STMicroelectronics releases nine RF integrated passive devices (RF IPDs)

Nine RF integrated passive devices (RF IPDs) from STMicroelectronics combine antenna impedance-matching, balun, and harmonic filter circuity optimised for STM32WL wireless microcontrollers.

The STM32WL MCUs combine application-level processing and wireless communication for smart, connected devices. They integrate an Arm Cortex-M4 microcontroller with a sub-GHz long range radio managed by a Cortex-M0+ core. The radio is LPWAN-compliant, supports multiple modulation schemes, and comes with LoRaWAN and Sigfox stacks included in the STM32CubeWL microcontroller software package.

The RF IPDs are in tiny chip scale packages. They connect the STM32WL microcontroller to its antenna and help maximise the RF performance. By integrating all the components on one die, STMicro said performance is consistent and avoids the process variations that affect conventional matching networks built with discrete components. They also simplify circuit design, save on bill of materials, and permit a smaller form factor, added ST.

The nine RF IPD variants let designers choose the optimum parameters according to the RF frequency range and power, microcontroller package type, and two- or four-layer PCB. 

The series comprises the BALFHB-WL-01D3 through BALFHB-WL-06D3 for applications at 868MHz and 915MHz. The BALFLB-WL-07D3, BALFLB-WL-08D3, and BALFLB-WL-09D3 are optimised for 490MHz. Each integrates the complete receive and transmit signal paths between the microcontroller and antenna. The integrated filter provides high attenuation of unwanted transmitter harmonics, for designers to satisfy the regulations set by radio licensing authorities worldwide.

All devices are in production now. They are offered in a 2.13 x 1.83mm eight-bump wafer-level chip-scale package with a profile below 630 micron after reflow. 

http://www.st.com

> Read More

SiT7910 Super-TCXO sets timekeeping benchmark, says SiTime 

Designed for aerospace and defence applications, the latest member of the Endura family by SiTime enables faster GPS signal acquisition and locking. The SiT7910 sets a new performance benchmark for timekeeping components, said the company.

The SiT7910 is part of the SiTime Endura ruggedised family in aerospace and defence devices which use global positioning system (GPS) signals, such as ruggedised handheld radios, ground vehicles and sensors. All can acquire and lock to GPS more quickly and securely with the 25 times higher precision of this Super-TCXO, said SiTime.

 “The GPS signal is ubiquitous and is a crucial part of national security, everyday communications, financial systems, and power grid operations,” said Piyush Sevalia, executive vice president of marketing at SiTime. “However, it is susceptible not just to environmental disruptions but also to jamming and spoofing”. It requires precision timekeeping, which ensures the faster and more secure acquisition of, and locking to GPS signals, even in the harshest of environmental conditions. The SiT7910 Super-TCXO uses SiTime’s MEMS, analogue and systems technologies.

Key features include 32.768kHz frequency and ±0.2 ppm frequency stability over -55 to +105 degrees C with performance up to 25 times better than legacy quartz technology, reported SiTime. The device maintains one second of accuracy for one year, versus legacy quartz devices that can only maintain it for one to 14 days.

The SiT7910 also has 20 ppb per g g-sensitivity for resilience in high-vibration environments. It also has low power consumption, typically 6.0 microA and ±5 ppm frequency ageing over 20 years.

Operating supply voltage is 1.62 to 3.63V.

The Super-TCXO is packaged in a space saving 2.5 x 2.0mm package and is Pb-free, RoHS, and REACH-compliant

The Endura SiT7910 is sampling now. Volume production is expected in Q2, 2023.

SiTime is a precision timing company, with products designed to enable customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. 

http://www.sitime.com

> Read More

Qualcomm announces “first 5G Advanced-ready modem-RF system”

Claimed to be the first modem to antenna system to support 5G Advanced, Snapdragon X75 will push the boundaries of connectivity including coverage, latency, power efficiency and mobility, said Qualcomm. Target applications are smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 has a dedicated hardware tensor accelerator, Qualcomm 5G AI processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1. It also introduces Qualcomm 5G AI Suite Gen 2 with AI-powered optimisations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The 5G AI suite’s AI-based capabilities include what is believed to be the first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2 to optimise 5G performance.

The Snapdragon X75 is powered by a new modem-to-antenna upgradeable architecture and is scalable. In addition to the 10-carrier aggregation for mmWave, there is 5x downlink carrier aggregation and FDD uplink MIMO for sub-6GHz bands, which optimise spectrum aggregation and capacity.

Converged transceiver for mmWave and sub-6GHz paired with the new Qualcomm QTM565 mmWave antenna modules reduce cost, board complexity, hardware footprint and power consumption, said the company.

There is also the company’s 5G PowerSave Gen 4 and RF Power Efficiency suite for extended battery life. 

The modem to antenna system has support for DSDA Gen 2, enabling 5G/4G Dual Data on two SIM cards simultaneously. For fast, reliable, long range uploads, there is the Smart Transmit Gen 4 now includes support for Snapdragon Satellite.

“5G Advanced will take connectivity to a whole new level, fuelling the new reality of the connected intelligent edge,” said Durga Malladi, senior vice president and general manager, cellular modems and infrastructure, Qualcomm Technologies. He added the Snapdragon X75 Modem-RF system with “innovations such as hardware accelerated AI and the support for upcoming 5G Advanced capabilities,  . . .  unlock a whole new level of 5G performance and a new phase in cellular communications.”

Qualcomm has also announced the Snapdragon X72 5G modem-RF system (pictured). It is optimised for mainstream adoption of mobile broadband applications, supporting multi-Gigabit download and upload speeds.

Snapdragon X75 is currently sampling, with commercial devices expected to launch by the second half of 2023. 

http://www.qualcom.com

> Read More

TDK adds two digital MEMS accelerometer sensors to Tronics AXO300 series 

The AXO301 and AXO305 digital MEMS accelerometer sensors have been introduced by TDK. 

The AXO301 high resolution accelerometer and inclinometer is for railway and industrial systems and the AXO305 is a high performance accelerometer for land, marine and robotics applications.

The AXO301 low noise and high resolution ±1 g accelerometer is suitable for high precision acceleration/deceleration measurements in railway applications and inclination control in industrial applications. The AXO305 ±5 g accelerometer is tailored for navigation, positioning and motion control of land and marine manned and unmanned systems. 

They use a closed-loop architecture that delivers high linearity and stability even under strong vibrations, said TDK. The accelerometers have a one year composite bias repeatability of 1mg and composite scale factor repeatability of 600ppm. 

The AXO301 offers a performance-equivalent, low-SWaP (size, weight and power) and cost-effective alternative to force balance inclinometers and servo-accelerometers, said TDK. It demonstrates a low noise density of eight microg/√Hz with 50 microg resolution to offer high-accuracy inclination angle measurements. The AXO301 is tailored to odometry assistance for train positioning and localisation systems, high-end industrial tilt and inclination measurements systems as well as motion control of construction machinery. It is compliant with EN61373 railway standard for vibrations and shocks. 

The AXO305 has an input measurement range of ±5g and vibration rectification error of 20 microg/g². It is tailored to navigation, positioning and motion control functions of land, rail and marine transportation systems and vehicles. It demonstrates a bias instability of 4 microg with a ±0.5 mg bias over its temperature range, thus enabling precise GNSS-aided navigation of manned and unmanned ground vehicles and trains when integrated into inertial navigation system (INS), said TDK. AXO305 is a candidate for motion reference units (MRUs) used for ship motion control and dynamic positioning, inertial measurement units (IMUs) for land navigation, sub-sea navigation of AUVs (autonomous underwater vehicles) and ROVs (remotely operated vehicles), platform and crane stabilisation as well as precision robotics. 

The closed-loop architecture offers high resolution and strong vibration rejection, said TDK. 

The accelerometers are housed in a miniature, hermetic, ceramic J-lead package that ensures long operational and storage life and guarantees a high compliancy with the stringent thermal cycling requirements of critical applications. They embed hard-coded electronics with a 24-bit digital SPI for fast integration into standalone sensor modules, INS, IMUs as well as attitude and heading reference systems (AHRS). Built-in self-test ensures initial verification of the sensor’s integrity and continuous in-operation functionality test, added TDK.

http://www.tdk-electronics.tdk.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration