New functionality for EquipmentCloud and KontronGrid improves security and user experience

Kontron offers industrial software for cross-industry automation solutions through its subsidiary Kontron AIS GmbH. With the latest enhancements to the EquipmentCloud digital transformation solution and KontronGrid IoT device management solution, Kontron AIS offers machine builders and component manufacturers even more security, usability and flexibility.

Single sign-on (SSO) makes the login process much easier to use, and more secure. By linking to external identity providers such as Azure Active Directory, one click is all it takes for secure identification. By integrating multiple identity providers, both, the own employees and those of the system operators can be integrated. SSO can replace traditional login methods using a username and password in both desktop and mobile environments. Sensitive information such as passwords remains protected while administration is handled by the respective domain managers.

In addition, multi-factor authentication (MFA) can be made compulsory by administrators, further increasing the protection of sensitive information. The management of identities always remains in the hands of the local managers to provide a high level of security and control. Facing the prospects of growing cyber threats and legal requirements, Kontron AIS makes a decisive contribution to the secure operation of customer portals and IoT infrastructures.

Using the latest software version of EquipmentCloud, service managers can create custom reports in PDF format. Machine-related data such as master data and outstanding points can be integrated via an API so that customer-specific service processes, tickets and machine configurations can be easily documented. In addition, new CSS customisation features offer more freedom using design elements such as fonts, colours, and formatting. This means machine builders can promote their brand identity while maintaining full user-friendliness.

User statistics, which provide insights into user behaviour, are also new. Portal operators get answers to key questions: How many customers are active? How do KPIs evolve over time?

In addition, the new tracking function makes it easier to evaluate maintenance and machine care processes. Service managers can track and evaluate working hours, costs and spare parts used across systems. This creates transparency and enables more efficient invoicing.

KontronGrid, the IoT device management solution for edge devices, also offers new functionality. Docker Compose is now integrated to make it easy to configure complex Docker environments, including remote files. At the same time, a REST API for device management makes it possible to automate updates and device configurations. This enables companies to seamlessly integrate device management functions into external systems without using the graphical interface.

Further improvements have been made to the onboarding of edge devices: New devices can now be easily registered, configured and then assigned to hierarchies using the Universal ID manually or by scanning a QR code.

KontronGrid also offers the option of connecting IoT devices to machines. This gives machine manufacturers a clear overview of all their systems and the devices connected to them. Relationships can be analysed for each device group or device type, providing an important basis for predictive optimisations.

https://kontron-ais.com

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Renesas has announced ultra-low-power MCUs with capacitive touch, segment LCD and robust security

Renesas has introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support. Based on an 80-MHz Arm Cortex M33 processor with TrustZone support, the new MCUs deliver a combination of performance features and power savings that enable designers to address a myriad of applications, including water meter, smart locks, IoT sensors and more.

The RA4L1 MCUs employ proprietary low-power technology that delivers 168 µA/MHz active mode @ 80 MHz and standby current of just 1.70 µA with all the SRAM retained. They also are available in very small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), addressing the needs of products such as portable printers, digital cameras and smart labels.

The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.

Key Features of the RA4L1 MCUs

Core: 80 MHz Arm Cortex-M33 with TrustZone
Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash

Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100

Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash

Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option

Availability
The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK).

https://www.renesas.com

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New Bluetooth module from Panasonic Industry

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.

https://industry.panasonic.eu

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New industrial CoolSiC MOSFETs from Infineon offer improved power density

Infineon Technologies is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.

The CoolSiC MOSFETs 650 V G2 in TOLL are now available in R DS(on) from 10 to 60 mΩ, while the Q-DPAK variant is available in 7, 10, 15 and 20 mΩ.

https://www.infineon.com/coolsic-g2

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