ADLINK expands COM lineup featuring NXP i.MX 95 applications processor family

ADLINK Technology has announced its latest NXP-based IMX95 modules powered by the NXP i.MX 95 Applications Processor family. Engineered to meet the demands of aerospace, automotive edge, commercial IoT, industrial, medical, and networking sectors, these modules deliver a blend of performance, security, and efficiency—supported by a guaranteed 15-year product lifecycle to ensure long-term availability and stability.

At the core of the IMX95 modules is the NXP i.MX95 Applications Processor, featuring up to six-core Arm Cortex-A55 alongside Cortex-M7 and Cortex-M33 cores, providing multicore processing and real-time control. The integrated Neutron Neural Processing Unit (NPU), supported by the eIQ framework, delivers up to 2 TOPS, enabling advanced AI inference, computer vision, and real-time data analytics directly at the edge—all within a low-power design optimised for sustained workloads.
Complementing this AI capability, the NXP i.MX 95 Applications Processor modules feature an Image Signal Processor (ISP), Video Processing Unit (VPU), and Arm Mali graphics G310 GPU to support immersive 3D graphics and high-quality vision applications. With flexible memory configurations supporting up to 8GB LPDDR4L RAM and up to 256GB eMMC storage, plus multiple graphic output interfaces including DSI and LVDS, these modules offer extensive adaptability to varied application needs. They also include other standards found in all NXP products, ensuring broad compatibility and easy integration.

Connectivity options include USB 2.0/3.0 ports and high-speed Ethernet interfaces with Precision Time Protocol (PTP), ensuring seamless integration into diverse industrial environments.

The ADLINK OSM-IMX95, compliant with SGeT OSM 1.2 Size-L (45 mm x 45 mm), is a module that delivers powerful processing and AI capabilities in a rugged, solderable form factor designed for extreme environments. I

Engineered for embedded edge deployments in space- and power-constrained devices, the OSM-IMX95 is available in ruggedised options that support industrial and commercial environments. It excels in smart city sensors, transportation systems, portable healthcare equipment, and compact robotics. Its soldered-down design reduces manual assembly requirements, making it ideal for high-volume production.

The ADLINK LEC-IMX95, compliant with SGeT SMARC 2.2 specifications and offered in the 82 mm x 50 mm form factor, delivers flexibility and performance for scalable edge and IoT applications.

With its optional 10GbE interface alongside the standard 2x GbE, secure boot, and real-time control, the LEC-IMX95 delivers deterministic performance across smart infrastructure, retail automation, and intelligent transport systems. With its long lifecycle support and industrial-grade reliability, it enables rapid prototyping and deployment of high-performance, production-ready solutions for evolving industrial and commercial environments.

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ST introduces new battery-saving wireless MCUs optimised for remote controls

STMicroelectronics has introduced the STM32WL3R, a wireless microcontroller (MCU) optimised for remote control units in consumer products and home automation. Evolved from the STM32WL3 sub-GHz wireless MCU, the STM32WL3R contains a low-power RF transceiver, flexible power-saving states, and six individual wake-up pins that facilitate creating energy-efficient remotes.

ST co-developed the STM32WL3R with France-based building-automation innovator Somfy group, which produces smart systems including wirelessly controlled electric roller shutters, garage openers and connected solutions for home and commercial applications. Engineers at Somfy labs worked with ST to design the new MCU for their next-generation RF remotes and sensors, resulting in a compact and cost-efficient unit that offers flexibility and extended battery life for a great user experience. “This single-chip wireless MCU, optimised for use in remote-control units, lets us continue setting the pace in systems for smarter, more comfortable, and environmentally friendly buildings,” said Serge Robin, RF Development Manager at Somfy.

With its specially engineered RF transceiver, the STM32WL3R is the world’s first Cortex-M0+ multiband wireless MCU to operate in the 315MHz band allocated for remote controls in North America, while the support of the 850MHz and 950MHz ISM bands qualifies its use in products approved for sale worldwide.

Specially adapted for the STM32WL3R, the MCU’s extra power-saving states give greater control to deactivate unused circuitry while also optimising the system wake-up time. In these states, battery life is extended while RAM retention preserves the application context to ensure fast wake-up and thus provide the best possible user experience. Among the states available, ultra-deep stop draws just 450nA while retaining 16KB of RAM data and there is also an incredibly frugal 14nA shutdown mode with up to six wakeup pins.

By providing six wake-up pins, instead of one, the STM32WL3R allows richly featured remotes while simplifying circuit layout and facilitating reuse of the PCB design in multiple product variants.

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ST reveals new NB-IoT modules for cellular connectivity

STMicroelectronics has introduced two new ST87M01 NB-IoT wireless modules and revealed an enhanced development ecosystem designed to facilitate the creation of smart IoT solutions with narrowband cellular connectivity. Typical applications include smart logistics, environmental monitoring, smart lighting, smart parking, industrial condition monitoring, livestock and pet tracking, alarms, and remote healthcare.

Existing modules in the ST87M01 family are already installed in smart meters deployed throughout Europe, helping utilities capture real-time granular data to meet environmental and operational goals. “We are now taking the next step to make our module technology and fully owned, resilient supply chain accessible across a wider variety of markets and environments. This all-in-one solution combines industry-leading compactness and ultra-low power consumption with reliability and security, enabling scalable and secure IoT deployments,” said Domenico Arrigo, General Manager, Application Specific Analog Product Division, STMicroelectronics.

The two new modules include the ST87M01-1001, supporting NB-IoT narrowband cellular data connectivity, and the ST87M01-1301 which adds GNSS and Wi-Fi positioning capabilities for outdoor and indoor geolocation. The EVKITST87M01-2 evaluation kit is a comprehensive development platform with a ready-to use Conexa IoT SIM card and two SMA antennas, for prototyping and testing NB-IoT connectivity in real-world applications. ST’s expanded ecosystem also includes the “Easy-Connect” software library and design examples.

ST’s “Easy-Connect” library helps developers to quickly communicate with the module, configure and exercise the NB-IoT, GNSS, and Wi-Fi functionalities, and exchange data with the cellular network, over a C-like, totally hardware agnostic, and OS independent platform. The IoT SIM card provides 50MB of data, valid for 6 months after user activation, through the Conexa network. Operated by ST Authorised Partner Wireless Logic, Conexa supports NB-IoT connectivity across many international markets, with this SIM specifically configured for use in Europe, Middle East, and Africa (EMEA).

“Wireless Logic’s cellular connectivity, included free of charge with ST’s latest NB-loT module evaluation kits, provides the easiest and fastest way to connect and develop prototypes,” commented John Dillon, Product and Marketing Managing Director, Wireless Logic. “Our Conexa IoT network and management platforms provide extensive geographical coverage and ensure resilient and future-proof NB-loT connectivity.”

The Virtual Antenna technology from Ignion, alongside its seven different antenna components and Oxion AI-powered integration platform of RF projects, helps customers select and design-in the right Virtual Antenna chip to meet size, performance, and bill-of-materials constraints. Using Oxion’s antenna integration platform, ST87M01 developers can trial shortlisted antennas, apply best practices, and quickly iterate their designs to fine-tune performance.

Jaap Groot, CEO of Ignion, said, “Our Virtual Antenna® and Oxion™ AI-powered platform solutions make RF design simpler, faster, and more predictable, giving engineers confidence and control throughout development. Working closely with ST, we’ve brought this capability to the new ST87M01 modules, reflecting our shared commitment to deliver integrated, ready-to-scale wireless solutions that help customers save time and focus on what matters most: innovation.”

DAOS can optionally support ST customers throughout system development, from hardware and software design to production, accelerating time-to-market and unlocking the potential of the ST87M01 module in IoT projects.

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Kontron presents compact motherboards with Intel Core series 2 processors

Kontron has announced the availability of a comprehensive BIOS update for all current ATX, µATX and mITX motherboards supporting the 12th, 13th and 14th generation of Intel Core i processors. The update enables full compatibility with the new Intel Core Series 2 processors (codename “Bartlett Lake”) and will be available starting November 2025.

Featuring up to 24 cores (8P + 16E), the new processor family delivers higher performance, particularly for AI-based and real-time applications. All Kontron motherboards belong to a unified product family with a synergetic BIOS, consistent drivers and an extensive toolset for customer-specific configurations (e.g., default settings, thermal management, boot logo). The products are designed and manufactured in Germany and are ideal for connected IoT applications in industrial automation, medical technology, KIOSK, digital signage, POS/POI, video surveillance, and casino gaming.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are based on the Intel Q670E chipset, offering comprehensive features such as vPro Manageability, Stable Image (SIPP) and RAID support. Real-time applications benefit from Time Sensitive Networking (TSN) functionality. Both boards feature dual Intel LAN interfaces with teaming and TSN support, a PCIe x16 Gen5 expansion slot, USB 3.2 Gen2 interfaces, M.2 Key-M and Key-E slots, and two SO-DIMM sockets for high-performance DDR5 memory.

The Mini-ITX motherboard K3836-Q/R is based on the Intel Q670 and R680E chipsets for ECC-based applications, offering additional USB, COM and SATA interfaces as well as dual power supply options (standard ATX power supply or single 12 V input).

The ATX motherboard K3851-R, based on the Intel R680E chipset, is designed for applications requiring extensive PCIe expandability (including PCIe 5.0). It features three network interfaces (2× Intel i226 and 1× Intel i219LM GbE vPro controller incl. AMT & teaming), dual M.2 Key-M PCIe/NVMe SSD slots, four COM ports, six PCIe slots, one PCI slot, and eleven USB ports including USB Type-C 3.2 Gen2.

The µATX Motherboards K3841-Q, K3842-Q and K3843-B each include two M.2 slots and an integrated Intel TPM 2.0 for Windows 11 support. All models support Intel Core i3/i5/i7/i9 processors of the 12th and 13th generations with a maximum CPU TDP of 125 W.

The K3841-Q µATX industrial motherboard features three LAN interfaces (one Intel i219LM Gb Ethernet controller with manageability functions and two latest-generation i226LM controllers with 2.5 Gbit Ethernet ports), four COM interfaces, four PCIe ports (including Gen5 and two x1 ports) and eleven USB interfaces (USB 3.2 Gen2 and Type-C). The K3842-Q µATX board, which features an Intel Q670 chipset and up to two LAN interfaces, is ideal for high-quality desktop PCs or semi-industrial applications. Based on the Intel B660 chipset, the K3843-B µATX board offers features such as cTDP, DDR5, four DisplayPorts and four PCIe Gen5 interfaces for high speed and bandwidth.

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