Compact, power-efficient CoM is powered by Intel Atom x6000E series

The NanoCOM-EHL is the computer on module (CoM) developed by Aaeon which brings the Intel Atom x6000E Series to the COM Express Type 10 form factor.

It has Intel Atom x6000E series processing power, onboard LPDDR4 and a range of I/O features on a small module for use in compact products.

The NanoCOM-EHL uses power-efficient 12W Intel Atom, Pentium and Celeron processors with onboard LPDDR4 system memory of up to 16Gbyte on a compact form factor, measuring 3.31 x 2.17 inches (84 x 55mm). The module also has the option of 64Gbyte of onboard eMMC storage.

The NanoCOM-EHL has the capacity to host multiple expansion modules via its four PCIe slots. Together with the module’s processing power and small form factor, this makes it suitable for semiconductor test equipment use.

I/O consists of two high speed (10Gbits per second) USB 3.2 slots, eight USB 2.0 slots and a dual LVDS / eDP display output. There is also a 2.5GbE and a high definition audio output interface.

The low power NanoCOM-EHL is suitable for smart transport systems where it can be used in passenger information systems and streaming control applications. 

The NanoCOM-EHL is now in mass production.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI Edge solutions. The company provides reliable, high quality computing platforms including industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN solutions. It also supports OEMs and ODMs worldwide and works closely with cities and governments to develop and deploy Smart City ecosystems.

Aaeon works closely with chip designers to deliver stable, reliable platforms. 

http://www.aaeon.com

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Lemo expands high-speed data connector portfolio

USB 3.1 and single pair Ethernet connectors expand Lemo’s high-speed connector portfolio. 

The company has completed its existing USB 2.0-compliant portfolio with a new range of USB 3.1 connectors providing data transfer speed up to 10Gbits per second.

The connectors have inserts which ensure optimum shielding and absolute signal integrity. They are also equipped with a pair of USB 2.0 contacts to ensure backwards compatibility as well as a low voltage power contact.

The company is also extending its Ethernet-compliant portfolio that includes 1000 Base-T4 and 10G Base-T4-compliant solutions with a range of single pair Ethernet (SPE) connectors providing data transfer speed up to 1Gbits per second.

The miniature models are available with either one or two high-speed SPE pairs, and are claimed to ensure robust, safe and lasting compact integrations.

These new configurations for both USB 3.1 and SPE guarantee high-quality and reliable high-speed interconnect solutions for both indoor and outdoor environments where absolute signal integrity is needed. They are available in Lemo’s B, K and T series.

Lemo designs and manufactures precision custom connection and cable solutions. Its Push-Pull connectors are used in a variety of challenging application environments including medical, industrial control, test and measurement, audio-video and telecommunications.

Lemo has been designing precision connectors for over seven decades. Offering more than 90,000 combinations of products that continue to grow through customer-specific designs, Lemo and its affiliated sister companies Redel, Northwire and Coelver currently serve more than 100,000 customers in over 80 countries around the world.

http://www.lemo.com

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Renesas unveils family of automotive radar transceivers with high accuracy and low power consumption

Renesas Electronics Corporation is entering the automotive radar market with the introduction of a 4×4-channel, 76-81GHz transceiver designed to meet the requirements of ADAS (advanced driver assistance systems) and Level 3 and higher autonomous driving applications. 

Renesas will incorporate the new RAA270205 high-definition radar transceiver into its growing sensor fusion portfolio, which combines radar, vision systems, and other sensing modalities.

Designed in co-operation with Steradian Semiconductors Private Limited, which Renesas acquired earlier this year, the new transceiver MMIC (monolithic microwave integrated circuit) is especially suited for imaging radar, long-range forward-looking radar and 4D radar, but can also be used for corner and central-processing radar architectures, the so-called ‘satellite’ automotive radar systems, said the company. Equipped with 4Tx and 4Rx channels, the RAA270205 supports up to 16 MIMO (multiple-input and multiple-output) channels. It can be cascaded to enable higher channel count and better radar resolution.

The RAA270205 features up to 5GHz of bandwidth and a 112.5MSPS ADC (analog-to-digital converter) sampling rate that it claims is nearly three times faster than those of competing devices. Power consumption of 1.2W is 50 per cent lower than that of comparable transceivers and it delivers a noise figure of 9dB, which is 3dB less than other radar transceivers, it says. Its chirp rate of up to 300MHz/microAs improves radar resolution and object detection.

“Today’s radar transceiver MMICs must achieve higher definition to support the high-accuracy requirements of ADAS and autonomous driving safety platforms,” said Vivek Bhan, senior vice-president and deputy general manager of Renesas’ automotive solution business unit“Working in close collaboration with Steradian, which brings deep radar design expertise, we are expanding our sensor fusion offerings with a focus on functional safety and low power consumption to help our customers lower their development costs and improve time to market.”

Renesas plans to combine the RAA270205 transceiver with other compatible devices from its portfolio to support automotive radar systems. These combinations will include the satellite radar system for AD/ADAS, which will be available in Q2/2023. 

 The RAA270205 will be available in 1Q/2023 in sample quantities, with commercial production planned for 2024. The transceiver is available in a small, easy-to-integrate eWLB (embedded wafer-level ball-grid array) package, measuring 7.6×5.6mm. It will be fully compliant with automotive industry requirements such as IATF 16949, AEC-Q100 Grade2 and ASIL B. 

Visit Renesas at electronica 2022, Hall B4, 179

https://renesas.com

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NeoCortec P Series NeoMesh wireless module can be integrated to PCBs

NeoCortec, manufacturer of bi-directional wireless mesh network modules, has released its P Series of wireless NeoMesh modules. Featuring an RF/IO antenna connection placed under the module on solder pads for quick and easy soldering to any PCB, the company claims the P Series modules allow for a more efficient antenna design as well as more compact design of the sensor or actuator and allow customers to integrate Neocortec’s NeoMesh modules into their own PCB with the antenna also already integrated.

The new NeoMesh modules, NC1000P-8, NC1000P-9 and NC2400P, operate at 868MHz, 915MHz and 2.4GHz respectively and complement the C-Series modules that come with an u.FL connector and are used whenever an external connector is wanted. Cost efficient and easy to integrate, all the modules from NeoCortec suit a broad range of applications based on IoT and Cloud-based sensor networks, including smart home and smart workplace, metering, security, agriculture, transportation, Industry 4.0, medical and food distribution.

NeoMesh from NeoCortec is a protocol enabling node-to-node mesh communication of sensors, without any need for mains-powered devices. All devices can be battery-powered, as can the gateway. To start building the network, simply switch on two nodes. When switched on additional nodes will automatically join the existing network and will start expanding it in a number of devices in range. The NeoCortec communication modules are equipped with radio and NeoMesh and can easily be integrated in a sensor or motor.

NeoCortec is a supplier of ultra-low-power bi-directional wireless mesh network modules. NeoCortec is based in Copenhagen, Denmark.

Visit NeoCortec at electronica 2022, Hall B5, W11

https://neocortec.com

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