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Dev kit evaluates multi-connectivity indoor-outdoor tracking

Tue, Aug 09, 2022

To support engineers building proof of concept for asset tracking systems, STMicroelctronics offers the STEVAL-ASTRA1B multi-connectivity evaluation kit. It is battery powered, has a small form factor and includes firmware to simplify development targeted applications such as livestock monitoring, fleet management, and logistics.

The kit helps users evaluate ST’s short- and long-range STM32 wireless SoCs. The STM32WL55JC sub-GHz SoC is for long-range connectivity or low power wide area networks (LPWAN) and implements the LoRaWAN (long range WAN) protocol. It provides LoRa, (G)FSK, (G)MSK, and BPSK modulations.

The second wireless SoC is the STM32WB5MMG module for 2.4GHz Bluetooth Low Energy and Zigbee connectivity. Each SoC has an Arm Cortex-M4 core for application processing with a dedicated Cortex-M0+ to manage the radio.

The development kit also includes an ST25DV64K near field communication (NFC) contactless chip for secure pairing and communication and an STSAFE-A110 secure element for privacy and protection against hacking.

There is also a Teseo-LIV3F miniature GNSS module which provides outdoor positioning. Sensors from the company provide data for monitoring asset condition and environment. Sensors available include an STTS22H low voltage, low power temperature sensor with ±0.5 degrees C accuracy, HTS221 digital humidity and temperature sensor, the LPS22HH barometric pressure sensor, and LIS2DTW12 low power three-axis accelerometer. Also available is the LSM6DSO32X always-on inertial module, which contains a3D accelerometer and 3D gyroscope with machine-learning core.

The STEVAL-ASTRA1B has a smart power and battery management architecture that helps developers maximise application runtime, said ST. It also includes the ST1PS02 nano-quiescent synchronous step-down converter, STBC03 Li-ion battery charging controller, and TCPP01-M12 USB-C port-protection IC.

The ecosystem available for evaluating applications in development include software and tools from ST. The choice includes the FP-ATR-ASTRA1 STM32Cube software function pack with firmware libraries and typical application examples. There is also ST’s asset-tracking mobile app, available on Apple Store and Google Play. The DSH-Assetracking cloud dashboard is also available, free of charge to demonstrate an end-to-end proof of concept.

The STEVAL-ASTRA1B evaluation kit is available to order now through ST’s eStore.

http://www.st.com

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NFC tags meet authentication security measures, says Infineon

Mon, Aug 08, 2022

Near field communication (NFC) tags released by Infineon Technologies meet high security requirements for proving authenticity. The NFC4TCxxx tags can protect consumer products to ensure they are not counterfeit to safeguard brand identity and revenue. In products such as pharmaceutical and food, the company pointed out, counterfeit products can pose a serious threat to consumer health and safety.

The NFC4TCxxx tag includes an open standard security architecture using AES-128 cryptography. It is also equipped with inherent resistance to physical attacks such as differential power analysis (DPA) and differential fault analysis (DFA).

The secured NFC tags have a range of memory options, from 304 bytes to 4kbytes, enabling brands to store data and create customised applications.

The tags can be programmed with brand-specific landing pages that provide additional information about the product and also show the customer a list of similar products. They can also offer two-way communication between the consumer and the brand, direct users to exclusive offers and invitations to special events while helping brands to use customer analytics to optimise products and marketing.

Infineon has also introduced the NFC 2Go starter kit which demonstrates consumer product authentication enabled by Infineon’s secured NFC tags with an NFC smartphone. The kit includes NFC stickers, iOS and Android mobile apps, back end cloud authentication software, tag personalisation tools and a user guide.

The NFC4TCxx tags and the NFC 2Go starter kit for brand protection can be ordered now.

http://www.infineon.com

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Duagon’s SBC has up to eight cores to operate in rail systems

Mon, Aug 08, 2022

A 3U CompactPCI serial CPU board by Duagon features the 11th generation Intel Core and Intel Xeon W-11000E series processors / Tiger Lake-H CPUs. The G28 has up to eight cores and up to 64Gbyte RAM and is suitable for embedded computing for rail systems (onboard and trackside) as well as for the medical and critical automation industries.

Optional 10Gbit Ethernet interfaces allow for high data throughput and direct connection to the network backbone.

For a robust performance in harsh environments, DRAM (up to 64Gbyte DDR DRAM with error code correction or ECC) is soldered to the board, the components are underfilled and additionally coated to guarantee optimum shock and vibration resistance and durability against harsh environmental conditions. The CPU is scalable from 25 to 45W TDP (thermal dynamic performance) and four to eight cores allows operation in ambient temperatures of up to +85 degrees C with active cooling. According to Duagon, a single board can cover different environmental conditions and market applications.

In onboard rail applications, the G28 can be used as central maintenance and virtualisation platform and main computing unit for passenger Wi-Fi and internet access. As part of a rail wayside server system, the SBC can be used for condition monitoring and in medical applications, the G28 can be used in surgical robots. It can also be used in factory automation for motion control and robotics in industrial automation.

For system security, a Trusted Platform Module (TPM 2.0) is assembled. This provides the G28 support for remote device authentication, measured boot, and secure updates. There is also an independent board management controller (BMC) which monitors onboard voltages, current and temperature. It also performs dedicated tasks like external watchdog management, power supply control and reset handling.

The G28 features three RJ45 or two M12 Ethernet front connectors, one USB 3.2 Gen 2×1 connector and one USB-C connector for one USB 3.2 Gen 2×1 and one DisplayPort. Main backplane interfaces include four SATA (6Gbit), eight PCIe 3.0 root ports with lane configurations of one, four or eight, and two 1Gbit Ethernet ports.

The SBC is supported by Linux Yocto Project, Windows 10 IoT Enterprise 64-bit as well as real time operating systems (RTOS) that supports Intel’s multi-core architecture.

Duagon also offers long-term availability of the components for a minimum of 10 years. The G28 is backwards compatible to the predecessor products G25, G25A and G23.

The fully qualified G28 will be available from September 2022.

https://www.duagon.com/

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AMD and ECARX collaborate on immersive cockpit in-vehicle computing

Fri, Aug 05, 2022

AMD and mobility technology company, Ecarx, will work together on an in-vehicle computing platform for electric vehicles (EVs), expected to be in mass production in late 2023. The Ecarx digital cockpit in-vehicle platform will be offered with AMD Ryzen Embedded V2000 processors and AMD Radeon RX 6000 Series GPUs (graphic processor units) and Ecarx hardware and software.

The digital cockpit’s features will include driver information mode, heads-up display, rear seat entertainment, multiple-displays, multi-zone voice recognition, gaming and a 3D user experience.

Ecarx is AMD’s first strategic ecosystem partner in China for the digital cockpit.

“The global automotive industry is transforming towards an intelligent future at an unprecedented pace with demand for computing power and graphics capabilities rapidly increasing,” said Ziyu Shen, chairman and CEO of Ecarx. “With this collaboration, we will further enable OEMs and tier 1 suppliers to enhance their digital cockpit experiences as they seek to create greater consumer value through intelligent connected cars.”

“EV adoption is now a key underlying factor for growth in the automotive semiconductor market and the associated semiconductor demand is forecast to grow at a CAGR [compound annual growth rate] of 31 per cent over 2021 to 2026,” said Asif Anwar, executive director – PBCS and EVS, Strategy Analytics. He believes domain- and zonal-based architecture will drive adoption of the digital cockpit, ADAS (advanced driver assistance systems) and the connected vehicle.

The Ryzen Embedded V2000 Series processors are the second generation designed for automotive in-vehicle infotainment and instrumentation applications. They are also used in industrial edge, thin client and miniPC systems. The processors can power up to four independent displays simultaneously in 4K resolution; it is equipped with up to eight CPU cores and seven GPU compute units. A single AMD Ryzen Embedded V2000 Series processor provides up to two times the multi-threaded performance per Watt, up to 30 per cent better single-thread CPU performance and up to 40 per cent better graphics performance over the previous generation.

AMD Radeon RX 6000 Series GPUs are built upon the AMD RDNA 2 graphics architecture. This is, said AMD, the only graphics architecture that spans from next-generation desktop PCs, laptops and consoles to mobile devices and automotive infotainment systems. It offers up to two time higher performance) and up to 50 per cent more performance per Watt in select titles compared to the previous generation AMD RDNA architecture.

Ecarx’s current core products include infotainment head units (IHU), digital cockpits, vehicle chipsets, a core operating system and integrated software stack. It is also developing a full-stack automotive computing platform.

Its technology has been integrated into more than 3.2 million cars worldwide.

For more than 50 years, AMD has developed computing, graphics and visualisation technologies.

http://www.amd.com

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Dev kit evaluates multi-connectivity indoor-outdoor tracking

NFC tags meet authentication security measures, says Infineon

Duagon’s SBC has up to eight cores to operate in rail systems

AMD and ECARX collaborate on immersive cockpit in-vehicle computing

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