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Infineon adds the AIROC CYW20820 system on chip for flexibility, low power and high-performance connectivity

Mon, Jun 20, 2022

Infineon Technologies is adding the AIROC CYW20820 Bluetooth and Bluetooth LE (low energy) system on chip (SoC) to its AIROC Bluetooth portfolio. The AIROC CYW20820 is a Bluetooth 5.2 core specification-compliant device for IoT applications. It is designed to support a wide spectrum of uses for home automation and sensors, including medical, home, security and industrial, as well as lighting, Bluetooth Mesh, or any IoT application that needs Bluetooth LE or dual mode Bluetooth connectivity.

The AIROC CYW20820 is claimed to provide reliable connectivity and low power with high performance compute capability, integrating an Arm Cortex-M4 microcontroller unit with a floating point unit. It features multiple digital interfaces, an optimised memory subsystem and a power amplifier that delivers up to 11.5dBm transmit output power in LE and BR (basic rate) modes, reducing the device footprint and the costs associated with implementing Bluetooth solutions.

Infineon is also adding three modules that include an onboard crystal oscillator, passive components and the AIROC CYW20820 SoC. These integrated modules are globally certified to support fast time-to-market of IoT devices. The AIROC CYBT-243053-02, CYBT-253059-02 and CYBT-243068-02 are supported by ModusToolbox software and tools with code examples to support the rapid development of Bluetooth applications.

“The AIROC CYW20820 Bluetooth, Bluetooth LE SoC and modules are key additions to our portfolio and provide a solution that is low-power, cost-efficient and with scalable performance. With certified AIROC modules, Infineon is taking care of key steps in Bluetooth design to enable customers to have the quickest path to market.” said Sonal Chandrasekharan, vice president of the Bluetooth product line at Infineon.

Infineon’s AIROC wireless products, including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combos, have shipped more than a billion devices, claimed the company.

AIROC Bluetooth products leverage a common software framework and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver differentiated products to market on time and on budget.

The AIROC CYW20820 will be shown at Embedded World, Nuremberg, Germany, from 21 to 23 June 2022, in hall 4a, booth #138.

http://www.infineon.com/wireless

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STMicroelectronics’ new inertial modules enable AI training inside the sensor

Mon, Jun 20, 2022

STMicroelectronics has introduced ISM330ISN inertial sensors that contain an intelligent sensor processing unit (ISPU). The company said the power the onlife era: interacting with trained devices, with intelligence moving from “on” the edge to “in” the edge.

The ISM330ISN always-on, six-axis inertial measurement unit (IMU) for movement and position sensing uses its embedded intelligence to deliver unrivalled performance and accuracy for its size and power, claimed ST. Used in IoT and industrial applications, the IMU sets to accelerate response time and extend battery life in equipment such as condition monitors for predictive maintenance, as well as battery-operated asset trackers and industrial applications, such as robots.

The intelligence built into the ISM330ISN enables smart devices to perform advanced motion detection functions in the sensor without interaction with the external microcontroller (MCU), thus saving power at system level. ST’s approach integrates a specialised processor, the ISPU, in a small area directly on the sensor chip, optimised for machine learning applications. This enables the ISM330ISN module to have a 50 per cent smaller footprint and consume 50 per cent less power than a typical co-packaged MCU, claimed the company.

Developers can programme the ISPU using ST’s NanoEdge AI Studio. This tool is used to deploy AI applications on STM32 microcontrollers. The technology is now available for programming the ISPU, enabling users to easily generate automatically optimised machine learning libraries. Designing an anomaly detection library with AI learning capability directly inside the ISPU is possible with minimal data and just a few clicks, claimed the company, and with no specific data science skills needed.

“Intelligence formerly implemented at the network edge, in an application processor, is now moving to the deep edge, inside the sensor,” said Simone Ferri, general manager of marketing, Analogue MEMS and Sensors Group, STMicroelectronics. “Our ISM330ISN IMU heralds a new category of smart sensors, leveraging embedded AI to handle complex operations such as pattern recognition and anomaly detection with greatly increased efficiency and performance.”

The ISM330ISN has the same 3.0 x 2.5 x 0.83mm package outline as conventional inertial modules. Designers can therefore upgrade products quickly and cost-effectively with no obligation to change an established circuit board layout.

The ISM330ISN is covered by ST’s 10-year longevity programme, which provides long-term availability assurance for product designers and manufacturers.

The ISM330ISN is part of ST’s iNEMO family of IMUs. It contains a three-axis accelerometer and three-axis gyroscope with low-noise sensing performance, and an output data rate (ODR) of 6.6kHz. With the ISPU, the sensor ensures consistently high accuracy while consuming only 0.59mA in combination mode with the accelerometer and gyroscope active.

ST’s ISPU architecture, based on digital signal processing (DSP), is compact and power-efficient, with 40kbytes of RAM, and occupies just 8,000 gates on the sensor die. Performing floating-point operations with single-bit precision, ISPU is suitable for machine learning applications and binary neural networks, claimed the company.

The ISM330ISN is scheduled to enter production in the second half of 2022 and will be available from st.com or distributors. NanoEdge AI Studio enabling the creation of libraries designed for specific ISPU part numbers is available at no charge on ST.com.

ST’s ISPU and the NanoEdge.AI tools have been shortlisted for the Embedded Award at Embedded World 2022, in the Hardware and Software categories respectively (in Nuremberg, Germany, 21-23 June). ST will be exhibiting in Hall 4A-148.

https://www.st.com

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Rohde & Schwarz extends ZNB VNA family for mmWave and Ka band uses

Mon, Jun 20, 2022

Rohde & Schwarz has added new models and options to the R&S ZNB vector network analyser family, addressing applications in the mmWave range such as 5G at FR2 frequencies and applications in aerospace and defence in the Ka band. The R&S ZNB26 provides network analysis up to 26.5GHz, and R&S ZNB43 extends the upper frequency of the mid range vector network analyser (VNA) family to 43.5GHz.

The R&S ZNB43 is used for development and production network analysis. –

The R&S ZNB43 is available as two-port or four-port models, with two connector types, either 2.4mm or 2.92mm. It also offers an extended power range and a second internal source. The R&S ZNB43 is suitable for characterisation of passive devices such as filters, couplers and switches. When equipped with the second internal source, it becomes a versatile instrument for measurements of active devices such as mixers and amplifiers.

Higher frequencies, faster clock rates, and more precise specifications all demand more accurate device characterisation. In particular for the higher microwave frequencies, de-embedding the test fixture from the device under test is increasingly important. While simple in principle, de-embedding is much more complicated in practice, as the S-parameters for the fixture cannot easily be measured. Only in the past few years have practical de-embedding solutions come to the market.

A range of industry-wide software tools for de-embedding in line with IEEE 370 is now available as integrated options.

With any network analyser, no matter how well a test set up has been calibrated, there will still be a residual measurement uncertainty that will vary according to settings, such as the power level for the current test. Knowing the actual uncertainty under given test conditions is crucial.

The R&S ZNB allows users to keep track of measurement uncertainty in real-time, with integrated software options.

The R&S ZNB family also supports inline calibration units that remain connected to the device under test throughout the test period. Inline calibration is essential for tests in a thermal chamber, for example, on satellites or satellite components, or in multiport setups with large numbers of ports, where instead of a time-consuming reconnection of DUT (device under test) cables, recalibration is reduced to just pressing a button, said Rohde & Schwarz.

Rohde & Schwarz is launching the ZNB43 at the IMS2022 (International Microwave Symposium), Denver, Colorado, USA (19 to 24 June), on booth 7056.

https://www.rohde-schwarz.com

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Four-channel beamformers advance 5G mmWave precision, says NXP

Fri, Jun 17, 2022

Two four-channel, dual-polarised analogue beamformers, the MMW9012K and MMW9014K enable advanced precision in beam steering for 5G mmWave, improving system reliability, said NXP.

The analogue beamformers have been developed using NXP’s silicon germanium (SiGe) process. They support dual-polarisation to improve 5G reliability and offer a high degree of integration to help reduce 5G base station size and costs, said the company. They also reduce current consumption for 5G mmWave designs.

5G mmWave solutions are typically deployed in dense urban areas, where the higher frequency and bandwidth are well-suited to meet consumers’ needs for higher bit rates. However, the higher frequency also decreases the distance an mmWave signal can cover, as does the interference of buildings and other obstacles. The dual-polarised, four-channel analogue beamformers enable more precise steering of simultaneous beams to users, explained NXP, mitigating the propagation loss common to 5G mmWave deployments and improving overall system reliability.

The MMW9012K operates at 28GHz, while the MMW9014K operates at 26GHz. Both devices offer a high transmit and receive gain with EVM (error vector magnitude) at 2.5 per cent at Pout of 9dBm.

Doeco Terpstra, vice president and general manager, Smart Antenna Solutions, NXP, said: “Reliability is more important than ever, and OEMS need the ability to precisely direct simultaneous beams to the different users that require the low latency and high bandwidth that 5G mmWave offers. At the same time, utilising a dual-polarisation on a single antenna panel enables a higher degree of integration for 5G mmWave panels, reducing system size and cost for OEMs.”

NXP also announced an antenna system developer kit to complement the beamformers. It features an 8×8 antenna panel, with a control board with GUI (graphic user interface) and power supplies. According to NXP, the antenna developer system makes it easy for OEMs to accelerate their panel designs to more quickly build 5G antenna systems.

The MMW9012K and MMW9014K four-channel, dual polarised analogue beamformers are in volume production.

http://www.nxp.com

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Infineon adds the AIROC CYW20820 system on chip for flexibility, low power and high-performance connectivity

STMicroelectronics’ new inertial modules enable AI training inside the sensor

Rohde & Schwarz extends ZNB VNA family for mmWave and Ka band uses

Four-channel beamformers advance 5G mmWave precision, says NXP

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