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u-blox bases two GNSS positioning modules on F9

Mon, Jun 12, 2023

Two GNSS positioning modules, the NEO-F9P for industrial machinery and the ZED-F9P-15B for mobile robotics, have been introduced by u-blox.

Both are based on the company’s F9 platform. The low-power NEO-F9P supports navigation and automation of moving industrial machinery and the ZED-F9P-15B provides customers in the mobile robotics market with an L1/L5 option in addition to the L1/L2 bands.

The u-blox NEO-F9P GNSS module features include concurrent reception of GPS, Galileo and BeiDou, multi-band L1/L5 RTK and short convergence times. It delivers centimetre-level accuracy in seconds and comes in the smallest form factor for a high-precision module, said u-blox. It is 50 per cent smaller than the regular u-blox ZED.

The small size, coupled with very low power consumption and ANN-MB1 antenna compatibility, makes the u-blox NEO-F9P suitable for navigation and automation in smart antennas, UAVs (unmanned aerial vehicles) and mobile robotics. It supports open as well as standards-based correction services for enhanced performance, such as the u-blox PointPerfect GNSS augmentation service.

The modules are the company’s response to the increased requirement for precise navigation and automation in industrial applications, particularly in the UAV and mobile robotics sectors, commented Alex Ngi, product manager, industrial navigation and robotics at u-blox. “By delivering centimeter-level accuracy in a compact and energy-efficient module, the NEO-F9P, u-blox proven RTK engine, is ideal for space-constrained designs,” he added.

The NEO-F9P offers customers an effective upgrade path from the u-blox NEO-M8P model and the ZED-F9P-15B provides existing ZED customers with an L1/L5 alternative to L1/L2.

u-blox specialises in positioning and wireless communication in automotive, industrial and consumer markets, providing services and products which let people, vehicles and machines determine their precise position and communicate wirelessly over cellular and short range networks. The company’s portfolio include chips, modules and secure data services and connectivity to empower customers to develop innovative and reliable solutions for the IoT.

The company is headquartered in Thalwil, Switzerland and has offices in Europe, Asia, and the USA.

http://www.u-blox.com

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Green Hills Software supports Imagination’s RISC-V CPUs

Fri, Jun 09, 2023

At AutoTech Detroit this week, Imagination Technologies will be demonstrating Green Hills’ µ-velOSity running on its RISC-V CPUs’ RISC-V Catapult CPUs. The two companies have announced a partnership in which Green Hills’ µ-velOSity RTOS will support Imagination Technologies’ CPUs to accelerate real-time safety and security in automotive and industrial designs.

This partnership will extend support to Imagination’s Catapult CPU family roadmap in the future, confirmed the two companies.

The µ-velOSity RTOS is the smallest of Green Hills Software’s family of real time operating systems. It has been updated and optimised to support the RISC-V architecture and has been certified to meet industry standards for functional safety and security. It offers seamless integration with the safety-certified Green Hills MULTI integrated development environment (IDE) and C/C++ compilers, in order to make it easy for developers to learn and use to create high performance, small footprint designs for automotive, industrial, and IoT applications.

“We have a long-standing relationship with Imagination and are thrilled to extend our support to the company’s RISC-V CPUs,” said Dan Mender, vice president of business development at Green Hills Software. “The adoption of the RISC-V instruction set architecture is increasing rapidly in countless markets, particularly in IoT, industrial, and embedded applications. By using Imagination’s Catapult family and our µ-velOSity RTOS, advanced debugger and optimising C/C++ compilers, customers can efficiently create and confidently deploy safety- and security-critical RISC-V applications,” he added.

Catapult is Imagination’s RISC-V product line designed from the ground up for deployment and is configurable for use in a variety of markets, said the company.

Imagination’s RISC-V real-time CPUs can be integrated into complex SoCs for applications as wide ranging as networking, packet management, storage controllers and sensor management for AI cameras and smart metering. The company also provides GPU and AI accelerator IP and confirmed it will be expanding its RISC-V CPU product line with more applications-focused solutions in the future. All Imagination GPUs are compatible with RISC-V SoCs.

Imagination will be demonstrating Green Hills’ µ-velOSity running on Imagination’s RISC-V CPUs at AutoTech Detroit (7 to 8 June) at Booth 827.

https://www.imaginationtech.com

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iWave bases SoM on i.MX 91

Thu, Jun 08, 2023

Designed for secure and reliable Linux edge processing, the solderable NXP i.MX 91-based LGA system on module (SoM) has been added to the iW-RainboW-G50M family by iWave.

The SoM incorporates the newest member of the i.MX 9 applications processor series and is built on the OSM v1.1 solderable SoM standard. The rugged, compact form factor also offers extensive interfaces, said iWave.

Evaluation kits of the SoM will be ready to purchase this month.

The i.MX 91 SoC combines security, performance and scalability. It can operate as a foundation block for cost-optimised Linux edge devices, said iWave. The i.MX 91 family features an Arm Cortex-A55 running at up to 1.4GHz and an integrated EdgeLock Secure Enclave. There are also dual Gigabit Ethernet, dual USB ports interfaces and essential I/O to fit in products used in smart factory, smart home, medical devices and smart metering.

In addition to the NXP i.MX 91 SoC, the SoM integrates 2Gbyte LPDDR4 RAM, 16Gbyte eMMC flash, two 1Gbit per second Ethernet controllers (one with TSN or time sensitive networking), one 4bit SD, one USB 2.0 OTG, four USB 4.0 host Wi-Fi 6 and Bluetooth 5.3 and IEEE802.15.4 connectivity.

The SoM is in a size-L form factor with dimensions of 45 x 45mm. The solderable LGA package is certified to the OSM v1.1 standard with provision for 662 contact, offering high pin to area ration across the SoM, said iWave. It is part of the company’s 10 years’ product longevity programme.

It is possible to directly solder the SoM onto the carrier card to ensure high levels of robustness for products prone to vibrations, including electric vehicle charging stations, industrial gateways and human machine interface (HMI) displays.

The i.MX 9x family of i.MX 91 and i.MX 93 provides customers scalability with reduced development cost and time to market and provides consumers with efficient power management and advanced security features on the edge, added the company.

The i.MX 91-based system on module is integrated on a carrier board, which is positioned as a single board computer (SBC) and also doubles up as an evaluation kit. The production-ready SBC is built on a Pico-ITX form factor and integrates the necessary interfaces for applications such as smart home hubs, metering gateways, and industrial automation solutions.

The SBC is characterised by the NXP i.MX 91 SoC, 2Gbyte LPDDR4 RAM, 16Gbyte eMMC, Wi-Fi 6, Bluetooth 5.3 and IEEE802.15.4 connectivity. There is also a GNSS receiver module (GPS / GLONASS / Galileo / BeiDou), dual 1000/100/10Mbits per second Ethernet, one USB 2.0 OTG (microAB receptacle connector), a dual USB 2.0 host (TypeA) and one each USB header and USB Type-C connector. There is also a micro SD, 3.5mm audio in and out jack through I2S codec, an M.2 connector Key B, expansion connector (UART, CAN, ADC, Tamper, PWM) and one RS232 header.

The SoM and SBC are production ready, with all documentation, necessary software drivers and board support package available for customers.

http://www.iwavesystems.com

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Topside cooling creates thinner, lighter 5G radio units

Wed, Jun 07, 2023

Topside cooled RF amplifier modules have been developed by NXP Semiconductors and based on packaging designed to enable thinner and lighter radios for 5G infrastructure.

Smaller base stations can be more easily and cost-effectively installed, increasing network density, while being able to blend more discretely into their environment, said NXP. Its GaN multi-chip module series, combined with what is claimed to be the industry’s first topside cooling for RF power, helps to reduce not only the thickness and weight of the radio by more than 20 per cent, but also the carbon footprint for the manufacture and deployment of 5G base stations.

“Top-side cooling represents a significant opportunity for the wireless infrastructure industry, combining high power capabilities with advanced thermal performance to enable a smaller RF subsystem,” said Pierre Piel, vice president and general manager for radio power at NXP.

Benefits afforded by NXP’s topside cooled devices are the removal of the dedicated RF shield, use of cost-effective and streamlined PCBs and separation of thermal management from RF design. These features help networking solution providers create slimmer and lighter 5G radios for mobile network operators, while reducing their overall design cycle, NXP added.

NXP’s first topside cooled RF power module series is designed for 32T32R, 200W radios covering 3.3 to 3.8GHz. The devices combine the company’s in-house LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31dB gain and 46 per cent efficiency over 400MHz of instantaneous bandwidth.

The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC modules are available today. The A5M36TG140-TC will be supported by NXP’s RapidRF reference board series.

NXP Semiconductors specialises in secure connectivity solutions for embedded applications in the automotive, industrial and IoT, mobile and communications infrastructure markets while advancing a more sustainable future. The company has over 60 years of combined experience and expertise and operates in more than 30 countries.

http://www.nxp.com

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u-blox bases two GNSS positioning modules on F9

Green Hills Software supports Imagination’s RISC-V CPUs

iWave bases SoM on i.MX 91

Topside cooling creates thinner, lighter 5G radio units

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