Latest News Archives - Page 130 of 581 - SmartCitiesElectronics.com

Ryzen Embedded 5000 processors secures ‘always on’ NAS systems

Mon, Apr 24, 2023

Developed for use in ‘always on’ networking firewalls, network attached storage systems and other security applications, AMD’s Ryzen Embedded 5000 series processors is the latest member of the Zen 3-based AMD embedded processor portfolio, joining the Ryzen Embedded V3000 and EPYC Embedded 7000 series families.

The processors are equipped with six, eight, 12 or 16 cores and 24 lanes of PCIe Gen4 connectivity.

The Ryzen Embedded 5000 series processors offer scalability up to 16 cores and 32 threads and up to 64Mbyte of shared L3 CPU cache.

The processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers, explained AMD. Features include an ECC-supported memory subsystem. The thermal design power (TDP) profile ranges from 65W to 105W, enabling the Ryzen Embedded 5000 processors to reduce the overall system cooling footprint for space-constrained and cost-sensitive applications.

According to Rajneesh Gaur, corporate vice president and general manager, embedded solutions group, AMD: “This expansion of our embedded product portfolio offers a mid-range solution that fills the gap between our low-power BGA Ryzen Embedded and . . . EPYC embedded family for customers requiring both high performance and scalability of up to 16 cores.”

The series consists of the 5950E with 16 cores, the 5900E (12 cores), 5800W (eight cores) and 5600E (six cores) all with 24 PCIe Gen 43 lanes and 3.05 to 3.4GHz CPU base frequency, depending on the model.

The Ryzen Embedded 5000 processors are built on 7nm technology and are currently in production, with planned five-year manufacturing availability.
For more than 50 years, AMD has innovated in high performance computing, graphics and visualisation technologies, says the company.

http://www.amd.com

> Read More

Dedicated software library accompanies MEMS inertial sensing module

Mon, Apr 24, 2023

The ASM330LHB is an automotive-qualified MEMS inertial-sensing module by STMicroelectronics. It provides measurements for a variety of vehicle functions and is provided with dedicated software which addresses functional-safety applications up to ASIL B1.

The module contains a three-axis digital accelerometer and three-axis digital gyroscope and provides a six-channel synchronised output. The inertial measurements can improve the precise positioning of the car in context, said ST. It can support ADAS (advanced driver assistance systems) or vehicle to everything (V2X) communication, help stabilise key sensing systems like radar, lidar and visual cameras, and assist semi-automated driving applications up to L2+. It can also be used to enable a variety of functionalities in the car body, added ST.

Used with the companion software, the ASM330LHB supports automotive systems that require safety integrity up to level B. Using two ASM330LHB sensor modules for fail-safe redundancy delivers resilient contextual data for driver-assistance applications, such as lane centring, emergency braking, cruise assistance and semi-automated driving. The ASIL B -compatible software library has been developed in accordance with the automotive functional-safety standard ISO 26262 and certified independently by TÜV SÜD. The library implements dedicated safety mechanisms, including data integrity and accuracy to ensure compliance with ASIL B automotive systems.

The ASM330LHB has embedded intelligence to add new services about the car status when the driver is away. The integrated machine learning core draws just a few microA of current, said ST and a machine learning algorithm can detect events such as theft attempts, jacking-up or towing, or impacts from other vehicles.

By monitoring threshold combinations, the integrated finite state machine can detect when the vehicle is in motion or stationary, and for sensing vibrations or instability.

The accelerometer and gyroscope inside the module maintain high stability over time and temperature and have very low noise, achieving an overall bias instability of three degrees per hour. The ASM330LHB operates over the extended temperature range of -40 to +105 degrees C and has multiple operating modes that let designers optimise the data-update rate and power consumption.

The ASM330LHB is AEC-Q100 qualified and in production now in a 2.5 x 3.0mm 14-lead VFLGA package.

http://www.st.com

> Read More

GNSS receiver is tailored for automotive applications

Fri, Apr 21, 2023

The u-blox ZED-F9L is an L1/L5 GNSS receiver module, designed for automotive, telematics, V2X (vehicle to everything) and navigation applications.

It has integrated dead reckoning technology, six-axis IMU (inertial measurement unit), multiple outputs and robust automotive grade hardware (AEC-Q104) for automotive designs that demand top-tier performance and seamless integration, said u-blox.

The ZED-F9L leverages L1/L5 band signals and six satellite constellations simultaneously, including NavIC. The receiver provides continuous sub-meter-level positioning accuracy, using algorithms to combine GNSS measurements, IMU data, wheel ticks, and vehicle dynamics for positioning and attitude data, even when GNSS services are unavailable, u-blox added. The receiver also has a 50Hz output rate with low latency for real-time applications.

Operating temperature is up to 105 degrees C, for use in telematic control units (TCUs) under the roof or smart antennas and motorbike applications. Security features include anti-jamming and sensor-based anti-spoofing techniques.

The ZED-F9L module is pin-to-pin compatible with the ZED-F9K module, offering an upgrade path to RTK (real time kinetic) technology.

u-blox specialises in positioning and wireless communication in automotive, industrial, and consumer markets. The company’s products and services let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules, and secure data services and connectivity for customers to develop innovative and reliable solutions for the IoT quickly and cost-effectively. The company has headquarters in Thalwil, Switzerland and offices in Europe, Asia, and the USA.

http://www.u-blox.com

> Read More

Texas Instruments makes Wi-Fi technology more robust and affordable for connected IoT applications

Wed, Apr 19, 2023

Texas Instruments (TI) has introduced a SimpleLink family of Wi-Fi 6 companion integrated circuits (ICs) to help designers implement reliable, secure and efficient Wi-Fi connections at an affordable price for applications that operate in high-density or high-temperature environments up to 105 degrees C.

The first products in TI’s CC33xx family include devices for Wi-Fi 6 only or for Wi-Fi 6 and Bluetooth Low Energy 5.3 connectivity in a single IC. When attached to a microcontroller (MCU) or processor, the CC33xx devices are said to enable a secure Internet of Things (IoT) connection with reliable radio-frequency (RF) performance in broad industrial markets such as grid infrastructure, medical and building automation.

Building on TI’s growing wireless connectivity portfolio, the SimpleLink CC3300 Wi-Fi 6 companion IC and CC3301 Wi-Fi 6 and Bluetooth Low Energy 5.3 companion IC start at US$1.60. The 2.4-GHz CC33xx devices are claimed to provide greater Wi-Fi network efficiency and a stable connection across more than 230 access points, while operating at temperatures from –40 degrees C to 105 degrees C. The devices also allow designers to connect their IoT edge nodes directly to home or enterprise access points without additional equipment.

The Wi-Fi 6 companion devices feature orthogonal frequency division multiple access (OFDMA) technology and basic service set (BSS) colouring to deliver fast and consistent network performance and connect more devices simultaneously, without interference from congestion. The devices support Wi-Fi Protected Access (WPA) security features, including the latest WPA3 cryptographic technologies for personal and enterprise networks and a secure boot feature with firmware authentication.

SimpleLink CC3300 and CC3301 Wi-Fi 6 companion ICs easily attach to TI and many other companies’ MCUs and processors that support Linux or real-time operating systems (RTOS). For example, CC33xx products easily attach to artificial intelligence (AI)-capable processors such as TI’s AM62A Arm Cortex-based vision processors, used in edge AI applications such as smart appliances and security cameras to reliably connect smart Wi-Fi-enabled devices to the cloud.

Industrial design engineers can incorporate TI’s CC3300 with host MCUs such as TI’s 2.4-GHz CC2652R7 SimpleLink multiprotocol wireless MCU or an AM243x MCU-hosted system to enable greater IoT flexibility with Wi-Fi 6, Bluetooth LE 5.3, Thread, Zigbee 3.0 and Matter protocols.

Samples of the CC33xx companion ICs are available in a quad flat no-lead (QFN) package and start at US$1.60 in 1,000-unit quantities. A new, easy-to-use BP-CC3301 evaluation board is available for purchase for US$39. Volume production for the CC3300 and CC3301 is expected in the fourth quarter of 2023. TI is also developing pin-to-pin compatible, dual-band 2.4- and 5-GHz Wi-Fi 6 devices that will be available as samples later this year.

https://www.TI.com

> Read More

Ryzen Embedded 5000 processors secures ‘always on’ NAS systems

Dedicated software library accompanies MEMS inertial sensing module

GNSS receiver is tailored for automotive applications

Texas Instruments makes Wi-Fi technology more robust and affordable for connected IoT applications

About Smart Cities