New direct Time-of-Flight sensor from ams OSRAM, sees the difference!

The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced or slightly varied objects. The new sensor from ams OSRAM can tell whether an espresso cup or a travel mug is placed under a coffee machine, ensuring the right amount is dispensed every time. This kind of precision is critical for a broad spectrum of applications: from logistics robots that distinguish between nearly identical packages, to camera systems that maintain focus on moving objects in dynamic video scenes.

With dToF technology, the sensor emits light pulses in the invisible infrared range. These pulses reflect from objects in the sensor’s field of view and return to the sensor, which calculates the distance based on the time it takes for the light to travel — similar to how the delay of an echo reveals distance: the longer it takes, the farther away the object. Multi-zone sensors enhance this by capturing reflected light from multiple viewing angles (zones), like a network of echo points. This enables the creation of detailed 3D depth maps.

The TMF8829 divides its field of view into up to 1,536 zones — a significant improvement over the 64 zones in standard 8×8 sensors. This higher resolution enables finer spatial detail. For example, it supports people counting and presence detection in smart lighting systems, object detection and collision avoidance in robotic applications, and intelligent occupancy monitoring in building automation. The detailed depth data also provides a foundation for machine learning models that interpret complex environments and enable intelligent interaction with surroundings.

Measuring just 5.7 × 2.9 × 1.5 mm— thinner than a cent coin and more compact than typical sensors with lower resolution — the TMF8829 delivers high resolution in a format ideal for space-constrained devices. Because it operates without a camera, it supports privacy-sensitive applications. When paired with a camera, the sensor enables hybrid vision systems like RGB Depth Fusion, combining depth and colour data for AR applications such as virtual object placement.

Classified as a Class 1 eye-safe device, the TMF8829 uses a dual VCSEL (Vertical Cavity Surface Emitting Laser) light source to measure distances up to 11 meters with 0.25 mm precision — sensitive enough to detect subtle movements like a finger swipe. With its 48×32 zones, the sensor covers an 80° field of view, delivering depth information across a scene comparable to that of a wide-angle lens. On-chip processing reduces latency and simplifies integration. Instead of relying on a single signal, the sensor builds a profile of returning light pulses to identify the most accurate distance point — ensuring stable performance even with smudged cover glass. Full histogram output supports AI systems in extracting hidden patterns or additional information from the raw signal.

https://ams-osram.com/

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Renesas introduces ultra-low-power MCUs for next-generation smart home appliances

Renesas has introduced the new 16-bit RL78/L23 microcontroller (MCU) group, expanding its low-power RL78 family. Running at 32MHz, the RL78/L23 MCUs combine industry-leading low-power performance with essential features such as dual-bank flash memory, segment LCD control, and capacitive touch functionality to support smart home appliances, consumer electronics, IoT and metering systems. These compact devices address the performance and power requirements of modern display-based human-machine interface (HMI) applications.

The RL78/L23 is optimised for ultra-low power consumption and ideal for battery-powered applications that spend the majority of time in standby. They offer an active current of just 109μA/MHz and a standby current as low as 0.365μA, along with a fast 1μs wake-up time to help minimise CPU activity. The LCD controller’s new reference mode, VL4, reduces LCD operating current by approximately 30 percent when compared to the existing RL78/L1X group. The MCUs come with SMS (SNOOZE Mode Sequencer), which enables dynamic LCD segment display without CPU intervention. By offloading tasks to the SMS, the devices minimise CPU wake-ups and contribute to system-level power savings.

The RL78/L23 offers a wide operating voltage range of 1.6V to 5.5V, which supports direct operation from 5V power supplies commonly used in home appliances and industrial systems. This capability reduces the need for external voltage regulators. The MCUs also integrate key components such as capacitive touch sensing, a temperature sensor, and internal oscillator, reducing BOM cost and PCB size.

Its built-in segment LCD controller and capacitive touch realize sleek, responsive user interfaces for products such as induction cooktops and HVAC systems. The IH timer (Timer KB40) enables precise multi-channel heat control, which is essential in smart kitchen appliances such as rice cookers and IH cooktops. The devices include dual-bank flash memory for seamless firmware updates via FOTA (Firmware Over-the-Air), allowing continuous system operation in applications like metering, where downtime must be minimised. The dual-bank architecture allows one memory bank to run the user program, while the other receives updates. This approach keeps the system functional throughout the process for improved reliability.

The RL78/L23 comes with an easy-to-use development environment. Developers can leverage support tools such as Smart Configurator and QE for Capacitive Touch to streamline system design. Renesas offers the RL78/L23 Fast Prototyping Board which is compatible with Arduino IDE, and a capacitive touch evaluation system for in-depth testing and validation.

https://renesas.com

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Latest Bluetooth module from Panasonic now in mass production and supporting Bluetooth 6.0

Now in mass production, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication.

All 32 pins available on nRF54L15 are routed out on to a hybrid packaging consisting of castellated edges and LGA in a hybrid layout such that a dedicated number of pins positioned at the edge lending for easy prototyping, with the rest of the GPIOs located at the bottom that allows leveraging the full potential of the wireless SoC platform.

The module benefits from very small dimensions of only 10.35 mm × 9.8 mm × 1.9 mm. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.

Based on nRF54L15, the module is shipped with an open embedded application processor based on ARM Cortex-M33 processor clocking up to 128 MHz for high performance embedded applications with a 256 kB RAM. Furthermore, the module has a non-volatile memory of 1.5 MB as available on the SoC.

However, Panasonic adds further features above and beyond those available on the SoC. Pascal Maier, Head of IOT Devices at Panasonic Industry comments: “Our latest PAN B611-1 Bluetooth module is a versatile device that can support a variety of applications – from ultra-low power battery driven solution to very complex applications like Matter, as well as sophisticated algorithm-heavy features like Channel Sounding. This is why we offer different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4 MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”

An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms.

Furthermore, the PAN B611-1 is ideally suited for Matter applications, as dedicated variants exist with additional flash memory, and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. Apart from Matter, the highly versatile module also supports a variety of wireless protocols in the 2.4 GHz spectrum including Bluetooth LE, Bluetooth Mesh and IEEE 802.15.4 – enabling Zigbee and Thread as well as other third-party proprietary technologies, which make it effortless to develop products for smart home standards like Matter and Zigbee and even allow running multiple wireless protocols concurrently.

The PAN B611-1 Bluetooth module is available with an integrated chip antenna (-1C) or as bottom pad version (-1B) to cater to diverse project needs. It is certified for Europe (CE RED), UK (UKCA), USA (FCC), Canada (ISED), Japan (MIC).

https://industry.panasonic.eu

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Infineon introduces 75 mΩ industrial CoolSiC MOSFETs for medium-power applications

Infineon is expanding its CoolSiC MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems. The devices are available in multiple package options, including TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4. As a result, the product family supports both Top Side Cooling (TSC) and Bottom Side Cooling (BSC) approaches and offers developers a high degree of flexibility. The devices are ideal for high- and medium-power switching mode power supplies (SMPS) in different applications, including AI servers, renewable energy, electric vehicle and e-mobility chargers, humanoid robot chargers, televisions, and drives.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation. The different packages offer various advantages: TOLL and ThinTOLL 8×8 packages provide high thermal cycle stability on the PCB and enable compact system designs. When used in SMPS, they reduce the space requirements on the PCB and lower manufacturing costs at the system level. The list of target applications for TOLL and ThinTOLL 8×8 has been expanded, enabling PCB designers to address cost-reduction challenges. The addition of TOLT strengthens Infineon’s growing TSC product family, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos. The TSC variants allow up to 95 percent direct heat dissipation and enable designers to use both sides of the PCB, improving space utilisation and reducing parasitic effects.

https://www.infineon.com

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