Customisable RISC-V Vector Unit is largest available, says Semidynamics 

At up to 2048bits of computation per cycle, Semidynamics says that its customisable Vector Unit is the largest available in the RISC-V market today, offering “unprecedented data handling”.

At the RISC-V Summit Europe 2023 (05 to 09 June) in Barcelona, Semidynamics highlights the customisable vector unit to accompany the company’s customisable 64-bit RISC-V cores. The Vector Unit complies with the RISC-V Vector Specification 1.0 and has additional, customisable features to enhance data handling capabilities. Semidynamics claimed that together they “set a new standard for data handling both in terms of unprecedented speed and volume”.

The company has taken the same approach with the Vector Unit as for its Atrevido core, which is not just configurable from a set of option but can be opened up and the inner workings changed to add features or special instructions to create a totally bespoke solution.

A Vector Unit is composed of several ‘vector cores’, roughly equivalent to a GPU core, that perform multiple calculations in parallel. Each vector core has arithmetic units capable of performing addition, subtraction, fused multiply-add, division, square root, and logic operations. Semidynamics’ vector core can be tailored to support different data types: FP64, FP32, FP16, BF16, INT64, INT32, INT16 or INT8, depending on the customer’s target application domain. The largest data type size in bits defines the vector core width or ELEN. Customers select the number of vector cores to be implemented within the Vector Unit, either four, eight, 16 or 32 cores, catering for a wide range of power performance area (PPA) trade-off options. Once these choices are made, the total Vector Unit data path width or DLEN is ELEN multiplied by the number of vector cores. Semidynamics supports DLEN configurations from 128b to 2048bits.

Semidynamics has equipped its Vector Unit with a high performance, cross vector core network that provides all-to-all connectivity between the vector cores at high bandwidth, even for the very large, 32-vector core option. The cross vector core unit is used for specific instructions in the RISC-V standard that shuffle data between the different vector cores, such as vrgather or vslide.

A second choice is the number of bits of each vector register (VLEN) which can also be tailored to customer’s needs. Most vendors assume that VLEN is equal to DLEN (i.e., 1X ratio), Semidynamics offers 2X, 4X and 8X ratios. When the VLEN is larger than the DLEN, a vector operation uses multiple cycles to execute. This allows the Vector Unit to tolerate large memory latencies and reduce power. For example, when VLEN=2048 and DLEN=512, each vector arithmetic operation will take four clocks to execute. As a result, the Vector Unit can process “unprecedented amounts of data bits” and fetch all this data from memory. Semidynamics’ Gazzillion technology can handle up to 128 simultaneous requests for data and track them back to the correct place in whatever order they are returned. This level of fast handling of big data is expected to be beneficial in application areas such as HPC (high performance computing) application areas such as video processing, AI and ML.

If required, Semidynamics can do Open Core Surgery on cores and Vector Units to provide special interfaces and protocols to a customer’s proprietary IP block.

Founded in 2016 and based in Barcelona, Spain, Semidynamics provides fully customisable RISC-V processor IP and specialises in high bandwidth, high performance cores with vector units targeted at ML and AI applications. The company is privately owned and is a strategic member of the RISC-V Alliance.

http://www.semidynamics.com 

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STMicro packages MEMS pressure sensor in water-resistant package

Suitable for gas and water metering equipment, weather monitoring, air conditioning, and home appliances, the ILPS28QSW is believed to be the market’s first MEMS water / liquid-proof absolute pressure sensor. It is available from STMicroelectronics and has a 10-year longevity programme for the industrial market.

“With the spread of the Industrial Internet of Things, companies are seeking to gather data from throughout their operations, often in challenging environments both indoors and outdoors,” said Simone Ferri, general manager, AMS MEMS sub-group, STMicroelectronics. The waterproof MEMS pressure sensors provide the environmental robustness needed to power digital transformation everywhere, with the long-term availability needed to protect customers’ designs, he added.

The ILPS28QSW sensor is provided in a sealed, cylindrical, surface mount package. It features a ceramic substrate that provides high resistance to liquid permeability and a robust potting gel, proven in automotive applications, to protect the internal circuitry. The lid, made from high-grade surgical steel, is sealed with an o-ring and secured with epoxy adhesive. This package design ensures an ingress protection rating of IP58 to withstand immersion in over one meter of water, certified according to IEC 60529 and ISO 20653. In addition, the sensor can sustain up to 10Bar over-pressure.

The ILPS28QSW provides absolute pressure readings, accurate to within 0.5hPa, with selectable full-scale range of 260 to 1260hPa and 260 to 4060hPa. It has a wide operating temperature range of -40 to +105 degrees C. 

The sensor also features ST’s Qvar electrostatic charge sensing channel, allowing developers to create additional value in their applications through features such as liquid leakage detection. When Qvar is combined with the pressure signal it enables monitoring of both liquid level and even the tiniest of leaks in home appliances and industrial processes.

Operating current is as low as 1.7 microA, suitable for power-conscious applications. The ILPS28QSW also integrates digital features that simplify system design and management. For example, temperature compensation, FIFO memory, and an I2C / MIPI-I3C digital communication interface are all built-in and the output data rate is selectable from 1.0Hz to 200Hz.

The ILPS28QSW is in production now.

http://www.st.com 

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Integrated, low power, single-chip LCOS panel fits into AR/XR/MR glasses

The OP03011 liquid crystal on silicon (LCoS) panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and low-power for smart glasses

The OP03011 is a single chip, 648p LCoS panel for next generation augmented reality (AR), extended reality (XR) and mixed reality (MR) glasses and head-mounted displays. The LCOS panel features 3.8 micron pixels in what is claimed to be one of the world’s smallest 0.14-inch optical formats. The low power, lightweight design is intended for next-generation glasses that can be worn 24/7, said Omnivision.

The growing interest in AR glasses has led OEMs to design more functionality into slim, fashionable designs that consume very little power and are lightweight, allowing them to be worn for long periods. The OP03011 is designed in a compact format for applications requiring a smaller field of view and lower resolution, making it well suited for some of the sleekest, most innovatively designed AR glasses, said Devang Patel, marketing director for the IoT and emerging segment, Omnivision. “The OP03011 supports applications of next-generation smart glasses, like displaying notifications in the user’s field of view and access to GPS for maps and directions directly from the glasses, so the user never needs to pull out their smartphone,” he said.

The OP03011 features 648 x 648 resolution at 120Hz and comes in a small FPCA package. It supports a single-lane MIPI-DSI interface. 

Samples are available now, and the OP03011 will be in mass production in Q4 of 2023.

Omnivision is a fabless semiconductor company that develops advanced digital imaging, analogue and touch and display solutions for multiple applications and industries, including mobile phones, security and surveillance, automotive, computing, medical, and emerging applications. 

http://www.ovt.com

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Cadence introduces tools for Arm TCS23 for a fast path to tapeout

Cadence has finetuned its RTL-to-GDS digital flow and delivered corresponding 3nm and 5nm rapid adoption kits (RAKs) for Arm Cortex-X4, Cortex-A720 and Cortex-A520 CPUs and Immortalis-G720, Mali-G720 and Mali-G620 GPUs.

This part of Cadence Design Systems’ expanding collaboration with Arm to advance mobile device silicon, providing customers with a faster path to tapeout through the use of Cadence digital and verification tools and the new Arm Total Compute Solutions 2023 (TCS23) for the cores and GPUs.

Cadence delivered comprehensive RTL-to-GDS digital flow RAKs for 3nm and 5nm nodes to help customers achieve power and performance goals using the new Arm TCS23. The Cadence tools optimised for the new Arm TCS23 include the Cadence Cerebrus Intelligent Chip Explorer, Genus Synthesis, Modus DFT software, Innovus implementation system, Quantus extraction, Tempus timing signoff and ECO Option, Voltus IC Power Integrity, conformal equivalence checking and conformal low power. Cadence Cerebrus provided Arm with AI-driven design optimisation capabilities that resulted in 50 per cent better timing, a 10 per cent reduction in cell area and 27 per cent improved leakage power on the Cortex-X4 CPU, empowering Arm to achieve power, performance and area (PPA) targets faster, reported Cadence.

The digital RAKs provide Arm TCS23 users with benefits, for example the AI-driven Cadence Cerebrus automates and scales digital chip design, providing customers with improved productivity versus a manual, iterative approach. Cadence iSpatial technology provides an integrated implementation flow, offering improved predictability and PPA, leading to faster design closure. The RAKs also incorporate a smart hierarchy flow that enables accelerated turnaround times on large, high-performance CPUs. The Tempus ECO Option, which provides path-based analysis, is integrated into the flow for signoff-accurate, final design closure. Finally, the RAKs use the GigaOpt activity-aware power optimisation engine, incorporated with the Innovus implementation system and the Genus Synthesis to dramatically reduce dynamic power consumption.

Arm used the Cadence verification flow to validate the Cortex-X4, Cortex-A720 and Cortex-A520 CPU-based and Immortalis-G720, Mali-G720 and Mali-G620 GPU-based mobile reference platforms. The Cadence verification flow supports Arm TCS23 and includes the Cadence Xcelium logic simulation platform, Palladium Z1 and Z2 Enterprise emulation platforms, Helium Virtual and Hybrid Studio, JasperÒ formal verification platform and Verisium Manager planning and coverage closure tools.

The Cadence verification flow lets Arm TCS23 users improve overall verification throughput and leverage advanced software debug capabilities. Cadence also validated that Cadence Perspec system verifier, VIP and System VIP tools all support TCS23-based designs to enable customers to accelerate time to market when assembling TCS23-based SoCs. The virtual and hybrid platform reference designs include the Arm Fast Models to enable early software development and verification through the Cadence Helium Studio as well as the Cadence Palladium and Protium platforms, also known as the dynamic duo.

The Cadence digital and verification flows support the Cadence Intelligent System Design strategy, which enables customers to achieve SoC design excellence. 

http://www.cadence.com 

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