AAEON compact industrial AI system with enhanced expansion options

AAEON has released the GENESYSM-MTH6, a slim SubCompact System powered by Intel Core Ultra processors Series 1 (formerly Meteor Lake).

Measuring just 190mm x 134.1mm x 43mm and with both wall and VESA mounting options, the GENESYSM-MTH6 appears well-suited to act as a compact edge AI system for industrial setups. However, given the presence of three LAN ports for peripheral camera support, AAEON have noted it has the specifications necessary to operate as part of AI-assisted surveillance applications.

Differentiating itself from previous AAEON SubCompact Systems is the GENESYSM-MTH6’s inclusion of the PER-SB2B expansion module as part of the product’s BOM. The module, which was offered as an optional accessory for the board-level GENE-MTH6, will be included by default for the GENESYSM-MTH6.

This module provides a substantial boost to the expansion options available, providing the system with two M.2 2280 M-Key slots for high-speed storage or AI acceleration, while maintaining an additional M.2 2280 M-Key on the system’s motherboard. Other expansion options include an M.2 3052 B-Key and M.2 2230 E-Key, which allow for the installation of 5G and Wi-Fi 6E CNVi modules, respectively.

The GENESYSM-MTH6 has a robust I/O that lends itself to industrial use, including three RJ-45 LAN, two of which run at 2.5GbE and one at 1GbE. AAEON notes that Intel vPro and PXE support is available on the system’s two 2.5GbE ports on SKUs featuring select processors from the Intel® Core Ultra processors (Series 1) range. Rounding off its I/O, the GENESYSM-MTH6 offers two COM ports for RS-232/422/485, two USB 3.2 Gen 2, a GPIO 8-bit, and a choice of SMBus or I2C.

Environmental resilience reinforces the GENESYSM-MTH6’s credibility for industrial deployment, with a 9V to 36V power input range with ERP support alongside a -10°C to 50°C operating temperature range.

 

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Taoglas expands compact chip antenna range for Wi-Fi 6/7, UWB and ISM applications

Taoglas has announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimised for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 are designed for next-generation IoT, consumer, industrial, and wearable applications.

Built on Taoglas’ LTCC technology, the new chip antennas combine high radiation efficiency and frequency stability, ensuring consistent performance even in densely integrated, multi-radio designs. Each antenna supports automated pick-and-place SMT integration and is supplied in tape and reel format, simplifying assembly and enabling high-volume production.

The Taoglas ILA.257 is a compact, high-performance LTCC antenna designed for Wi-Fi 6 and Wi-Fi 7 applications. It supports tri-band operation across the 2.4 GHz, 5.8 GHz, and 7.125 GHz frequency ranges, providing full coverage for the latest and emerging wireless standards, including Wi-Fi 6E and beyond. Measuring just 3.2 × 1.6 × 0.5 mm, it offers radiation efficiency and stable signal integrity across all bands, even in high-frequency regions where many chip antennas suffer degradation. The ILA.257’s small footprint, minimal keep-out area, and low profile make it ideal for ultra-compact devices such as wearables, portable consumer electronics, and industrial IoT modules.

The Taoglas ILA.68 has been engineered specifically for UWB applications across the 6 GHz to 8.5 GHz spectrum. With dimensions of just 3.2 × 1.6 × 1.1 mm, it delivers a stable omnidirectional radiation pattern, excellent repeatability, and low insertion loss across temperature and frequency variations. The ILA.68 supports a broad range of applications, including precision indoor positioning, secure access control, and short-range radar. Its performance-to-size ratio makes it particularly well-suited for automotive sensors, smart home systems, and miniaturised IoT devices that demand reliable UWB connectivity within the smallest possible form factor.

The Taoglas ILA.89 is a high-efficiency LTCC chip antenna designed for operation within the 868 MHz and 915 MHz ISM bands. Supporting both European and US frequency allocations, it enables global deployment of devices using LPWAN and LoRa technologies. The antenna achieves up to 47.9% radiation efficiency and a peak gain of 0.56 dBi within a compact 4.0 × 12.0 × 1.6 mm footprint, making it ideal for small, battery-powered IoT products with limited PCB real estate. The ILA.89’s simple layout requirements and region-specific variants reduce design complexity and time-to-market while lowering total cost of ownership for OEMs.

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Infineon PSOC Edge MCUs for robotics, industrial, and smart home applications

Mouser is now shipping the new PSOC Edge machine learning microcontrollers (MCUs) from Infineon Technologies. The PSOC Edge is Infineon’s enhanced and advanced high-performance machine learning (ML) MCU for next-generation devices in smart home, robotics, industrial, and human-machine interface (HMI) applications.

The Infineon PSOC Edge MCUs are designed for a new generation of responsive, user-centric machine learning-based edge devices, with hardware-accelerated neural net compute support for continuous low-power, high-performance operation in a fully integrated microcontroller. These MCUs integrate Arm Cortex-M55 processors and M33 coprocessors. These devices are enhanced with Infineon’s NNLite accelerator, right-sized peripherals, state-of-the-art security, and support for Helium DSP and Arm Ethos-U55 integration, making them “always-on” IoT and industrial applications. The PSOC Edge series is supported by a rich set of enablement features, including industry-recognised ModusToolbox software, DEEPCRAFT Studio AI with off-the-shelf DEEPCRAFT-ready models and graphics, as well as support for voice, audio, and vision, enabling easy migration and upgrades from current designs.

Mouser offers two different development kits for the PSOC Edge. The KITPSE84AITOBO1 PSOC Edge E84 AI evaluation kit utilises the versatile PSOC Edge E84 MCU, which features a hardware platform designed for ML and Edge AI. The kit is optimised for rapid prototyping and development of embedded systems utilising Infineon’s ML platform DEEPCRAFT Studio, with ML models and other software products. The Infineon KITPSE84EVALTOBO1 PSOC Edge E84 kit, offers the PSOC Edge E84 MCU on a detachable SODIMM-based system-on-module (SOM) board, along with an AIROC Wi-Fi and Bluetooth combo-based connectivity module. The carrier board includes multiple onboard multimedia connectivity features, including custom MIPI-DSI displays, audio interfaces, and more. Arduino and mikroBUS-compatible headers enable easy expansion.

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Nordic Semi launches Wi-Fi 6 board to speed nRF54L IoT development

Nordic Semiconductor has announced the availability of the nRF7002 Expansion Board II (nRF7002 EBII). The nRF7002 EBII plug-in board adds Wi-Fi 6 capabilities to Nordic’s nRF54L Series Development Kits (DKs), enabling developers to create high performance, energy-efficient, Wi-Fi 6-enabled IoT solutions.

Based on Nordic’s nRF7002 Wi-Fi Companion IC, the nRF7002 EBII allows product developers using Nordic’s nRF54L Series multiprotocol SoCs to bring the benefits of Wi-Fi 6—including power efficiency gains for battery-powered Wi-Fi operation, and management of large IoT networks—to a wide range of IoT applications. Typical use cases include smart home and Matter-enabled devices, industrial sensors and smart city infrastructure, as well as wearables and medical devices.

The nRF7002 EBII accelerates Wi-Fi 6 development by providing seamless hardware and software integration with the nRF54L15, and nRF54LM20 DKs, enabling developers to build advanced connected multiprotocol applications while leveraging Nordic’s expertise in low power wireless technology.

The nRF7002 EBII supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and advanced Wi-Fi 6 features such as Target Wake Time (TWT), OFDMA and BSS Coloring, enabling efficient, interference-free, battery-powered operation. It features a dual-band chip antenna ensuring robust connectivity across Wi-Fi bands. The onboard nRF7002 companion IC offers Wi-Fi 6 compliance, as well as backward compatibility with 802.11a/b/g/n/ac Wi-Fi standards. It supports both STA and SoftAP operation modes for flexible network configuration.

The nRF7002 EBII is designed for easy integration with nRF54L Series Development Kits via a dedicated expansion header. Developers can also leverage SPI or QSPI interfaces for flexible host communication and use integrated headers for power profiling, making the board ideal for energy-constrained designs.

The nRF7002 EBII is fully supported in the nRF Connect SDK, Nordic’s unified and flexible software development kit. The nRF Connect SDK provides developers with a streamlined workflow and example code for rapid prototyping and accelerated product development.

nordicsemi.com

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