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SiC based modules increase range, with faster charging for EVs

Thu, Sep 29, 2022

Automotive silicon-carbide (SiC) -based power modules, the AMP32 series, have been developed by onsemi for on-board chargers. The modules, claimed the company, enable faster charging and increased range for all types of electrical vehicles.

The three APM32 SiC-based power modules feature transfer moulded technology and are intended for use in on-board charging and high voltage (HV) DC/DC conversion in all types of electric vehicles (xEV). The modules are specifically designed for high-power 11 to 22kW on-board chargers.

Each module exhibits low conduction and switching losses, said onsemi, “best in class thermal resistance” and high voltage isolation to deal with 800V bus voltage. The enhanced efficiency and lower heat generation allow one OBC to charge the EV faster and increase its operating range, claimed the company.

The modules allow designers to meet charging efficiency and space goals, said onsemi. “By adopting the pre-configured modular format, designers are able to configure their designs faster, with significantly lower time to market and design risk,” said Fabio Necco, vice president and general manager, automotive power solutions at onsemi.

Each APM32 module is serialised for full traceability. The modules can operate with junction temperatures (Tj) up to 175°C, for reliable operation even in challenging, space-constrained automotive applications.

Two modules, the NVXK2TR40WXT and NVXK2TR80WDT, are configured in H-bridge topology with a breakdown (V(BR)DSS) capability of 1200V, ensuring suitability for high voltage battery stacks. They are designed to be used in the OBC and HV DC/DC conversion stages. The third module, the NVXK2KR80WDT, is configured in Vienna rectifier topology and used in the power factor correction (PFC) stage of the OBC.

All three modules are housed in a compact dual inline package (DIP), which is claimed to ensure low module resistance. The top cool and isolated features meet stringent automotive industry standards, the creepage and clearance distances meet IEC 60664-1 and IEC 60950-1. Additionally, the modules are qualified to AEC-Q101 and AQG 324.

The company also announced that it will introduce a six-pack and full-bridge modules.

http://www.onsemi.com

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Multi-pixel driver supports CAN FD Light for automotive lighting

Thu, Sep 29, 2022

Linear current regulators from STMicroelectronics provide dynamic automotive lighting control using the CAN FD Light protocol. The driver is intended for use with OLED lamps for bright, homogeneous and high contrast lighting from a small surface area.

The L99LDLH32 has 32 regulated current sources, independently programmable from 1.0 to 15mA. The regulator can drive individual pixels in external and interior lighting applications. Global dimming is also provided, with eight-bit resolution. The driver is powered at the vehicle battery voltage and produces outputs of up to 35V to cover a wide emitter forward voltage spread.

The integrated CAN FD Light protocol handler and transceiver simplify connection to the vehicle’s communication infrastructure and controlling domain ECU (electronic control unit). CAN FD Light’s synchronised commander / responder communication is engineered for controlling simple devices such as lights and sensors. According to ST, this saves costly external components such as timing crystals.

The data bandwidth of 1Mbit per second enables designers to create complex animated light patterns and permits smoothly modulated transitions and dimming.

On-chip memory cells allow programming of parameters, such as current level and PWM dimming for standalone operation, to provide a failsafe mode in the event of the communication bus or controller malfunction.

The L99LDLH32’s features for functional safety include a fault-status pin, voltage and temperature monitors, a programmable timeout watchdog, short-circuit and open-load detection. In addition, frequency dithering minimises electromagnetic emissions.

Consequently, target applications include safety critical lighting such as taillights, stoplights, and turn indicators.

The driver is monolithically integrated using ST’s BCD9sL process. It is AEC-Q100 qualified and packaged in a 7.0 x 7.0mm QFN48 device with wettable flanks and an exposed thermal pad to aid dissipation

http://www.st.com

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Adapter board allows machine learning based sensor fusion

Wed, Sep 28, 2022

The latest addition to Rutronik System Solutions’ board family is the RAB1 – Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) -based sensor fusion, which forms the basis and the future of artificial intelligence (AI).

It is equipped with sensors from Infineon, Bosch SE and Sensirion. (All sensors are also available in Rutronik’s product portfolio.)

It can be used as a development tool to shorten time to market for a range of applications of sensor fusion, such as air quality measurement or smoke and gas detectors.

Combining and linking different measured values from several sensors, or sensor fusion, is important to gain information, explained Rutronik. The RAB1 Sensorfusion board allows developers to test and select the most suitable components or combination of sensors for an application. The board features the DPS310 barometric air pressure sensor from Infineon, the BMI270 IMU and the BME688 intelligent gas sensor from Bosch Sensortec and the SGP40-D-R4 and the SHT41-AD1B-R2 temperature and humidity sensor from Sensirion. These components can be tested individually or in combination using the board. Rutronik System Solutions provides the software including various application examples. It also has an Arduino interface for use with all other boards, including the Rutronik Basis Board RDK2.

Rutronik Elektronische Bauelemente was founded in 1973 and is an independent family-owned company.

The broad product portfolio includes semiconductors, passive and electromechanical components as well as embedded boards, storage and displays, and wireless products. The company has product areas in the Rutronik Automotive, Rutronik Embedded, Rutronik Power and Rutornik Smart divisions with both specific products and services tailored to the respective applications.

Competent technical support for product development and design-in up to the research area, individual logistics and supply chain management as well as comprehensive services are available.

http://www.rutronik.com

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Automotive GbE switch with optical ports is an industry first, says KDPOF

Mon, Sep 26, 2022

The EVB9351-AUT-SW-NXP with five 1000BASE-RH optical ports is an industry first, claimed KDPOF. It comprises the company’s KD9351 FOT (fibre optic transceiver) and KD1053 PHY IC. The core of the high-speed switch platform is the NXP SJA1110 SoC, commented Guenter Sporer, director of marketing, systems and applications of automotive Ethernet solutions at NXP Semiconductors.

The SJA1110 is a four pin-compatible and software-compatible automotive Ethernet switch SoC. KDPOF’s evaluation board supports carmakers and suppliers in delivering high speed connectivity essential for autonomous vehicles.

The EVB9351-AUT-SW-NXP automotive Ethernet switch board has two SJA1110 switches from NXP. The SoC integrates an Arm Cortex-M7 at 200MHz processor for autonomous and secure operation. It has 512kbyte integrated SRAM as instruction tightly coupled memory (ITCM) and 256kbyte integrated SRAM as data tightly coupled memory (DTCM). It contains a double precision floating point unit and a memory protection unit. Boot time is less than 100ms with a 512kbyte firmware with authentication.

The switch has selectable I/O voltages (1.8, 2.5 and 3.3V) to aid in design flexibility. Its footprint is just 14 x 14mm (LFBGA256) and a package with 0.8mm pitch.

The switch is automotive AEC-Q100 qualified, compliant with ISO 26262 and ASIL-B. 2.5Gbits per second operation is supported for two SGMII ports. The board has five optical 1000/100BASE-RH ports, 12 100BASE-T1 ports, and one NXP SABRE expansion connector.

With the KD9351 optical interface, KDPOF complements the KD1053 digital interface IC, providing a full optical port for in-vehicle gigabit connectivity. The assembly of the FOT and the IC is simplified, explained KDPOF. The connector has snap-fit without soldering.

The devices form a complete automotive 1000BASE-RHC physical layer. KDPOF explained that constructing the trans-impedance amplifier, photodiode, LED driver and LED as one single device significantly lowers costs.

Optical Ethernet connectivity solves the challenges and electrical interference in vehicles thanks to its EMC, reliability and low cost. The optical Ethernet connectivity can be used in safe Ethernet backbones, smart antenna modules and sensor connections for ADAS (advanced driver assistance systems) and audio/video.

Fabless semiconductor supplier KDPOF provides high speed optical networking for harsh environments. KDPOF made Gbit communications overstep-index plastic optical fibre (SI-POF) a reality for automotive design.

Founded in 2010 in Madrid, Spain, KDPOF offers its technology as a fully qualified automotive-grade ASSP.

https://www.kdpof.com

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SiC based modules increase range, with faster charging for EVs

Multi-pixel driver supports CAN FD Light for automotive lighting

Adapter board allows machine learning based sensor fusion

Automotive GbE switch with optical ports is an industry first, says KDPOF

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