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ST’s new Edge AI, NPU-accelerated microcontrollers now available from Mouser

Tue, Feb 11, 2025

Mouser is now shipping the new STM32N6 high-performance microcontroller from STMicroelectronics. The STM32N6 is the newest and most powerful of the STM32 family, optimised for edge-intensive AI algorithms in automotive, smart industry, robotics, drones, healthcare, smart buildings, smart homes, smart farming, and personal electronic applications.

STMicroelectronics STM32N6 MCU is the first of the STM32 series featuring ST’s proprietary Neural-ART Accelerator, specifically architected for embedded inference, delivering 600 times more machine-learning performance than existing high-end STM32 MCUs. The STM32N6’s Neural-ART Accelerator clocks at 1GHz, providing 600 giga-operations per second (GOPS) at an average of 3 tera-operations per second (TOPS), delivering energy efficiency while allowing machine learning applications requiring an accelerated microprocessor to now run on an MCU.

The STM32N6’s machine learning performance makes it possible to run computer vision, audio processing and sound analysis for consumer and industrial applications at the edge, utilising a Cortex-M55 MCU running at 800 MHz, a robust 4.2 MB embedded RAM that also includes a NeoChrom GPU alongside an H.264 hardware encoder, and a Helium™ M-Profile Vector Extension. The STM32N6 delivers remarkable AI performance and provides excellent flexibility in a small silicon package ideal for embedded systems and wearables.

The STM32N6 is supported by the STM32N6570-DK discovery kit. The kit is a complete demonstration and development platform for the STM32N6 and provides a full range of hardware features to enable users to evaluate the device. The kit includes USB Type-C, Octo SPI flash memory and Hexadeca SPI PSRAM devices, Ethernet connectivity, a camera module, a 5″ LCD touchscreen, and more. Four flexible extension connectors offer easy expansion capabilities for applications such as wireless connectivity, analog applications, and sensors.

https://www.mouser.com

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NVIDIA Jetson Orin Nano “Super” now available on the Advantech EPC-R7300 Edge AI Box PC

Mon, Feb 10, 2025

Advantech has announced the release of its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB system-on-module. Leveraging the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance with ultra-low power consumption (25 watts). Its ultra-compact design (152×173×50 mm) and Ubuntu OS readiness facilitate seamless AI deployment, making it ideal for next-generation applications such as small Large Language Models (LLMs), Vision-Language Models (VLMs), and Vision Transformers (ViTs).

The EPC-R7300 Orin Nano Super, coupled with Jetpack 6.2, introduces advancements in AI performance, making it an ideal platform for deploying small LLMs, VLMs, and ViTs. With enhanced GPU, CPU, and memory capabilities, the Orin Nano Super efficiently supports models with fewer than 10 billion parameters, enabling tasks such as natural language understanding and generation directly on embedded devices. This capability supports diverse embedded applications such as conversational AI in robotics, voice interfaces for IoT, real-time translation, retail analytics, and industrial data and vision processing. By supporting small-scale LLMs, VLMs, and ViTs, the Jetson Orin Nano Super provides developers with a powerful, efficient, and privacy-focused solution, enabling real-time embedded intelligence across industries.

Advantech’s EPC-R7300 industrial-grade AI Box PC is engineered to meet the diverse computing needs of developers with its versatile I/O features, including RS-485, CAN bus, and multiple Ethernet ports. Supported by NVIDIA JetPack, the EPC-R7300 ensures a seamless migration from NVIDIA’s development ecosystem and simplifies integration by automatically enabling I/Os without requiring additional driver installations or configurations. For edge AI applications such as image inferencing, which demand high-quality camera inputs, the EPC-R7300 supports both USB and IP camera interfaces, making it ideal for vision-based systems. Additionally, it offers 4K resolution displays via its HDMI 2.0 port, while ensuring reliable data connectivity with 2 x GbE LAN ports. To expand functionality, the EPC-R7300 includes 2 x USB 3.2 Gen 1 ports, 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key: Supports Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key: Enables 4G/5G connectivity, 1 x 2280 M-Key: Comes pre-installed with a 128GB NVMe SSD, with additional expansion capability). With its robust features and ease of integration, the EPC-R7300 is a powerful and flexible solution for developers building next-generation edge AI systems.

The EPC-R7300 Orin Nano Super AI Box PC is engineered for durability in harsh industrial environments, supporting a wide operating temperature range (-20 ~ 60ºC / -4 ~ 140ºF), wide power input range (9 ~ 36 VDC), and high vibration tolerance (3.0 Grms). This rugged design enables users to quickly prototype field-side applications, streamlining the development process and minimising the time and resources required for system integration, verification, and transformation into a ready-to-use edge AI solution.

Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA Jetpack 6.2, making the EPC-R7300 capable of delivering excellent functionality without additional integration work.
The EPC-R7300 with NVIDIA Jetson Orin Nano Super support will be available starting Q1 2025.

https://www.advantech.com

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u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

Thu, Feb 06, 2025

u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

The wireless modules combine ultra-lower power consumption and high processing efficiency, consuming up to 50% less current than previous-generation devices while doubling process capacity. They also security features, which makes them ideal for a wide range of IoT applications, such as smart home devices, industrial automation, or healthcare.

The entire NORA-B2 series comprises four variants that differ in memory sizes, design architectures and price levels to match almost any device manufacturer’s requirements.

• NORA-B20 features an ultra-low power nRF54L15 SoC with a 128 MHz Arm Cortex-M33, RISC-V co-processor, and 2.4 GHz multiprotocol radio. It includes 1.5 MB NVM and 256 KB RAM.
• NORA-B21, built on the nRF54L10 SoC, supports multiple wireless protocols (Bluetooth LE, Mesh, Thread, Matter, Zigbee, Amazon Sidewalk) with 1.0 MB NVM and 192 KB RAM.
• NORA-B22 is a cost-effective option with up to 31 GPIOs, 0.5 MB NVM, and 96 KB RAM.
• NORA-B26 is pre-flashed with u-blox u-connectXpress, enabling easy Bluetooth integration without prior expertise.

All NORA-B2 modules are designed for PSA Certified Level 3 security. They incorporate features such as secure boot and updates, tamper detection, and secure firmware over-the-air (FOTA) updates. These security measures ensure that IoT devices remain protected against any potential threats, safeguarding both data and functionality. NORA-B2 modules are also qualified against Bluetooth Core 6.0 that includes Channel Sounding, enabling endless cost-effective possibilities in tracking and locating use cases.

NORA-B2 variants either come with an antenna pin for connecting an external antenna of choice or are designed with a patented PCB antenna providing best-in-class RF performance. All module versions come with global certification allowing device manufacturers to launch their products worldwide with minimal effort.
Samples of NORA-B20 are now available. Early samples of NORA-B21 and NORA-B22 are available for evaluation in limited quantities. The pre-release version of u-connectXpress software for NORA-B26 is also available for early adopters.

https://www.u-blox.com

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Molex has released compact power over coax solution

Wed, Jan 29, 2025

Molex, has announced the availability of its new compact MMCX Power over Coax (PoC) solution, which features a patent-pending mating technique to ensure secure and stable connections while maintaining electrical ground continuity. This product innovation is ideally suited for space-constrained applications where reliable RF connections and continuous power delivery are paramount, such as automotive liquid-crystal display (LCD) mirrors, driver monitoring systems or industrial sensors.

The MMCX Power over Coax (PoC) product not only alleviates persistent reliability problems, it also is backward compatible with IEC 61169-52 MMCX jack receptacles to facilitate seamless product upgrades. This alleviates the need to redesign existing PCB receptacles, which can save significant time while reducing costs associated with product integration. Compliance with current and future standards offers customers a future-proof solution to meet evolving RF connection and power delivery requirements.

The compact product is 30% smaller than traditional MMC connectors, making it ideal for customers seeking to replace larger, heavier MCX connectors as well as more robust and reliable performance. MMCX Power over Coax is especially advantageous in applications where separate power and data connectors is either impractical or undesirable. To date, MMCX Power over Coax is being tested and deployed in a variety of agriculture, automotive and industrial automation applications.

Additionally, this future-proof solution improves performance for a vast range of miniaturised, rugged and reliable products, encompassing remote and mobile devices, unmanned aerial vehicles, portable electronics, smart-home automation systems, as well as IoT sensors and infrastructure. MMCX Power over Coax also accommodates the stringent reliability requirements for GPS antennas, intelligent transport management systems, wireless meter readers and more.

https://www.molex.com

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ST’s new Edge AI, NPU-accelerated microcontrollers now available from Mouser

NVIDIA Jetson Orin Nano “Super” now available on the Advantech EPC-R7300 Edge AI Box PC

u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

Molex has released compact power over coax solution

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