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RDK3 baseboard provides proof of concepts for IoT

Thu, Mar 09, 2023

Rutronik System Solutions has developed the RDK3 baseboard, designed for engineers developing their own proof-of-concepts for Bluetooth connectivity. It shortens time-to-market for a variety of IoT applications, including advanced robotics, smart buildings, smart factories and healthcare. 

It features Infineon’s PSoC 64 secured microcontroller, enabling the implementation of security features. There is also the ability to integrate Rutronik System Solutions’ software into Infineon’s ModusToolbox.

Advanced robotics, smart buildings and factories and healthcare applications require wireless, intelligent networking of individual elements or work processes. Networked systems allow work steps and objects to be intelligently connected and interact with each other, explained Rutronik, for efficiency gains. The RDK3 baseboard is for wireless, low power Bluetooth connections with high security standards and low power consumption, said the company. It enables hardware and firmware developers to reduce time and costs in the pre-development phase and makes a significant contribution to bringing new applications much faster to market.

The RDK3 relies on Infineon’s PSoC 64 secured microcontroller with a Platform Security Architecture (PSA). The dual-core microcontroller features three-level hardware and firmware-based isolation. The Arm Dual-Cortex M-Core SoC provides a secure M0+core and performs all security functions. It is physically separated from the user applications running in parallel on the Arm Cortex-M4 core, with the main functions to build and authenticate secure applications the responsibility of the base board. 

The RDK3 has Arduino interfaces and is easy to combine with other adapter boards like HMS Anybus, Text To Speech, RAB1, and RAB2. In addition, all components used are from Rutronik’s product portfolio, ensuring the availability of all parts.

Rutronik Elektronische Bauelemente was founded in 1973 and is an independent family-owned company based in Ispringen, Germany. Today it is one of the world’s leading broadline distributors with more than 1,800 employees and serving over 40,000 customers. It has more than 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, for customer support in Europe, Asia, and North America.

http://www.rutronik.com

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STM32H5 microcontroller is designed with security in mind

Wed, Mar 08, 2023

Combining an Arm Cortex-M33 and Trust EE Secure Manager, the STM32H5 microcontroller has been designed by STMicroelectronics to make security simpler and to boost performance and security for smart applications.
The STM32H5 microcontrollers contain the Arm Cortex-M33 embedded core, which blends performance with security, energy efficiency and affordability, said ST to address the mid-range class of MCU-based applications. According to the company, the STM32H5 is the world’s highest performing Cortex-M33 implementation, running at 250MHz and 375 DMIPS for an EEMBC CoreMark industry reference score of 1023.

The STM32H5 series is designed to accelerate innovation at scale for the coming generations of smart, connected devices, which provide more intelligence “in the edge” and also strengthens defence against attacks on IoT assets. The Cortex-M33 core brings Arm’s TrustZone architecture. ST adds a range of its own security features, including some developed with ST Authorized Partner, ProvenRun.
The STM32H5 is believed to be the first MCU series to come with SoC security services accessed via an industry-standard application programming interface (API). This is called the STM32Trust TEE Secure Manager which saves developers writing their own code while providing security services developed according to known best practice. It simplifies development while ensuring effective protection.
Ricardo De Sa Earp, executive vice president general purpose microcontroller sub-group, microcontrollers and digital ICs group expects the STM32H5 microcontrollers to be used in smart homes, factories and cities making them intelligent, safe, and sustainable.
The STM32H5 MCUs also improve energy efficiency by leveraging ST’s advanced 40nm CMOS process technology and improved on-chip power conversion circuits. Power dissipation is no longer a constraint when using a 250MHz device in harsh environments where the ambient temperature can reach 125 degrees C, added ST. The STM32H5 microcontrollers are SIL-ready for products that must meet an appropriate safety integrity level (SIL), thanks to native hardware features that address a wide range of industrial and medical applications.
Typical applications include air conditioning systems, appliances, and alarm systems, industrial programmable logic controllers (PLCs), motor controls, industrial pumps, communication gateways, lighting controls, and energy conversion. They are also used in consumer products such as PC peripherals, smartphones, and accessories.
ST has been a lead development partner with Arm, supporting development of the Cortex-M33 core to comply with the PSA Certified Level 3 and GlobalPlatform SESIP3 security specifications. ST has collaborated with Microsoft Azure on middleware with strong security.

The STM32Trust TEE Secure Manager is developed with ProvenRun and powered by ProvenCore-M to ensure today’s highest security-assurance levels. The SoC security services provided include isolation, cryptography, key storage, and initial attestation.
To help users maximise its potential, ST has created dedicated development kits NUCLEO-H503RB, NUCLEO-H563ZI and STM32H573I-DK with examples showing how to use the security services and integrated all the necessary software tools and support in the STM32Cube development ecosystem.
The new devices also provide in-ST factory pre-provisioning credentials for seamless registration to various cloud and OEM servers, multi-tenant IP protection, and remote pre-integrated 3rd party public key infrastructure (PKI) lifecycle management.
The Kudelski IoT keyStream root of trust, from ST authorised partner Kudelski IoT, was pre-qualified on the STM32Trust TEE Secure Manager to allow remote credential lifecycle management services.
The STM32H5 MCUs raise dynamic efficiency to 61 microA per  MHz in switched mode (SMPS) and 120 microA per MHz running off the linear (LDO) converter (at VDD = 3.3V and 25 degrees C) in run mode with peripherals off.
The product lines initially available include the STM32H503 product line with128kbyte flash, allowing 250MHz computing capability in space- and cost-constrained applications. The STM32H562 and STM32H563 product lines have up to 2Mbyte flash, rich connectivity, and deliver 250MHz over the extended temperature range up to 125 degrees C. The STM32H573 includes AES cryptographic acceleration and security services.
Mass production is beginning now, starting with the STM32H503 and STM32H563.

http://www.st.com

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Dual-band Wi-Fi 5 and Bluetooth module extends battery life for the IoT

Tue, Mar 07, 2023

Extending the Infineon Airoc portfolio, the company has introduced the CYW43022 Wi-Fi 5 and Bluetooth module which extends battery life for IoT applications with up to 65 per cent power reduction.

The CYW43022 low power architecture results in up to a 65 per cent reduction in power usage during deep sleep mode, to extend the battery life for applications such as smart locks, smart wearables, IP cameras and thermostats.

Sivaram Trikutam, vice president of Wi-Fi product line at Infineon, said: “By optimising the sleep power for battery-operated IoT devices, consumers can now enjoy longer battery life compared to competing solutions. With the industry’s lowest power consumption for a Wi-Fi and Bluetooth combination, [the CYW43022] enables more devices to be smarter, connected, and more versatile in a wide range of environments,” he added.

The Aitoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth 5.3 device includes Wi-Fi network offloads and an embedded Bluetooth stack reducing power demands on host processors. To support designs with smaller antennas or designs that require longer reach, it includes a Class 1 Bluetooth power amplifier with +18dBm transmit power. To protect against hacker attacks, there is secure boot with firmware image authentication which requires signed Infineon firmware protects against hacker attacks.

Infineon’s Airoc wireless products, including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combinations with a broad portfolio of high-performing, reliable, low power products that deliver robust industry-leading performance.

Airoc products leverage a common software framework across Android, Linux, RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver differentiated products to market on time and on budget. 

Infineon’s Airoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth is available now. IT will be exhibited by Infineon at Embedded World in Nuremberg, Germany (14 to 16 March) Hall 4A-138.

http://www.infineon.com

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Sensor uses motion and bone conduction to save space and power

Tue, Mar 07, 2023

Headsets and hearable devices can be reduced in size and power budget using the STMicroelectronics’ motion and bone-conduction sensor, said the company. The LSM6DV16BX can deliver a longer listening experience and superior hearing in TWS (true wireless stereo) headphones and AR / VR / MR headsets.
The integrated sensors can save space inside hearable devices including sports and general-purpose earbuds. It combines a six-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1kHz.

The LSM6DSV16BX contains ST’s Qvar charge-variation detection technology for user-interface controls such as touching and swiping.
The LSM6DSV16BX sensor embeds ST’s Sensor Fusion Low Power (SFLP) technology, specifically designed for head tracking and 3D sound, and the in-the-edge processing resources featured in ST’s third generation MEMS sensors, including finite state machine (FSM) for gesture recognition, the machine learning core (MLC) for activity recognition and voice detection, and adaptive self-configuration (ASC), which automatically optimises performance and efficiency. These help to reduce system latency while saving overall power and offloading the host processor.
The enhanced integration and edge processing save up to 70 per cent of system power consumption and 45 per cent of PCB area. In addition, the number of pin connections can be reduced by 50 per cent, saving external connections, and the package height is 14 per cent less than earlier MEMS inertial sensors from ST.
The LSM6DSV16BX comes with many software examples, available on ST MEMS GitHub FSM and MLC model zoo. These include pick-up gesture detection to automatically turn on some device’s services, in-ear and out-of-ear detection in TWS headsets and head gestures for 3D sound in headphones. To save developer time, without starting from scratch, pre-integrated application examples are available in X-Cube-MEMS1 package.
The LSM6DSV16BX is in production now, available in a 2.5 x 3.0 x 0.74mm VFLGA package.

 

http://www.st.com/

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