3D magnetic sensor provides contactless position sensing for vehicles

The A31316 3D Hall-effect position sensor is the latest addition to Allegro MicroSystems’ 3DMAG line of 3D sensors. 

The sensors are offered in what is claimed to be the industry’s smallest 4.0 x 4.0mm body PCB-less package. They are suitable for automotive safety and advanced driver assistance systems (ADAS) applications that require reliable performance in harsh conditions such as powertrain and chassis applications. They are also suitable for industrial applications that require linear or rotary sensing.

Powertrain and chassis applications, passenger restraint systems, and shifter systems, are subjected to environmental vibrations and contaminants that can degrade performance. The position sensors used in powertrain and chassis applications typically require support components, like PCBs and capacitors. When a position sensor is required in a dirty, high-vibration environment—the assembly of system components can become corrupted by debris and vibration, which can inhibit the performance of the assembly. The same is true for many industrial linear and rotary sensing applications.

The A31316 3D Hall sensor eliminates the need for a PCB or other external components. It integrates the die and capacitors in a single package and for vibration-robust designs, the A31316 pins can be welded or soldered directly to connector leadframes and can be over-moulded or potted for a tight seal. 

Designed for both rotary and long-stroke linear applications, the A31316 maintains high angle accuracy across the full Grade 0 temperature range (–40 to +150 degrees C). Its flexible calibration table (33 fixed points or 22 freely placed points) enables options to reduce the time and complexity of end-of-line calibration and minimise errors due to mechanical misalignment. 

The 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications combine Allegro’s proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z). They enable true 3D sensing capabilities with a wide magnetic dynamic range without saturation, said the company. The A31316, is Allegro’s first magnetic position sensor to provide multi-direction measurement in a PCB-less SIP package. It provides designers with a configurable signal path and flexible linearisation for end-of-line calibration to optimise measurement accuracy. The IC can compensate for non-linear fields and static sensor-to-magnet misalignment errors. The high degree of configurability makes it easy for designers to optimise for accuracy and calibration time. This helps minimise processing in the electronic control unit (ECU) and maximises end-of-line yield for nonideal magnets and mechanical assembly tolerances. Multi-level output using binning can integrate the functions of multiple magnetic switch ICs into a single A31316.

The A31316 integrates a Manchester interface for programming the EEPROM through the output pin, which eliminates the need for a separate programming interface. 

A high-voltage supply is not required for EEPROM programming, and the A31316 can be programmed directly with a 5V supply voltage enabling integration with microcontrollers or other low supply devices.

The IC includes the industry’s fastest SENT protocol with 0.5 to 10 microseconds tick times, and includes a pulse-width modulation (PWM) interface with 125Hz to 16kHz carrier for simple digital interface to microcontrollers. 

Following Safety Element out of Context (SEooC) functional safety guidelines, the A31316 sensor supports ASIL B system-level integration in accordance with ISO 26262 and is automotive qualified to AEC-Q100 Grade 0.

The A31316 is available in a three-pin PCB-less SIP package (UC suffix). Product pricing and samples are available now.

http://www.allegromicro.com.

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Amphenol RF includes Wi-Fi 6-capable cable assemblies

The flexible cable assemblies available from Amphenol RF now include the reverse polarity RP-SMA to AMC assemblies. The miniature cable assemblies on RG-178 cable are designed on a flexible cable type that offers good thermal resistance and is suitable for tight spaces. 

The secure threaded coupling mechanism on the RP-SMA connector, along with the push-on mating of the right-angle AMC connector, make these assemblies particularly well-suited for use in antennas, WLAN, GPS and cellular applications, advised Amphenol RF.

The RP-SMA connector offers the same features and benefits as the SMA interface but the gender of the connector’s contact pin is reversed. The connectors provide additional benefits over traditional SMA, said Amphenol RF. In the event of wear, which is a typical result of screwing and unscrewing that causes signal strength to decrease, the RP-SMA connector allows for only the antenna or cable to be replaced which saves time.

These cable assemblies are typically used on Wi-Fi or WLAN devices. 

Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency, microwave, and data transmission system applications. 

Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing and manufacturing locations in North America, Asia and Europe.

Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions. 

https://www.amphenolrf.com

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AMD adds AU7P and ZU3T to UltraScale+ portfolio 

Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD has introduced the AU7P FPGA and ZU3T MPSoC. Both are based on the 16nm FinFET process for low power, high performance per Watt and small form factor applications. The SoCs are small, low cost, and low power entry points to the programmable logic transceiver-based UltraScale+ family, said AMD, with improved features such as high IO-to-logic density, UltraRAM and DSP.

The Artix UltraScale+ AU7P FPGA is claimed to be the lowest density, lowest power, and most cost-optimised 12.5Gbits per second transceiver-based FPGA in the Artix UltraScale+ portfolio. It offers high I/O-to-logic ratio and high memory-to-logic ratio for storing and buffering large amounts of data for processing and compute applications.

They provide up to 50 per cent lower static power, 20 per cent more I/O-to-logic ratio and twice as many 3.3V HDIO compared to the AU10P device, confirmed AMD.

The innovative InFO packaging with dimensions of 8.5 x 10.5mm means that the  AU7P is suitable for applications requiring high compute density in a small footprint. InFO packaging’s thermal and power distribution contributes to compact, power-sensitive applications such as medical imaging, machine vision, professional cameras/monitors, and automotive radar/lidar.

The ZU3T MPSoC device is the smallest device added to the Zynq UltraScale+ family with 12.5Gbits per second GTH transceivers for cost-optimised applications. The GTH transceivers are highly configurable and tightly integrated with programmable logic resources of the UltraScale+ architecture. It also has five times the transceiver bandwidth compared to the ZU3 device for critical networking applications, vision and video processing, and secured connectivity.

It also has a higher DSP slice count compared to the ZU3 for better signal processing compute, said AMD. The additional UltraRAM adds 2.5 times the embedded memory for embedded and video processing applications. 

The ZU3T contains a 64-bit processor combining real-time control with soft and hard engines for graphics processing. An Arm-based CPU sub-system is integrated for advanced analytics and there is on-chip programmable logic for task acceleration, making the MPSoC suitable for camera monitors, medical imaging and automotive infotainment systems.

The AU7P device is expected to begin shipping pre-production and production silicon in the second half of 2023.The ZU3T device is expected to begin shipping pre-production silicon to early access customers in the first half of 2023, with production silicon expected in the second half of 2023. 

Both will be available in automotive (XA) grade, qualified according to AEC-Q100 test specifications with full ISO26262 ASIL-C level certification. 

http://www.amd.com

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Temperature and humidity sensors lead the industry in accuracy, says ScioSense

Claimed to have industry-leading accuracies in temperature and humidity sensing, the ENS21x family of digital temperature and humidity sensors has been launched by ScioSense.

In addition to “industry leading accuracies”, they are claimed to have rapid response times. The sensors have low power operation with 40nA standby current and are automotive-qualified.

The family of digital humidity and temperature sensors are accurate down to 0.1 degrees C and 0.8 per cent relative humidity. 

The ENS21x family is suitable for use in home appliances, building and automotive HVAC, cold chain management, personal health and wellness monitoring, industrial automation and instrumentation.

ScioSense’s in-house support can help integrate and customise sensors to accelerate time to market.

Product samples are available on request from ScioSense and authorised distributors. 

ScioSense is headquartered in Eindhoven, The Netherlands. The company specialises in the manufacture of semiconductor-based environmental and flow sensors. Its product portfolio consists of humidity, gas / air quality, temperature, pressure and flow sensors for building automation, home appliances, IoT/wearables/mobiles, automotive and industrial applications.

https://www.sciosense.com

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