The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.
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New industrial CoolSiC MOSFETs from Infineon offer improved power density
Infineon Technologies is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.
These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.
The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.
The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.
The CoolSiC MOSFETs 650 V G2 in TOLL are now available in R DS(on) from 10 to 60 mΩ, while the Q-DPAK variant is available in 7, 10, 15 and 20 mΩ.
ST’s new Edge AI, NPU-accelerated microcontrollers now available from Mouser
Mouser is now shipping the new STM32N6 high-performance microcontroller from STMicroelectronics. The STM32N6 is the newest and most powerful of the STM32 family, optimised for edge-intensive AI algorithms in automotive, smart industry, robotics, drones, healthcare, smart buildings, smart homes, smart farming, and personal electronic applications.
STMicroelectronics STM32N6 MCU is the first of the STM32 series featuring ST’s proprietary Neural-ART Accelerator, specifically architected for embedded inference, delivering 600 times more machine-learning performance than existing high-end STM32 MCUs. The STM32N6’s Neural-ART Accelerator clocks at 1GHz, providing 600 giga-operations per second (GOPS) at an average of 3 tera-operations per second (TOPS), delivering energy efficiency while allowing machine learning applications requiring an accelerated microprocessor to now run on an MCU.
The STM32N6’s machine learning performance makes it possible to run computer vision, audio processing and sound analysis for consumer and industrial applications at the edge, utilising a Cortex-M55 MCU running at 800 MHz, a robust 4.2 MB embedded RAM that also includes a NeoChrom GPU alongside an H.264 hardware encoder, and a Helium™ M-Profile Vector Extension. The STM32N6 delivers remarkable AI performance and provides excellent flexibility in a small silicon package ideal for embedded systems and wearables.
The STM32N6 is supported by the STM32N6570-DK discovery kit. The kit is a complete demonstration and development platform for the STM32N6 and provides a full range of hardware features to enable users to evaluate the device. The kit includes USB Type-C, Octo SPI flash memory and Hexadeca SPI PSRAM devices, Ethernet connectivity, a camera module, a 5″ LCD touchscreen, and more. Four flexible extension connectors offer easy expansion capabilities for applications such as wireless connectivity, analog applications, and sensors.
NVIDIA Jetson Orin Nano “Super” now available on the Advantech EPC-R7300 Edge AI Box PC
Advantech has announced the release of its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB system-on-module. Leveraging the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance with ultra-low power consumption (25 watts). Its ultra-compact design (152×173×50 mm) and Ubuntu OS readiness facilitate seamless AI deployment, making it ideal for next-generation applications such as small Large Language Models (LLMs), Vision-Language Models (VLMs), and Vision Transformers (ViTs).
The EPC-R7300 Orin Nano Super, coupled with Jetpack 6.2, introduces advancements in AI performance, making it an ideal platform for deploying small LLMs, VLMs, and ViTs. With enhanced GPU, CPU, and memory capabilities, the Orin Nano Super efficiently supports models with fewer than 10 billion parameters, enabling tasks such as natural language understanding and generation directly on embedded devices. This capability supports diverse embedded applications such as conversational AI in robotics, voice interfaces for IoT, real-time translation, retail analytics, and industrial data and vision processing. By supporting small-scale LLMs, VLMs, and ViTs, the Jetson Orin Nano Super provides developers with a powerful, efficient, and privacy-focused solution, enabling real-time embedded intelligence across industries.
Advantech’s EPC-R7300 industrial-grade AI Box PC is engineered to meet the diverse computing needs of developers with its versatile I/O features, including RS-485, CAN bus, and multiple Ethernet ports. Supported by NVIDIA JetPack, the EPC-R7300 ensures a seamless migration from NVIDIA’s development ecosystem and simplifies integration by automatically enabling I/Os without requiring additional driver installations or configurations. For edge AI applications such as image inferencing, which demand high-quality camera inputs, the EPC-R7300 supports both USB and IP camera interfaces, making it ideal for vision-based systems. Additionally, it offers 4K resolution displays via its HDMI 2.0 port, while ensuring reliable data connectivity with 2 x GbE LAN ports. To expand functionality, the EPC-R7300 includes 2 x USB 3.2 Gen 1 ports, 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key: Supports Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key: Enables 4G/5G connectivity, 1 x 2280 M-Key: Comes pre-installed with a 128GB NVMe SSD, with additional expansion capability). With its robust features and ease of integration, the EPC-R7300 is a powerful and flexible solution for developers building next-generation edge AI systems.
The EPC-R7300 Orin Nano Super AI Box PC is engineered for durability in harsh industrial environments, supporting a wide operating temperature range (-20 ~ 60ºC / -4 ~ 140ºF), wide power input range (9 ~ 36 VDC), and high vibration tolerance (3.0 Grms). This rugged design enables users to quickly prototype field-side applications, streamlining the development process and minimising the time and resources required for system integration, verification, and transformation into a ready-to-use edge AI solution.
Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA Jetpack 6.2, making the EPC-R7300 capable of delivering excellent functionality without additional integration work.
The EPC-R7300 with NVIDIA Jetson Orin Nano Super support will be available starting Q1 2025.
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