Digi connect sensor XRT-M for IoT, industrial, sensor, and gateway applications

Mouser is now shipping the new Digi Connect Sensor XRT-M from Digi International. The Digi Connect Sensor XRT-M is a rugged, battery-powered LTE-M-enabled cellular gateway designed for zero-infrastructure remote monitoring in the toughest IoT environments in utilities, agriculture, environmental compliance, mining, and industrial applications.

The Digi Connect Sensor XRT-M, offers users both edge and cloud-based control options, together with a management platform equipped with an intuitive interface, for streamlining data management and enhancing operational efficiency. With intelligent edge processing powered by battery or solar, it gives reliable insights utilising Digi Axess to deliver the flexibility of the cloud, while seamlessly adjusting to supply consistent and reliable readings to enrich operational efficiency for field sensors in water and wastewater management, oil and gas operations, industrial automation, and environmental monitoring. The Digi Connect Sensor XRT-M is created for telemetry monitoring, while Digi Axess reveals actionable insights from remote assets.

Featuring support for the industry-standard MQTT protocol, setup is quick and intuitive, with deployment and data reception taking under 10 minutes. The web-based system ensures a fast and efficient setup process with streamlined configuration, extensive data analytics, and the ability to customise reports and alerts for specific conditions. The Digi Connect Sensor XRT-M is Digi’s most powerful remote telemetry device yet — offering flexibility in sensor integration, reliable cloud-connected data delivery via Digi Axess, and robust, IP68-rated protection.

mouser.com

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Renesas’s new GaN charging solution delivers 500W of power

Renesas has expanded its suite of AC/DC and power adapter solutions with a new GaN-based Half-Wave LLC (HWLLC) platform that supports 500W or higher operation across IoT, industrial and infrastructure systems. The new HWLLC converter topology scales an ultra-efficient, compact power architecture from 100W-class designs to 500W, enabling the next wave of high-speed chargers for power tools, e-bikes and other appliances without the size, heat and efficiency penalties of legacy topologies.

The portfolio expansion adds four controller ICs that build on Renesas’ proprietary zero-standby power (ZSP) technology. At the heart is the RRW11011, an interleaved power factor correction (PFC) and HWLLC combo controller engineered for high power density and high efficiency. The PFC with phase-shift control cancels ripple, reduces component size and cost, balances current and ensures robustness. The combo controller allows designers to lower operating temperature while delivering the wide output range (5V to 48V) required by USB Extended Power Range (EPR) and other variable-load charging systems. The new solution also features the RRW30120 USB Power Delivery (USB PD) protocol and closed-loop controller, which achieves maximum USB power delivery of 240W, and the RRW40120 half-bridge GaN gate driver and RRW43110 intelligent synchronous rectifier controller.

The HWLLC’s wide 500W power envelope broadens the addressable charging market to encompass large TVs and monitors, as well as higher-power appliances like vacuums, power tools, outdoor and industrial lighting and some medical devices. The new HWLLC-based AC/DC topology also helps designers move beyond 100W USB-C charging devices and adopt 240W USB EPR charging to shrink proprietary brick chargers in smartphones, laptops and many gaming systems. Renesas’ compact, high-power fast charging technology was recently incorporated into a GaN-based charger from Belkin. The Belkin Z-Charger features an innovative ZSP chip with Renesas’ advanced SuperGaN depletion mode (d-mode) GaN technology.

GaN technology drives the efficiency and power density behind Renesas’ next-generation AC/DC designs, enabling higher switching performance that helps shrink magnetics, reduce losses and keep thermals in check. Renesas’ SuperGaN d-mode technology employs a cascode configuration that is more robust and easier to drive than other GaN implementations, with a higher threshold voltage and drop-in compatibility with standard silicon gate drivers. The result is a faster path for customers to achieve compact, high-efficiency power supplies they can scale, validate and manufacture with greater confidence.

By eliminating transformer winding and reducing component count versus traditional LLC implementations, Renesas reduces design complexity and enables more compact magnetics. The enhancement accelerates design re-use across product families that support different wattages, voltages and form-factors while improving reliability and easing BOM management. The highly integrated, wide Vin/Vout offline solution helps customers build smaller, cooler and readily compliant products while achieving standout no-load/standby performance that supports higher energy-efficiency ratings.

renesas.com

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u-blox brings secure tri-band Wi-Fi 6E for industrial IoT

u-blox has announced the launch of the JODY-W6, the latest addition to its JODY family of modules. Based on the NXP Semiconductors IW623 chipset, the JODY-W6 combines tri-band Wi-Fi 6E (2.4 / 5 / 6 GHz) with 2×2 MIMO and Bluetooth Dual-Mode including LE Audio and qualified against Bluetooth Core 5.4. This powerful integration delivers higher throughput, better network availability, and an improved audio experience while addressing the industry’s growing need for secure, professional-grade wireless connectivity in industrial and IoT applications. The introduction of Wi-Fi 6E and Bluetooth LE Audio comes at a critical time, as industries face increasing spectrum congestion, demand for richer user experiences, and the need to comply with emerging cybersecurity regulations.

JODY-W6 is built on the NXP IW623 chipset and supports tri-band Wi-Fi 6E with 2×2 MIMO: Featuring Bluetooth Dual-Mode including LE Audio, JODY-W6 is qualified against Bluetooth Core 5.4. With a compact footprint and pin compatibility with the JODY module family, the new host-based multiradio module facilitates seamless migration across technology generations, offering simplicity, flexibility and cost savings in design. JODY-W6 provides a professional-grade solution designed to withstand harsh operating environments (-40 °C to +85 °C) while bringing enhanced security features, including NXP EdgeLock and secure boot on chip, to address growing cybersecurity requirements across industrial IoT deployments.

The JODY-W6 is well suited for industrial automation, healthcare, network infrastructure, and smart building applications, as well as security and surveillance systems that demand secure, high-throughput, and low-latency wireless performance.

Supporting SDIO or PCIe interfaces, the JODY-W6 offers flexibility for a wide range of host-based designs. The module is available in variants with two or three antenna pins, making it adaptable to diverse product requirements. Evaluation kits, including EVK-JODY-W683 and an M.2 form factor option, simplify design, testing, and integration.

By integrating the latest NXP IW623 chipset and supporting Wi-Fi 6E and Bluetooth LE Audio, the JODY-W6 addresses critical industry challenges such as spectrum congestion, cybersecurity compliance, and demand for high-performance wireless solutions.

u-blox.com

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NXP unveils Gen-3 radar transceiver for autonomous driving systems

NXP Semiconductors has announced its third-generation RFCMOS automotive radar transceiver TEF8388, a highly integrated 8-transmit/8-receive (8T8R) device designed to unlock the full potential of imaging radar for L2+ to L4 ADAS and automated driving systems. In the era of software‑defined vehicles, advanced perception systems have become key enablers, with high‑resolution radar sensing as a foundational technology. Radar sensors must deliver higher resolution, enhanced dynamic range and longer detection range while remaining feasible for large volume production.

This new transceiver is a key building block in NXP’s comprehensive, scalable portfolio of radar sensing solutions, addressing the industry’s growing need for robust perception in increasingly complex driving environments. When combined with NXP’s radar processing solutions, such as the S32R4 radar processor series, it forms a scalable imaging radar solution designed to meet the diverse performance, cost and regulatory requirements of global markets.

As the automotive industry pushes for more advanced radar performance, the challenge is no longer purely technical – it is a system level challenge. Higher channel counts historically increased power consumption, cost and integration effort while slowing down adoption. NXP’s latest radar transceiver TEF8388 breaks this trade-off by combining excellent RF performance with strong power efficiency and system cost optimisation, making high-performance imaging radar a practical and sustainable choice for next generation ADAS programs.

The new radar transceiver integrates eight transmit and eight receive channels on a single monolithic RFCMOS die, delivering RF performance while maintaining power consumption comparable to today’s much less integrated 3-transmit/4-receive devices. Its engineered architecture, optimised pin assignment and strategic launcher placement help improve channel isolation and signal quality, while simultaneously reducing overall system bill of materials. These design choices allow OEMs and tier 1 suppliers to build higher resolution radar sensors while cutting the amount of costly power and thermal management components needed.

www.nxp.com

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