ST’s second generation industry 4.0 edge AI processors are SESIP 3-certified

STMicroelectronics has introduced its second generation of industry 4.0-ready edge AI powered microprocessors, the STM32MP2 series of 64-bit microprocessors. They are supplied with SESIP Level 3 certification, industrial-application-ready interfaces and dedicated edge AI acceleration. 

The second generation of STM32 microprocessors are based on a new architecture built upon the same ecosystem and raising performance and security for applications at the industrial and IoT edge. 

They also integrate advanced security features in hardware ensuring SESIP Level 3 certification with Arm’s TrustZone architecture and resource isolation framework (RIF). There is also secure key storage, secure boot, device ID in one-time programmable (OTP) memory, hardware cryptographic engines, and on-the-fly DDR encryption / decryption. 

The 64-bit microprocessors are suitable for emerging opportunities in secure Industry 4.0, IoT, and rich user-interface applications, said the company.

The first product in this new generation, the STM32MP25, is available with single or dual 64-bit Arm Cortex-A35 cores running at 1.5GHz, complemented with a 400MHz Cortex-M33 embedded core for real-time processing. A dedicated neural processing unit adds up to 1.35TOPS (tera-operations per second) computing performance optimised for edge AI acceleration in applications such as advanced machine vision and predictive maintenance, said ST. There is also support for 32-bit DDR4 and LPDDR4 memories.

The processors also feature Gigabit time sensitive networking (TSN) support and a two-port Gigabit Ethernet TSN switch, with PCIe, USB 3.0 and CAN-FD peripherals for connectivity required for real-time industrial applications, data concentrators and gateways, and communication equipment. According to ST, the combined processing and networking capabilities enhance detection and feature recognition for security applications and industrial automation. For example, said ST, the processor can acquire video from a 5Mpixel sensor at 30 frames per second (fps), perform analytics with the edge AI accelerator, and send relevant video (encoding with an HW encoder) with detection metadata leveraging Gigabit Ethernet TSN, all in real-time streaming mode.

A 3D graphics processing unit (GPU) with 1080p resolution for graphics and video capabilities permits rich user interfaces, with support including Vulkan real-time graphics for Android applications. A1080p encoder/decoder and multiple display connections including LVDS, four-lane MIPI DSI and a MIPI CSI-2 camera interface are included to simplify connecting displays and digital cameras including raw-Bayer image sensors.

The STM32 microprocessors are specified over the extended temperature range from -40 to +125 degrees C, easing thermal management and enhancing reliability in industrial environments, said ST. The STM32MP2-series microprocessors are supplied with ST’s 10-year longevity commitment. 

Package options include a 0.8mm-pitch chip-scale package (TFBGA). This helps ease PCB design routing, said ST, and allows economical designs down to four layers avoiding costly laser vias.

The STM32MPU ecosystem contains the OpenSTLinux distribution that includes the complete AI framework (X-Linux-AI), as well as the STM32Cube development tools. The STM32Cube firmware will run bare metal or RTOS on the Cortex-M33 embedded core.

ST is now delivering samples of STM32MP25 devices along with evaluation boards to select OEM customers. Volume production of chips and boards is scheduled to begin in the first half of 2024. 

http://www.st.com 

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Advantech’s edge computer is based on Nvidia L4 GPU for industrial AI

The MIC-770 V3 has been developed by Advantech with the Nvidia L4 Tensor Core GPU as a compact, modular, industrial computer for factory automation, autonomous vehicles and automated optical inspection.

The modular industrial PC with MIC-75M20 expansion i-Module is compatible with the Nvidia L4 Tensor Core GPU which has 7,424 CUDA cores and 24Gbyte GDDR6 GPU memory. In addition it delivers 30.3TFLOs and consumes only 72W of power. The compact, scalable PC design, paired with the efficiency of the Nvidia L4 GPU can exploit AIoT (artificial intelligence of things) for diverse deep learning and edge inference applications in factory automation, autonomous vehicles, automated optical inspection (AOI) and AI prediction in medical equipment, as well as smart city video surveillance and transportation.

Other features include the use of 12th Gen Intel Core i9 / i7 / i5 / i3 processors (LGA 1700) and support for Advantech’s iBMC 1.2 remote management on WISE-DeviceOn.

The MIC-770 V3 is designed as an open source x86 platform capable of enabling the quick development of GPU-accelerated solutions. It uses MIC-75M20, a two-slot expansion i-Module, to create an integrated PC that is compatible with the Nvidia L4 Tensor Core GPU for AI-based edge computing and inference. It delivers energy-efficient universal acceleration for AI inference, video, and graphics applications and is suitable for global deployment in enterprise, cloud, and edge applications with limited space.

The MIC-770 V3’s modular design delivers enhanced functionality and flexibility for PCIe expansion via Advantech i-Modules and Flex I/O in the front panel. Adding a PCIE-1674 vision frame grabber card enables the connection of four cameras when used in autonomous vehicles, advised Advantech. Adding four GbE Flex I/O (98910770301) enables this controller to connect to lidar systems, thus enabling it to detect distances and shapes in its environment then pass on data to the Nvidia L4 GPU for the rendering of 3D models based on graphics analysis.

Operating temperature range is 0 to 40 degrees C. A dedicated server-grade air duct design improves the thermal management of the GPU, said Advantech and maintains a GPU IC operating temperature below 70.5 degrees C in environmental conditions up to 40 degrees C to deliver clock frequency residency. 

The Advantech MIC-770 V3 compact industrial computer (with MIC-75M20 i-Module) is available for order now. 

http://www.advantech.com/en-eu 

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Hyperlux family claims to boost performance, speed and features of automotive image sensors

With a 2.1 Microm pixel size, 150dB high dynamic range (HDR) and LED flicker mitigation (LFM) across the full automotive temperature range, the onsemi Hyperlux family is claimed to provide high performance, speed and advanced features to propel the next generation of Advanced Driver Assistance Systems (ADAS) forward. It also enables a smooth transition to Level 2+ driving automation, which requires the driver to take over only when alerted by the technology. 

The Hyperlux family spans products with resolutions from 3 megapixel (MP) to 8MP and higher, catering to both sensing and viewing camera applications. With an HDR of 150dB, it claims to capture high quality images under extreme lighting conditions without sacrificing lowlight sensitivity. The LFM capability of the platform ensures that pulsed light sources do not appear to flicker and thereby avoids flicker-induced machine vision issues. 

The simultaneous HDR and LFM capabilities ensure that the potential hazard can be identified in either very dark or bright scenes, critical to ADAS and in-cabin applications, said the intelligent driving sensor business unit at Desay SV. With the new Hyperlux technology, automotive OEMs and tier ones can expect proven high performance in all operating conditions to accelerate more advanced safety and convenience features, it added.

The Hyperlux product family claims to boast the industry’s lowest power consumption and smallest footprint. By using up to 30% less power and having an up to 28 per cent smaller footprint than competing devices, the automotive image sensors are claimed to deliver energy-efficient designs with the lowest system material cost. As more electronic content, including image sensors, is added to cars,  the content needs to be as small as possible to fit in existing designs while not disrupting the internal and external style of the vehicle.

As vehicles become more connected and move closer to autonomy, the importance of safety and security is more critical than ever, said onsemi. It claimed its knowledge of automotive applications and trends, along with its engineering expertise in image sensing, enables its customers to develop next-generation products that bring it closer to the Vision Zero initiative, a strategy to eliminate all traffic fatalities and severe injuries.

Hyperlux is designed to meet the safety requirements of Automotive Safety Integrity Level D (ASIL D) systems, while integrated security gives the highest coverage to cybersecurity threats. These sensors also offer a dual output stream at differing resolutions, allowing sensing and other functions to be performed simultaneously. Designers can benefit from the flexible architecture for the use of a single camera for multiple functions, reducing design time, risk and cost. 

The first two sensors of the Hyperlux product family, AR0823AT and AR0341AT, are now sampling. 

Onsemi will be exhibiting at AutoSens Detroit, 9-11 May 2023. 

https://www.onsemi.com

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Motor drive inverter supports 14V to 80V input DC voltage

EPC’s EPC9186 supports a wide input DC voltage ranging from 14V to 80V. The high-power capability of the EPC9186 supports applications such as electric scooters, small electric vehicles, agricultural machinery, forklifts and high-power drones.

The three-phase BLDC motor drive inverter uses the EPC2302 eGaN fet and four EPC2302 fets in parallel per switch position. It can deliver up to 200Apk maximum output current. 

The EPC9186 contains all the necessary critical function circuits to support a complete motor drive inverter, including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The boards can be configured for multiphase DC–DC conversion and support both phase and leg shunt current sensing.  

According to the company, the major benefits of a GaN-based motor drive are exhibited with this reference design, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, lower torque ripple for improved precision and lower filtering for lower cost.  

EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that is claimed to reduce design cycle times.

GaN-based inverters increase motor efficiency and can increase power capability without increasing size, claimed EPC. This enables motor systems that are smaller, lighter, less noisy, have more torque, more range, and greater precision for a wide range of consumer and industrial applications, it added.

The EPC9186 reference design board is priced at $900.00 and is available from Digi-Key.

Designers interested in replacing their silicon mosfets with a GaN solution can use the EPC GaN Power Bench’s cross-reference tool to find a suggested replacement based on their operating conditions.

EPC claims to be the leader in enhancement mode gallium nitride (eGaN) based power management. eGaN fets and integrated circuits are claimed to provide performance many times greater than the best silicon power mosfets in applications such as DC-DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, drones and low-cost satellites.

https://www.epc-co.com

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