows them to support Wi-Fi 6 and Wi-Fi 6E, high-efficiency Wi-Fi designs. This type of Wi-Fi is typically used in dense environments and employs advanced antenna technology which allows for more simultaneous communications and improved speeds.

Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency (RF), microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions. 

https://www.amphenolrf.com

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mmW 5G chipset addresses 5G NR FR2 spectrum 

Designers can reduce the complexity of 5G radio and reduce the number of components required, using a millimeter wave (mmW) 5G front-end chipset by Analog Devices. 

It comprises two single channel (1T1R) up / down converters (UDCs) and two dual polarisation 16-channel beamformer devices on a CMOS process. The power efficiency and linear output power provided by the beamformers enable size, weight, power, and cost reduction in mmW phased array designs compared to competing solutions, claims Analog Devices. The full-band UDCs with high drive level eliminate the need for frequency band variants and absorb driver stages for bill of materials savings. 

The mmW 5G front-end chipset includes four devices from Analog Devices, the ADMV4828, the ADMV4928, the ADMV1128 and ADMV1139. 

The ADMV4828 is a16-channel beamformer covering the 24 to 29.5GHz band in a single IC with more than 12.5dBm output power at three per cent error vector measurement (EVM) with a 400MHz 64QAM 5G NR (new radio) waveform while consuming only 310mW per channel.

The ADMV4928 is a 16-channel beamformer covering the 37 to 43.5GHz band in a single IC with above 11.5dBm output power at three per cent EVM with a 400MHz 64QAM 5G NR waveform while consuming only 340mW per channel.

The ADMV1128 is the company’s 24GHz to 29.5GHz wideband UDC with optional on-chip RF switch and hybrid, x2 /x4 local oscillator (LO) multiplier modes and baseband IQ support.

The fourth element is the ADMV1139, a 37 to 50GHz wideband UDC suitable for the upcoming 47GHz, as well as the 37 to 43.5GHz 5G NR bands. The single IC has optional on-chip RF switch and hybrid, with baseband IQ support.

The chipset enables seamless operation of phased array calibration functions online in the field in addition to factory non-volatile memory (NVM) through patented IP. This allows OEMs to move beyond the constraints of legacy NVM-only designs limited to one-time factory calibration of the beamformer, which does not address non-idealities external to the ICs and results in sub-optimal calibration results.

Analog Devices adds that mmW 5G deployment highlights the need for operators to expand their network footprint with more energy efficient, lightweight, and reliable radios. This requires highly linear, compact, and power efficient wideband products that allow design reuse over multiple bands without compromising on quality and performance. Analog Devices says that this mmW 5G front-end chipset allows OEMs to depart from the narrowband paradigm where competing solutions have traded-off design execution difficulty and RF performance for bandwidth, while also outsourcing critical pieces of IP such as packaging, test, and thermal modelling. 

The company also offers in-house quality management and package development, enabling engineers to create reliable, fully optimised, and customisable 5G radios quickly. 

http://www.analog.com

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