SoM based on NXP S32G has more processing power for functional safety 

Support for NXP Semiconductor‘s S32G3 vehicle network processor in the miriac MPX-S32G399A system on module (SoM) enables real time data processing power for mixed-critical safety applications. The miriac MPX-S32G399A SoM by MicroSys exceeds its NXP S32G2-based predecessor with 2.5 times more applications processing performance. 

There are also eight Arm Cortex-A53 cores instead of four and four Arm Cortex-M7 dual-core lockstep pairs instead of three. OEMs using this miriac SoM benefit from more processor bandwidth for safety-critical applications but also from the SoM’s inherent instant access to prototyping and extended connectivity as well as comprehensive software support and safety documentations mandatory for certifications, said MicroSys. 

The miriac MPX-S32G399A SoM offers multiple native CAN interfaces, as well as comprehensive FlexRay, LIN and Ethernet support including time sensitive networking. Target markets are real-time connected vehicles, mobile machinery and automotive test and measurement equipment. MicroSys said they can also be used for data loggers, edge gateways and fail-safe programmable logic controllers (PLCs).

The NXP S32G vehicle network processor is targeted for ASIL D safety applications in OEM and Tier-1 automotive applications. MicroSys Electronics extends its application areas to SIL certifications for any market where functional safety standards analogue to IEC 61508 are required, including railway technology (EN 50155), aviation (DO-160), stationary and mobile machinery (ISO 13849), as well as manufacturing robots (ISO 10218), control systems (IEC 62061), and drive systems (IEC 61800‑5‑2). Approvals in the aviation context (DO-254/DO-160) can be supported with manufacturer documentation.

The eight Arm Cortex-A53 cores with Arm Neon technology are organised in two clusters for applications and services. For real-time tasks, the S32G3 has also four dual core lockstep Arm Cortex-M7 pairs for which MicroSys offers support for dedicated FreeRTOS implementations beside NXP’s standard automotive support. Clustered and operated in lockstep mode, the set of heterogenous cores of the S32G3 can support ASIL-D applications or any other functional safety standard comparable to IEC 61508. 

The SoM also integrates 4Gbyte of soldered LPDDR4 RAM at 3200 Mtransfers per seocnd, up to 32Gbyte eMMC non-volatile memory and 64Mbyte QuadSPI flash. External SD card storage can be multiplexed with the on-board eMMC. 

There are generic and communication interfaces including four SerDes interfaces configurable as PCIe Gen3 2×1 or 2×2, three 2.5 Gigabit Ethernet plus three Gigabit Ethernet, 18x CAN FD bus, two FlexRay and four LIN. There are also 14 general purpose I/Os, 12 analogue inputs (ADC), four FlexSPI, two UART, one USB and four I2C interfaces.

For trace and debug tasks, the SoM supports Aurora and JTAG interfaces. MicroSys also offers a board support package including bootloader configuration and all required Linux drivers.

The miriac MPX-S32G399A SoM is scheduled to become available for approved OEM evaluation including the carrier board, cable set and cooling solution during 2022. Larger lots in series production quality are scheduled to become available in Q1 2023.

https://www.microsys.de/en

> Read More

AI / ML-based acoustic event detection and sensor fusion alarm is battery powered

Infineon Technologies has introduced the battery-powered Smart Alarm System (SAS). It uses sensor fusion based on artificial intelligence / machine learning (AI / ML), combined with low power wake-on acoustic event detection.

The compact design is claimed to exceed the detection accuracy of acoustic-only alarm systems used today in smart buildings and homes, and other IoT applications and equal or exceed the battery life of less sophisticated systems.

The design incorporates Infineon’s high signal to noise ratio (SNR) analogue Xensiv MEMS microphone IM73A135V01, the Xensiv digital pressure sensor DPS310 and PSoC 62 microcontroller. There is also a sensor fusion software algorithm based on AI / ML that combines acoustic and pressure sensor data to differentiate between sharp sounds inside a home and distinctive audio / pressure events, such as breaking glass, a smoke alarm or a carbon monoxide alarm.

The AI / ML sensor fusion algorithm is also capable of eliminating other background sounds or background pressure events that can generate false positives due to the similarities to alarm systems, noted Infineon.

The home security alarm SAS reference design technology is available today, and the board will be available in September 2022. 

http://www.infineon.com

> Read More

Ryzen Embedded R2000 has 2x cores for IoT, says AMD

Equipped with up to two times as many cores as the previous generation of Ryzen Embedded SoC processors, the Ryzen Embedded R2000 series targets industrial and robotics systems, machine vision, the IoT and thin client equipment, said AMD.

The R2514, for example has up to 81 per cent higher CPU and graphics performance than the comparable R1000 series processor, confirmed AMD. Performance-per-watt efficiency is also optimised using Zen+ core architecture with AMD Radeon graphics for multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in 4K resolution.

Embedded R2000 Series processors are scalable up to four Zen+ CPU cores with eight threads, 2Mbyte of L2 cache and 4Mbyte of shared L3 cache, allowing embedded system designers can scale performance and power efficiencies with a single processing platform, said the company. The Ryzen Embedded R2000 also supports up to 3200Mtransfer per second DDR4 dual channel memory and expanded I/O connectivity, to deliver 33 per cent higher memory bandwidth and up to two times greater I/O connectivity compared to R1000 series processors. 

The series is suitable for industrial applications like robotics and machine vision as well as thin clients and mini-PCs, which require performance, optimised power and graphics, commented the company. 

They can power up to four independent displays in 4K resolution leveraging DisplayPort 1.4, HDMI 2.0b or eDP 1.3 interfaces. They also feature peripherals and interfaces with up to 16 lanes of PCIe Gen3, two SATA 3.0 and six USB ports (USB 3.2 Gen2 and 2.0).

OS support includes Microsoft Windows 11/10, and Linux Ubuntu LTS.

 The series consists of the R2324 and R2312 SoC processors which are in production now and the R2544 andR2541 which are expected to be available in October 2022. Planned product availability extends up to 10 years, providing customers with a long-lifecycle support roadmap

http://www.amd.com 

> Read More

3D magnetic resolver IC is smallest available, claims Melexis

For industrial and automotive applications, the MLX90381 AEC-Q100 / ISO 26262 -compliant pico-resolver is supplied in a DFN-6 package, measuring just 2.0 x 2.5mm. Only three external capacitors are required to complete the circuit.

The ASIL-ready IC is programmable at module level and enables sensored mechatronic miniaturisation, particularly in rotor position detection, said the company. Being AEC-Q100 and ISO 26262 compliant (ASIL B SEooC), also makes it suitable for automotive safety related systems.

The 3D magnetic pico-resolver has a small outline and analogue outputs providing sine and cosine signals. It uses Melexis’ Triaxis Hall technology and can be used for absolute rotary position sensing where its low latency and fast response characteristics are able to measure rotational speeds of more than 50,000 rpm.

The MLX90381 pico-resolver can be used with DC, brushless DC (BLDC) and permanent magnet synchronous motors (PMSM) in applications such as e-valves and e-bike motors. 

The MLX90381 can be combined with Melexis’ family of smart embedded LIN drivers. These include the MLX81330 and MLX81332 (up to 10W) for directly driving flaps, valves and single-coil fans and pumps. It also works with the MLX81340, MLX81344 and MLX81346 pre-drivers (up to 2000W) which are incorporated into power blowers, engine cooling fans, pumps, window lifters, seat adjusters and sunroofs.

The selectable magnetic field axes (X/Y, X/Z and Z/Y) enable the MLX90381 to handle on-axis position sensing as well as off-axis through-shaft sensing. The sensitivity and filter bandwidth of each axis can be programmed directly through the device’s I2C interface. A dedicated high sensitivity version of the pico-resolver allows additional robustness against external magnetic stray fields.

The MLX90381 is available for order now.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components addressing the integration of sensing, driving and communication into products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis specialises in automotive semiconductor sensors. Today, on average, every new car produced worldwide contains 13 Melexis chips, according to the company. The portfolio includes magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight (ToF). The company’s driver IC portfolio incorporates advanced DC and BLDC motor controllers, LED drivers and FET pre-driver ICs.

Melexis is headquartered in Belgium.

http://www.melexis.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration