Latest News Archives - Page 22 of 576 - SmartCitiesElectronics.com

Renesas introduces new RX261/RX260 group of MCUs

Wed, Oct 23, 2024

Renesas has introduced the RX261 and RX260 microcontroller (MCU) Groups. The new 64 MHz MCUs deliver power efficiency of only 69μA/MHz during active operation and 1μA in standby mode. They also enable designers to easily implement water-resistant capacitive touch sensors and deliver robust security. This combination of performance and features position the RX261/RX260 Group MCUs for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

The RX261/RX260 Group MCUs are based on Renesas’ RXv3 CPU core, enabling 355CoreMark at 64MHz. This score is 2.5 times higher than competing 64-MHz class MCUs. Compared to other 64-MHz class MCUs, the RX261/RX260 also delivers 25 percent lower active current and 87 percent lower standby current. This outstanding power efficiency minimises current consumption during intermittent operation. These low power features help customers meet strict energy regulations for home appliances and extend the operating time of battery-powered applications.

Renesas’ third-generation capacitive touch IP (CTSU2SL) delivers high noise immunity and water resistance, allowing users to implement touch sensors in kitchen appliances and outdoor equipment such as smart locks. The automatic judgement function reduces current consumption during intermittent operation by enabling touch detections even in standby state. The QE for Capacitive Touch tuning tool, design guides, and sample programs ease the implementation of touch sensors in multiple applications.

Today, many consumer and industrial systems offer wireless connectivity features such as Bluetooth and/or Wi-Fi to enable smartphone controls or to download new firmware from cloud servers. By implementing security features with the Renesas Secure IP (RSIP-E11A) and flash protection functions, users can protect their applications from unauthorised use such as data falsification and eavesdropping by attackers. Sample programs help users to implement secure boot and secure firmware update functions quickly and easily.

The RX261 Group MCUs provide a wide range of features, including a Full Speed USB function controller with a high-speed on-chip oscillator (HOCO) that eliminates the need for external crystals to generate an accurate USB clock. A CAN FD module is also included to enable fast and reliable communication. Unlike some other MCUs, the RX261/RX260 Group MCUs include 8 KB data flash enabling customers to eliminate the need for an external EEPROM.

https://www.renesas.com/RX261

https://www.renesas.com/RX260

> Read More

ST adds network-ready convenience and dual-wireless resilience to IoT module

Mon, Oct 21, 2024

ST is making large-scale IoT deployments easier to connect and manage with new enhancements to its cellular data-communications module, accelerating the adoption of sustainable smart grids and smart industry.

The ST87M01 module platform is NB-IoT certified, with an optional state-of-the-art ST4SIM embedded SIM (eSIM) for accessing connectivity services. Furthermore, the modules now come pre-loaded with a Vodafone profile so customers can have quick and easy access to Vodafone’s extensive global connectivity footprint.

Also, ST has added wireless Meter-Bus (wM-Bus) connectivity in the same module, that provides an additional standardised channel, backing up the cellular connection, for collecting data such as household utility consumption. Using wM-Bus can provide cover in case of a cellular network outage and gives flexibility for drive-in and work-in meter readings.

Central to this module’s flexibility is the software-defined radio that ST has specially designed for this device, which enables dynamic switching between cellular NB-IoT and sub-GHz wM-Bus communication modes. This lets the module support a wide variety of use cases and adapt to specific needs including using wM-Bus as backup communication for extra resilience. Further flexibility comes from letting users embed their own code directly in the module for simple applications or connect to a separate host microcontroller in more sophisticated use cases.

In addition, the Vodafone profile is available in the ST87M01 variant that integrates NB-IoT with a multi-constellation GNSS receiver to enable location-based applications such as safety monitoring for remote workers, asset tracking, and general intelligent logistics. The embedded GNSS receiver saves power by operating during NB-IoT sleep time slots. All the ST87M01 module variants are industrial-grade qualified and come with a 10.6mm x 12.8mm package enabling designers to create reliable and cost-effective products with an ultra-compact overall form factor.

By combining location and multi-connectivity options on the same module, the ST87M01 platform can be used for industrial condition monitoring, factory automation, smart agriculture, environmental monitoring, and in smart buildings, smart cities, and smart infrastructure.

The module itself and all the internal components are entirely conceived, designed, and industrialised by ST, which ensures the complete control and management of the bill of materials and supply chain. This represents a unique market offer in terms of product quality, security, and longevity.

The ST87M01 platform is in production now and only available directly from ST. Please contact your local ST sales office for pricing and sample options.

https://www.st.com/st87m01

> Read More

Renesas introduces four-channel master IC and sensor signal conditioner for the growing IO-link market

Wed, Oct 16, 2024

Renesas has introduced two semiconductor solutions for the rapidly growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 – IO-Link ready, dual-channel resistive sensor signal conditioner IC.

IO-Link is a digital communication protocol that is used most widely in industrial automation applications. As a standardised technology, it enables seamless communication between sensors, actuators, and other devices in an automation system. IO-Link has become increasingly popular in recent years due to its ability to provide real-time data and diagnostics and its ease of use and compatibility with existing systems. It also regulates & reduces wiring, enhances data availability, and offers remote configuration and monitoring.

Renesas’ new CCE4511 is the industry’s first four-channel master IC for the IO-Link protocol with 500mA driving current for each channel and provides numerous advantages over two-channel master devices. It saves energy, reduces PCB size and requires fewer external components than competitive offerings.

The CCE4511 offers a high-voltage interface along with overvoltage detection and over-current protection. To improve application performance, an integrated IO-Link Frame Handler is provided, which automates most of the lower layer communication tasks. This reduces the microcontroller (MCU) loads significantly, thus gaining more performance for other tasks, and/or allowing designers to use a less expensive MCU. The CCE4511 has an ambient operating temperature of up to 125º C for harsh industrial environments. It also supports detection of ready pulses from IO-Link devices, which is required to fulfil the newly defined IO-Link Safety System Extension.

The ZSSC3286 is a dual path sensor signal conditioning IC (SSC) for highly accurate amplification, digitisation, and sensor-specific correction of sensor signals. It supports IO-Link connectivity with an integrated IO-Link stack running the IO-Link Smart Sensor Profile for digital measuring and switching sensors. The device is suitable for bridge and half-bridge sensors, as well as external voltage-source elements. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 32-bit Arm-based math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications.

ZSSC3286 is the first sensor signal conditioner with an integrated IO-Link compliant stack. Traditionally, an additional microcontroller has been used to run the stack. The ZSSC3286 obsoletes the MCU, saving board space and costs. It also offers two parallel ADCs with up to 24-bit resolution, a measurement scheduler for optimised performance, and advanced system diagnostic functions.

Renesas has combined both the CCE4511 and the ZSSC3286 with other offerings from Renesas’ broad line of embedded processing, analog, power and connectivity solutions to create the IO-Link Sensor Winning Combination. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimised low-risk design for a faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.

https://www.renesas.com/win

> Read More

Microchip releases 20 Wi-Fi products for industrial and commercial applications

Tue, Oct 15, 2024

With Industry 4.0, the rapid rise of Artificial Intelligence (AI), digitised manufacturing and the age of IoT everything, the demand for wireless connectivity in commercial and industrial applications is growing at an exceptional pace. These applications typically require reliable connectivity that can withstand extreme environments that are exposed to high temperatures, background noise and obstructions. To help meet this need, Microchip Technology has added 20 products to its Wi-Fi® portfolio.

The company’s Wi-Fi solutions are designed to support various application needs and developer skill levels. The selection ranges from modules that are regulatory certified in several countries that require no Radio Frequency (RF) expertise and little programming to robust Systems-on-Chip (SoCs) with industrial-level features.

Microchip’s Wi-Fi portfolio includes:
• Wi-Fi MCUs: all-in-one solution designed to combine the functionality of an MCU with reliable wireless connectivity
• Link Controllers: an SDIO interface enables the addition of Wi-Fi to Linux MPUs
• Network Controllers: an SPI interface allows the addition of wireless connectivity to an MCU
• Plug-and-Play Modules: simplify wireless-to-cloud connectivity by sending simple text commands from an MCU over a UART interface

The latest PIC32MZ-W1 Wi-Fi MCUs build on Microchip’s trusted 32-bit MCU line and feature advanced analog peripherals—including CAN, Ethernet, capacitive touch and ADC—to offer exceptional versatility. Additionally, the new devices feature some of the highest General-Purpose Input/Output (GPIO) capabilities on the market.

Also included in the lineup are next-generation WINCS02 network controllers and WILCS02 link controllers. Updates to the popular WINC and WILC solutions include improved radio performance and enhanced security features. The new wireless modules are pin-to-pin compatible with previous generations to ease migration from legacy devices.

To simplify Wi-Fi to cloud connectivity, Microchip has also expanded its plug-and-play product line with new RNWF02 modules. These modules connect MCUs to a cloud platform using simple ASCII commands sent over a UART interface.

Secure connections, which are critical for Wi-Fi applications that send or receive data from the cloud, can be challenging to implement depending on the developer’s skill level. To ease this process, Microchip has integrated its Trust Platform into many of its Wi-Fi products. Trust&GO module variants are pre-provisioned for secure authentication with popular cloud services, including AWS® and Azure®, to streamline the process of network authentication.

Millions of Microchip Wi-Fi products are already powering industrial applications around the world, offering seamless integration, enhanced security, robust connectivity and long-term performance and reliability throughout their lifecycle.

Microchip’s Wi-Fi portfolio is supported by a comprehensive suite of development tools, application demos, evaluation boards and services. Additional services include free design checks to give developers the support they need to create high-quality products efficiently.

https://www.microchip.com

> Read More

Renesas introduces new RX261/RX260 group of MCUs

ST adds network-ready convenience and dual-wireless resilience to IoT module

Renesas introduces four-channel master IC and sensor signal conditioner for the growing IO-link market

Microchip releases 20 Wi-Fi products for industrial and commercial applications

About Smart Cities