TDK expands i7A series with high-power, high-current DC-DC buck converters

TDK has announced a significant expansion of the TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new high-performance models that can deliver up to 1000 W of output power and support output currents of 60 A and 80 A, providing engineers with a very large increase of up to 82 % over existing models.

Maintaining the compact, 1/16th brick footprint, the new converters feature redundant input and output power pins to support higher current delivery. This enhanced pinout enables scalable power solutions ranging from 400 W to 1000 W, streamlining system design and integration. Despite their increased power, the converters weigh only 85 grams, due to an enhanced baseplate construction—making them suitable for weight-sensitive applications.

With a wide input voltage range of 18 V to 60 V and an adjustable output from 3.3 V to 28 V, the expanded i7A series offers exceptional flexibility to support a broad spectrum of DC input sources and system load voltages. This versatility helps reduce the number of unique part numbers in the bill of materials (BOM), simplifying inventory management. An adjustable output current limit reduces overcurrent and short-circuit levels, lowering device stress during overload conditions such as charging large capacitive loads. This feature also enables parallel operation of multiple i7A modules for redundancy or increased power capacity.

Delivering efficiencies up to 99 %, these converters reduce power loss and reduce energy consumption while enhancing thermal performance, system reliability, and overall power density, making them very well-suited for demanding industrial-grade applications.

The i7A series supports multiple cooling configurations, including open frame, baseplate, and heatsink options. This allows engineers to tailor thermal management to their system requirements, whether using conduction-cooled sealed enclosures, forced-air systems, or natural convection environments.

These new models complement the existing i7A converters, offering engineers a solution for demanding applications in medical, communications, industrial, test and measurement, robotics, drones, and battery-powered equipment. All models are certified to IEC/UL/CSA/EN 62368-1 and carry the CE and UKCA marks for Electrical Safety and RoHS Directives.

www.emea.lambda.tdk.com

> Read More

Analog Devices unveils CodeFusion Studio 2.0 to simplify embedded AI development

Analog Devices has launched CodeFusion Studio 2.0, an upgrade to its open source embedded development platform. Designed to simplify and accelerate the development of AI-enabled embedded systems, CodeFusion Studio 2.0 introduces advanced hardware abstraction, AI integration and powerful automation tools to streamline the journey from concept to deployment across ADI’s diverse processors and microcontrollers.

CodeFusion Studio 2.0 now supports complete AI workflows, enabling developers to bring their own models and deploy them efficiently across ADI’s processors and microcontrollers, from low-power edge devices to high-performance DSPs (digital signal processors). The latest platform, based on Microsoft’s Visual Studio Code, features a built-in model compatibility checker, performance profiling tools and optimisation capabilities that are designed to ensure robust deployment and an accelerated time-to-market.

A new Zephyr-based modular framework enables runtime performance profiling for AI/ML workloads, offering layer-by-layer analysis and seamless integration with ADI’s heterogeneous platforms. This encapsulation of toolchains simplifies machine learning deployment and enhances system-level performance insights.

The updated CodeFusion Studio System Planner now supports multi-core applications and expanded device compatibility, while unified configuration tools reduce complexity across ADI’s hardware ecosystem. Developers benefit from integrated debugging capabilities, including Core Dump Analysis and GDB (GNU debugger) support, making troubleshooting faster and more intuitive.

Availability
CodeFusion Studio 2.0 is now available for download. Developers can access the platform, documentation and community support at developer.analog.com

> Read More

ST launches three-in-one motion sensor for industrial IoT applications

ST has revealed the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge AI advancement. This smart IMU sensor uniquely combines simultaneous detection of low-g (±16g) and high-g (±256g) accelerations with a high performance and stable gyroscope within a single compact package, ensuring no critical event—from subtle motion or vibrations to severe shocks—is ever missed.

The ISM6HG256X addresses the growing demand for reliable, high-performance sensors in industrial IoT applications such as asset tracking, worker safety wearables, condition monitoring, robotics, factory automation, and black box event recording. By integrating accelerometer with dual full-scale ranges, it eliminates the need for multiple sensors, simplifying system design and reducing overall complexity. Its embedded edge processing and self-configurability support real-time event detection and context-adaptive sensing, which are essential for long lasting asset tracking sensor nodes, wearable safety devices, continuous industrial equipment monitoring, and automated factory systems.

Edge AI is a crucial driver for ST’s MEMS activity as it boosts performance and efficiency by enabling real-time data processing on the device, reducing latency and energy use. It enhances privacy and security through local data handling, limits reliance on external processing, and provides scalability and flexibility for various applications. Additionally, edge AI supports innovative uses like advanced sensing and IoT integration, aligning with growing demand for smart, connected devices.

The ISM6HG256X contains the unique machine-learning core (MLC) and finite state machine (FSM), together with adaptive self-configuration (ASC) and sensor fusion low power (SFLP). These features bring edge AI directly into the sensor to autonomously classify detected events, ensuring real-time, low-latency performance and ultra-low system power consumption. This embedded technology can reconstruct signal dynamics to provide high-fidelity motion tracking. Thanks to the embedded SFLP algorithm, also 3D orientation tracking is possible with just few µA of current consumption.

ST’s new X-NUCLEO-IKS5A1 industrial expansion board with MEMS Studio design environment and software libraries, X-CUBE-MEMS1, are available to assist developers, helping implement functions including high-g and low-g fusion, sensor fusion, context awareness, asset tracking, and calibration.

www.st.com

> Read More

Microchip unveils MCP server to power AI-driven product data access

Microchip has announced the launch of its Model Context Protocol (MCP) Server. An AI interface, the MCP Server connects directly with compatible AI tools and large language models (LLMs) to provide the context these systems need to answer questions. Through simple conversational queries, the MCP Server enables users to retrieve verified, up to date Microchip public data, including product specifications, datasheets, inventory, pricing and lead times.

Built on MCP streamable HTTP standards, the server delivers context-aware and JSON-encoded responses optimised for AI clients such as Copilots, AI chatbots, LLM-based IDEs and enterprise AI agents. The platform supports a wide range of applications and integrates Microchip public data directly into development environments and intelligent assistants.

“The launch of our MCP Server is another example of how Microchip is leaning into AI and providing AI-based tools that help make life easier for our customers,” said Rich Simoncic, chief operating officer for Microchip Technology. “We’re dedicated to harnessing the power of AI to boost productivity and drive innovation. By enabling instant access to verified product information within the AI platforms developers already rely on, we’re removing barriers and making it easier to design with Microchip solutions.”

By combining reliable technical and sourcing information, the MCP Server can enhance design productivity, streamline automation and empower engineers to develop faster and make more informed decisions.

microchip.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration