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Sensor tracks motion and orientation for IoT and metaverse

Fri, Jun 10, 2022

Sensor fusion for motion tracking, heading and orientation detection is provided by the FSP201 low power sensor hub microcontroller released by Ceva. It is designed for use in consumer robotics and smart devices which use motion tracking and orientation such as 3D audio headsets or XR (extended reality, or augmented, virtual and mixed reality) glasses. They can also be used in six-axis motion use cases across the IoT and the metaverse.

The FSP201 is based on Ceva’s proprietary MotionEngine sensor processing software and a low-power 32bit Arm Cortex M23 microcontroller. Manufacturers can choose from a pre-qualified list of external six-axis IMU (inertial measurement units) sensors (i.e. accelerometer plus gyroscope). These are from different sensor suppliers, thereby ensuring supply chain flexibility. The sensor options can be used to provide correction smoothing actions and auto-centring for example. The former corrects orientation drift slowly and transparently allowing head and body tracking by the user for an immersive XR or 3D audio experience, the latter dynamically recentres the soundstage in 3D audio applications based on a user’s gaze to maintain immersion in dynamic conditions and eliminate drift. Other options are sensors with tilt independent heading, which allows for proper heading output even when a robot’s driving surface is uneven, enabling rapid adjustment to obstacles or changes in flooring types and ones with inclination detection to provide three degrees of freedom robot orientation to detect surface issues that could cause the robot to become stuck or damaged.

Proprietary algorithms are able to monitor changes in sensor performance and temperature during live operation for dynamic calibration. Several low-cost MEMS sensors from leading suppliers are pre-qualified and have drivers pre-integrated to accelerate development and ensure supply chain flexibility, added Ceva.

The FSP201 is designed to be versatile, using I2C and UART interfaces for chip connectivity and can be placed directly on the target product’s main circuit board or designed into a separate module. It is also code-compatible with the BNO08X series of nine-axis sensor system in package (SiP) products.

The FSP201 and evaluation tools are available for immediate sampling via designated distributors.

https://www.ceva-dsp.com

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3D magnetic field sensor IC measures axes or temperature

Fri, Jun 10, 2022

Users of the MLX90397 can choose which fields to measure whether X, Y or Z axis, temperature or a combination of these. The 3D magnetometer from Melexis features a wide supply voltage (1.7 to 3.6V) and is a cost-efficient choice, suited to battery powered appliances for both consumer and industrial applications, said the company.

The adaptive BZ field range of up to 200mT simplifies designing with a back bias magnet (e.g. joystick) said Melexis, because it removes the constraint on the saturation.

The 16-bit, three-axis sensor has a magnetic field range reaching 50mT (with an adaptive range on the Z-axis of up to 200mT). The sensing element relies on Triaxis 3D Hall effect technology. Captured data is converted into a digital form and then transferred over an I2C interface.

The combination of a low 7nA power down current and a wide voltage supply range provides flexibility regarding the selection of the battery type as well as ensures extended usage, said Melexis.

The MLX90397 is designed to address 1.8, 2.2 or 3.3V applications. It has a typical RMS noise of 2.0 microT for a 50mT range.

The design also includes a Vdd I/O pin. This allows the customer to set the output at a different voltage level than the main supply and avoids the need to place extra level shifters to interface with the microcontroller.

The MLX90397 is supplied in a compact surface-mount eight-pin UTDFN package, measuring 2.0 x 2.5mm and a height of only 0.4mm. Operating temperature range is -40 to +105 degrees C.

Potential applications are gaming consoles, computer peripherals, home automation systems (window/door opening detection), energy metering (for anti-tampering purposes), controls for domestic appliances and handheld power tools.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components, specialising in automotive semiconductor sensors. Its portfolio of sensors and driver ICs are used in additionally used in smart appliances, home automation, industrial and medical applications. Melexis sensing product range includes magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight. The company’s driver IC portfolio incorporates DC and BLDC motor controllers, LED drivers and FET pre-driver ICs.

The company is headquartered in Belgium.

http://www.melexis.com

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Integrated devices from onsemi support KNX and PoE for building automation

Thu, Jun 09, 2022

Supporting the KNX and the PoE building automation protocols respectively, the NCN5140S and NCL31010 are integrated devices released by onsemi to shorten the development of smart building control panels and connected lighting.

For the development of access and control panels, the NCN5140S is the first system in package (SiP) certified with the KNX Association. The NCN5140S integrates all critical and certifiable elements of a KNX device, including a digital KNX transceiver, a 32-bit Arm Cortex-M0+ microcontroller with a pre-certified software stack, and system power DC/DC converters, into a single package. The level of integration reduces material costs, said onsemi, and allows manufacturers to develop very slim and modern designs of less than 5mm total depth.

The second introduction address PoE for Ethernet-powered connected lighting. The NCL31010 integrates an intelligent LED driver and PoE interface into a single package to support for both the lighting and power delivery needs of fully connected and managed lighting systems.

The pre-certified KNX SiP and intelligent LED driver can provide manufacturers with the latest technology and a headstart to develop complex, full-scale automation systems in a shorter time, said the company.

KNX products must demonstrate compliance to supported protocols and profiles through the association’s certification program to ensure seamless connectivity. The NCN5140S platform is pre-certified, so device KNX certification testing is not necessary. All that is needed is a KNX declaration of product modification, confirmed onsemi, eliminating the time and engineering efforts of a complete certification process.

The IEEE 802.3bt compliant NCL31010 can deliver over 90W via PoE. It integrates a Visible Light Communication buck LED driver. This involves modulating data directly onto the LED light, which remains imperceptible to the human eye, allowing it to broadcast data and function as a location beacon for use in indoor positioning systems.

The NCL31010 and the NCN5140S are available now through onsemi sales support and authorised distributors.

http://www.onsemi.com

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Arm has released the Mali-C55, and said that it is its smallest and most configurable image signal processor to date.

Thu, Jun 09, 2022

Image signal processors (ISPs) are used in IoT vision systems such as commercial, industrial or domestic cameras and drones.

The ISP has multi-camera capability for up to eight separate inputs, support for image resolutions up to 8K and a maximum image size up to 48Mpixels. According to Arm, the Mali-C55 offers the most efficient combination of image quality, throughput, power consumption and silicon area.

Image quality has been enhanced, compared to earlier generations, including the Mali-C52, with improved tone mapping and spatial noise reduction, enhanced support for high dynamic range (HDR) sensors and seamless integration with machine learning accelerators for access neural networks for various de-noising techniques. Being able to send the output from the ISP directly to the ML accelerator reduces cost and processing time by having less data sent from device to cloud, explained Arm. This is achieved without having to compromise on inferencing, said the company.

In addition to multi-camera support and integration with ML accelerators, the Mali-C55 also includes industry standard AXI and AHB interfaces for easy integration with either Cortex-A or Cortex-M based SoCs.

By combining multiple Mali-C55 ISPs, larger image sizes can be achieved for applications that require greater than 48 MP capabilities, such as video conferencing.

The Mali-C55 occupies half the silicon area size of previous generations, significantly lower power consumption to extend battery life, said Arm. It also contributes to a reduction in the cost of devices, said the company.

The Mali-C55 works under a wide range of different lighting and weather conditions, reported Arm. Its performance and power budget mean it is suitable for power- constrained applications, such as smart camera and edge AI vision applications in surveillance and security as well as smart buildings. For example, said Arm, cameras will be able to detect more critical details, such as recognising precise information on car number plates as the vehicle is travelling at up to 75mph. They can also be used to capture higher resolution images inside and outside of buildings in security systems and in smart home hubs they can efficiently include advanced features like secure visual unlock.

There is also a software package for controlling the ISP, as well as tuning and calibration tools.

http://www.arm.com

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Sensor tracks motion and orientation for IoT and metaverse

3D magnetic field sensor IC measures axes or temperature

Integrated devices from onsemi support KNX and PoE for building automation

Arm has released the Mali-C55, and said that it is its smallest and most configurable image signal processor to date.

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