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iWave bases SoM on i.MX 91

Thu, Jun 08, 2023

Designed for secure and reliable Linux edge processing, the solderable NXP i.MX 91-based LGA system on module (SoM) has been added to the iW-RainboW-G50M family by iWave.

The SoM incorporates the newest member of the i.MX 9 applications processor series and is built on the OSM v1.1 solderable SoM standard. The rugged, compact form factor also offers extensive interfaces, said iWave.

Evaluation kits of the SoM will be ready to purchase this month.

The i.MX 91 SoC combines security, performance and scalability. It can operate as a foundation block for cost-optimised Linux edge devices, said iWave. The i.MX 91 family features an Arm Cortex-A55 running at up to 1.4GHz and an integrated EdgeLock Secure Enclave. There are also dual Gigabit Ethernet, dual USB ports interfaces and essential I/O to fit in products used in smart factory, smart home, medical devices and smart metering.

In addition to the NXP i.MX 91 SoC, the SoM integrates 2Gbyte LPDDR4 RAM, 16Gbyte eMMC flash, two 1Gbit per second Ethernet controllers (one with TSN or time sensitive networking), one 4bit SD, one USB 2.0 OTG, four USB 4.0 host Wi-Fi 6 and Bluetooth 5.3 and IEEE802.15.4 connectivity.

The SoM is in a size-L form factor with dimensions of 45 x 45mm. The solderable LGA package is certified to the OSM v1.1 standard with provision for 662 contact, offering high pin to area ration across the SoM, said iWave. It is part of the company’s 10 years’ product longevity programme.

It is possible to directly solder the SoM onto the carrier card to ensure high levels of robustness for products prone to vibrations, including electric vehicle charging stations, industrial gateways and human machine interface (HMI) displays.

The i.MX 9x family of i.MX 91 and i.MX 93 provides customers scalability with reduced development cost and time to market and provides consumers with efficient power management and advanced security features on the edge, added the company.

The i.MX 91-based system on module is integrated on a carrier board, which is positioned as a single board computer (SBC) and also doubles up as an evaluation kit. The production-ready SBC is built on a Pico-ITX form factor and integrates the necessary interfaces for applications such as smart home hubs, metering gateways, and industrial automation solutions.

The SBC is characterised by the NXP i.MX 91 SoC, 2Gbyte LPDDR4 RAM, 16Gbyte eMMC, Wi-Fi 6, Bluetooth 5.3 and IEEE802.15.4 connectivity. There is also a GNSS receiver module (GPS / GLONASS / Galileo / BeiDou), dual 1000/100/10Mbits per second Ethernet, one USB 2.0 OTG (microAB receptacle connector), a dual USB 2.0 host (TypeA) and one each USB header and USB Type-C connector. There is also a micro SD, 3.5mm audio in and out jack through I2S codec, an M.2 connector Key B, expansion connector (UART, CAN, ADC, Tamper, PWM) and one RS232 header.

The SoM and SBC are production ready, with all documentation, necessary software drivers and board support package available for customers.

http://www.iwavesystems.com

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Topside cooling creates thinner, lighter 5G radio units

Wed, Jun 07, 2023

Topside cooled RF amplifier modules have been developed by NXP Semiconductors and based on packaging designed to enable thinner and lighter radios for 5G infrastructure.

Smaller base stations can be more easily and cost-effectively installed, increasing network density, while being able to blend more discretely into their environment, said NXP. Its GaN multi-chip module series, combined with what is claimed to be the industry’s first topside cooling for RF power, helps to reduce not only the thickness and weight of the radio by more than 20 per cent, but also the carbon footprint for the manufacture and deployment of 5G base stations.

“Top-side cooling represents a significant opportunity for the wireless infrastructure industry, combining high power capabilities with advanced thermal performance to enable a smaller RF subsystem,” said Pierre Piel, vice president and general manager for radio power at NXP.

Benefits afforded by NXP’s topside cooled devices are the removal of the dedicated RF shield, use of cost-effective and streamlined PCBs and separation of thermal management from RF design. These features help networking solution providers create slimmer and lighter 5G radios for mobile network operators, while reducing their overall design cycle, NXP added.

NXP’s first topside cooled RF power module series is designed for 32T32R, 200W radios covering 3.3 to 3.8GHz. The devices combine the company’s in-house LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31dB gain and 46 per cent efficiency over 400MHz of instantaneous bandwidth.

The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC modules are available today. The A5M36TG140-TC will be supported by NXP’s RapidRF reference board series.

NXP Semiconductors specialises in secure connectivity solutions for embedded applications in the automotive, industrial and IoT, mobile and communications infrastructure markets while advancing a more sustainable future. The company has over 60 years of combined experience and expertise and operates in more than 30 countries.

http://www.nxp.com

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Aaeon releases Boxer-8646AI AI system, powered by Nvidia AGX Orin

Wed, Jun 07, 2023

A fanless PoE embedded AI system by Aaeon is designed as an edge AI computer operating across multiple, vertical markers, including smart safety, parking and traffic management.

The Boxer-8646AI is a fanless PoE embedded AI system powered by the Nvidia Jetson AGX Orin module. It is equipped with an Ethernet interface and – with 12 PoE LAN ports – offers three times more PoE LAN ports than any previous Aaeon products featuring Nvidia Jetson modules.

It is also equipped with one 10G LAN port and four DB-9 ports for functions such as CANbus FD, RS-232/422/485 and DIO. LPDDR5 support provides fast system memory to ensure exceptional data transmission speed for peripheral devices such as cameras and sensors.

For storage, the Boxer-8646AI offers 64Gbyte of eMMC alongside NVMe, which is accommodated via M.2 2280 M-Key as well as a SIM card slot. The system hosts additional expansion options for add-on cards to augment application performance, namely an M.2 2230 E-Key and an M.2 3052 B-Key to facilitate wireless connections such as Wi-Fi / Bluetooth and LTE respectively.

Compatible with Nvidia Jetpack 5.0 and above, the Boxer-8646AI equips users with a library of graphics, multimedia and inferencing accelerators to complement its Nvidia Ampere GPU architecture. The interfaces offered by the Boxer-8646AI will enable users to take full advantage of the 200 TOPS of AI performance offered by the Nvidia Jetson AGX Orin platform, allowing them to both build and scale edge computing applications requiring high-quality inferencing performance across multiple video streams simultaneously.

The Boxer-8646AI is designed to sustain fanless operation within a wide -20 to +50 degrees C temperature range, for outdoor deployment. The Boxer-8646AI is available to order now.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge solutions and computing platforms including industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances, and LoRaWAN / WWAN solutions. Aaeon provides experience and knowledge to OEMs / ODMs worldwide and works closely with cities and governments to develop and deploy smart city ecosystems, offering individual platforms and end-to-end solutions.

http://www.aaeon.com

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Anritsu extends support for Wi-Fi 7 TRX tests for wireless devices

Wed, Jun 07, 2023

Anritsu extends test capabilities for manufacturing wireless communications devices with the Universal Wireless Test Set MT8870A / MT8872A which supports Wi-Fi 7 TRX tests by software options of the WLAN 802.11be TX Measurement MX887034A and WLAN 802.11be Waveforms MV887034A.

The MT8870A / MT8872A has excellent test features for manufacturing inspection of wireless communications equipment and modules, while also supporting all prior Wi-Fi TRX test standards (IEEE 802.11b / g / a / n / ac / ax).

The MX887034A and MV887034A add test features for the latest WLAN IEEE 802.11be Wi-Fi 7 standard to the MT8870A / MT8872A test set. These software options facilitate Wi-Fi 7 TRX testing without changing the manufacturing software and production line configurations in order for customers to optimise the efficiency of their equipment investment.

Offloading mobile data to the WLAN network is important to reduce traffic congestion, said Anritsu. As smartphones, tablets and home appliances, together with automobiles and factory equipment are connecting to the network, network data traffic is likely to continue increasing but the capacity of cellular communication networks, mainly used for mobile phones, is limited.

The latest Wi-Fi 7 WLAN standard attempts to address this, using a wider channel bandwidth and higher order modulation to increase data traffic capacity. A multi-link feature improves the stability of even congested networks. Introduction of Wi-Fi 7 helps implement a more robust communications environment, which is expected to drive further demand for Wi-Fi 7 devices.

Adding MX887034A and MV887034A options is Anritsu’s efficient solution to add Wi-Fi 7 test features to the customer test environment, said the company.

The Universal Wireless Test Set MT8870A / MT8872A series is designed for developing and manufacturing various wireless communication equipment. Installing up to four test units in the main unit supports a seamless frequency band up to 7.3GHz with a 200MHz bandwidth.

Each unit measures test parameters independently in parallel, enabling the MT8870A to quickly and simultaneously evaluate multiple wireless communications devices.

http://www.anritsu.com

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iWave bases SoM on i.MX 91

Topside cooling creates thinner, lighter 5G radio units

Aaeon releases Boxer-8646AI AI system, powered by Nvidia AGX Orin

Anritsu extends support for Wi-Fi 7 TRX tests for wireless devices

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