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Virtual I/O expansion module helps deploy AI, says Innodisk

Tue, Jan 17, 2023

The burgeoning AI and AIoT markets could result in 29 billion IoT edge devices by 2030, reports Innodisk. Such a large volume of edge devices means it is necessary to consider not only remote management, but also how to deploy devices more effectively in order to efficiently implement applications. In response, the company has introduced the InnoEx Virtual I/O expansion module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.

The integration helps enterprises effectively control computer equipment budgets and solve the issue of complicated circuits that cannot be cut and arranged, said Innodisk. It can be extended through virtual I/O technology using only a single computer system and a single network line, and can be connected with the InnoEx modules in series to flexibly expand the number and distance of terminal devices.

Miniaturisation in the computer world means the space for I/O expansion slots has been greatly reduced. If integrators want to increase the number of I/O expansion devices, they often have to redesign the motherboard, which can be time-consuming and not always economical. Embedded expansion cards by Innodisk can solve these issues but not all motherboards can use expansion cards. Innodisk has therefore launched InnoEx virtual I/O expansion. It allows for a single route to connect a single computer system and functions like a multi-function transfer port, effectively expanding the number and distance of external devices through virtual signals.

Benefits include high system compatibility and it does not occupy the I/O slots on the original computer system. Another advantage is that it does not require changes to the mechanism design. It can also be integrated into the existing network architecture to achieve borderless I/O expansion through networking.

The InnoEx virtual I/O expansion module supports interfaces such as HDMI and USB. It is suitable for applications such as smart retail, smart image recognition, digital display, and AGV smart handling. It can also realise various industrial applications and advanced AI intelligent applications.

Innodisk has also announced that it will launch Serial and CANbus versions in the second quarter of 2023.

https://www.innodisk.com

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Renesas introduces eight-pin package for RL78 / G15 MCU

Fri, Jan 13, 2023

A general purpose microcontroller (MCU) has been added to the Renesas Electronics low power RL78 family. The small, eight-pin package size targets eight-bit MCU applications, advised Renesas.

The versatile RL78 / G15 packs many peripheral functions and four to 8kbyte of code flash memory in package sizes ranging from eight to 20 pins, with the smallest eight-pin device measuring only 3.0 x 3.0mm. They are designed to keep system size small and reduce the cost of end systems, such as industrial, consumer, sensor control, lighting, and inverter applications. The maximum operating ambient temperature of 125 degree C covers a wide temperature range and allowing the MCU to be used near heat-generating components such as inverter motors.

All pins can be used for general-purpose I/O, except VDD and VSS power supply pins. In addition to up to 8kbyte of code flash memory, the MCU has 1kbyte of code flash memory, 1kbyte of data flash and 1kbyte of SRAM.

It supports operating voltages from 2.4 to 5.5V and supports CSI, UART, Simple I2C, and multi-master I2C serial interfaces. The MCU has a high-precision oscillator (±1.0 per cent) and a built-in comparator.

Engineers designing with the RL78 / G15 can use the GUI-based Smart Configurator to generate driver code for peripheral functions. Renesas also offers the Fast Prototyping Board (FPB) for evaluation, which comes with Arduino Uno and Pmod Type 6A interfaces with access to all pins. Debugging and programming are possible using only a USB cable. Developers can gain access to RL78 development resources using just an Arduino library that can run on the FPB. They can also access the resources offered through the Arduino ecosystem.

The RL78 / G15 is available today in volume production.

Renesas Electronics combines embedded processing, analogue, power and connectivity expertise to deliver semiconductors for the automotive, industrial, infrastructure and IoT market sectors.

http://www.renesas.com

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Aaeon pairs server-grade Intel Xeon with COM Express Type 7 form factor

Thu, Jan 12, 2023

Computer on module (COM) developer, Aaeon’s latest module is the COM-ICDB7 which is powered by the third generation Intel Xeon D processor platform (formerly known as Ice Lake-D).

It is designed for applications such as drone fleet control, biomedical science, and data analysis applications, said Aaeon. The COM-ICDB7 offers server-grade CPU performance of up to 10 cores and 20 threads via the third generation Intel Xeon processors on a 4.92 x 3.75 inch (125 x 95mm) COM Express Type 7 form factor.

Supporting a 70W CPU, the COM-ICDB7 can power multiple expansion modules via its PCIe 4.0 [x16] slot and four PCIe 3.0 [x4] slots. It also has two DDR4 SODIMM sockets providing up to 64Gbyte system memory with ECC (error code correction) support, which adds stability to large data analytics applications.

There are also four 10GbE ports accessible via its carrier board for high speed, high volume data transference. These features combine to ensure the COM-ICDB7 is able to execute complex computing tasks, for solutions deployed in fields such as industrial automation, edge servers and data centres.

Optional additions to the COM-ICDB7 include a custom carrier board, which offers a more cost-effective approach to outdoor deployment, said Aaeon.

The COM-ICDB7 is eligible for application-specific customisation such as wider operational temperature ranges for operation in harsh environments where the COM-ICDB7 could be used to power smart city, transport, and drone fleet control applications.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge products. Its portfolio includes industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN solutions. The company works closely with cities and governments to develop and deploy Smart City ecosystems. Aaeon is recognised as a Titanium member of the Intel Internet of Things Solutions Alliance.

http://www.aaeon.com

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Intel optimises fourth general Xeon Scalable processors for data centre power

Thu, Jan 12, 2023

The fourth generation Intel Xeon Scalable processors are Intel’s most sustainable data centre processors, said the company. They have a range of features for optimising power and performance, to help achieve customers’ sustainability goals, said Intel.

Code-named Sapphire Rapids, the Xeon processors are claimed to have the most built-in accelerators of any CPU available today, making them suitable for AI, analytics, networking, security, storage and high performance computing (HPC) applications.

Compared to earlier generations, they increase performance per Watt efficiency by a factor of 2.9, using built-in accelerators, to save up to 70W power per CPU in optimised power mode with minimal performance loss, said Intel. This equates to between 52 and 66 per cent low total cost of ownership (TCO).

The number of built-in accelerators means that the fourth generation Xeon processor needs less additional discrete acceleration.

The new optimised power mode can deliver up to 20 per cent socket power savings with a less than five per cent performance impact for selected workloads. Innovations in air and liquid cooling reduce total data centre energy consumption, added Intel.

The manufacturing process of the processors uses 90 per cent or more renewable electricity at Intel sites with water reclamation facilities.

In AI, and compared to the previous generation, the processors increase PyTorch real time inference and training performance with built-in Intel Advanced Matrix Extension (Intel AMX) accelerators.

The low latency network and edge workloads mean that the fourth generation Xeon processors are “a critical part of the foundation driving a more software-defined future for industries ranging from telecommunications and retail to manufacturing and smart cities,” said Intel. For 5G core workloads, the built-in accelerators help increase throughput and decrease latency, while the processors’ power management enhances both the responsiveness and the efficiency of the platform, Intel added.

Compared to earlier generations, they deliver up to twice the virtualised radio access network (vRAN) capacity without increasing power consumption. This enables communications service providers to double the performance-per-Watt to meet critical performance, scaling and energy efficiency needs.

The latest Xeon processor combines up to four Intel 7-built tiles on a single package, connected using Intel EMIB (embedded multi-die interconnect bridge) packaging technology. It delivers increased memory bandwidth with DDR5, increased I/O bandwidth with PCIe5.0 and Compute Express Link (CXL) 1.1 interconnect.

http://www.intel.com

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Virtual I/O expansion module helps deploy AI, says Innodisk

Renesas introduces eight-pin package for RL78 / G15 MCU

Aaeon pairs server-grade Intel Xeon with COM Express Type 7 form factor

Intel optimises fourth general Xeon Scalable processors for data centre power

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