Gaia Converter augments DC/DC converter portfolio for rail applications 

High reliability and industrial grade wide input DC/DC converters from Gaia Converter now include an input bus conditioner for rail applications, designed to meet the needs of the rapidly-evolving railway infrastructure. 

Railways worldwide are expanding and evolving to reduce emissions while optimising safety, capacity, and interoperability, said the company. The widespread adoption of smart signalling and speed control systems like the European Rail Traffic Management System (ERTMS) is setting new, more stringent requirements for power conversion devices.

The new input bus conditioner can suppress extreme surges in railway environments and board-mount parts rated at 20W, 40W and 80W, with the added feature of 3kVAC reinforced safety isolation rating to IEC 62368-1. 

Input range for each part is 12 to 160V DC, to include 24V, 48V, 72V, 96V and 110VDC nominals in order to meet EN 50155 and other rail specifications, as well as standards for common industrial applications. The input will also withstand 176V DC for 100ms to include the surge specified in rail standard NF-F 01-510 for 110V DC nominal, as well as the RIA12 specification of 168V DC for 20ms for 48V DC nominal. 

Surges to 385V DC for 20ms to specification RIA12 can be met with the additional input bus conditioner type FLHGI90, which also attenuates fast transients, provides reverse polarity protection and ensures compliance with EN 550121 EMC specification. 

Without the input bus conditioner, the parts can meet EN 55022 Class B EMI with a recommended external filter. Outputs available for each model are 2 x 5V, 2 x 12V or 2 x 15V, which are mutually isolated and can be paralleled for higher current, placed in series for higher voltages or connected as ±bipolar outputs for maximum flexibility. Efficiency is typically 87 per cent and case operating temperature range is from -40 to +105 degrees C without derating. Output power derates by just 25 per cent for input voltages lower than 36V DC.

Control functions include an on/off pin and output trim which can vary the outputs (-20 to +10 per cent). Protection features are over-load, short-circuit, soft-start and input under-voltage lock-out, with a trimmable threshold, to match all battery voltage standards.

Each converter is offered in a fully potted, low profile metallic case measuring 35 x 30 x 10mm for the 20W part, 46 x 36 x 10mm for the 40W part and 50 x 44 x 12.9mm for the 80W part.

MTBF performance is typically above 1000khrs according to Mil HDBK 217F GB, 25 degrees C, where the usual figure for competing products is nearer to 300 to 500khrs for the same standard conditions.

https://www.gaia-converter.com

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Low power positioning technology extends RivieraWaves Bluetooth IP

Support for Channel Sounding over Bluetooth technology has been added by Ceva to its RivieraWaves Bluetooth IP portfolio. The company said it has been introduced to meet the surging demand for high-accuracy secure positioning in the automotive, industrial and broader IoT markets.

Channel Sounding (previously referred to as HADM or high accuracy distance measurement) is a radical improvement on traditional Bluetooth distance and position measurement techniques, namely received signal strength indicators (RSSI) with angle of signal arrival/departure (AoA/AoD). It has additional security and accuracy compared to previous generations of Bluetooth positioning, as well as a low power profile, which makes Bluetooth-based Channel Sounding suitable for applications such as automotive digital keys. It is also suitable for general applications such as industrial / warehouse / consumer asset tracking, and real-time sport / fitness tracking.  

Ceva said that its implementation provides best-in-class decimeter-level accuracy in complex, multi-path real-world environments. This robust, low power architecture, incorporates advanced security mechanisms to defeat distance-spoofing and ‘relay attacks’, said the company, describing these as essential for next generation digital keys and wireless payment systems.

Beyond the demanding secure vehicle entry segment and asset tracking, Bluetooth-based positioning is also experiencing growth in the retail location services segment, especially when coupled with Bluetooth-based electronic shelf label (ESL) systems. 

Ceva’s Channel Sounding for Bluetooth will be available for general licensing in September 2023. The company will be demonstrating the technology at MWC Shanghai 2023 (28 to 30 June), booth N2.EMR04 in Hall 2.

Ceva’s RivieraWaves Bluetooth IP platforms provide solutions for both Bluetooth LE and Bluetooth dual mode connectivity, spanning RF, modem, baseband controller, and complete host and profile software stacks. All the latest features of Bluetooth are supported, including LE Audio / Auracast, LE channel classification, PaWR, and other enhancements. 

The RivieraWaves Bluetooth IP is widely deployed in consumer, automotive and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, beacons, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.

Ceva licenses wireless connectivity and smart sensing technologies and custom SoCs. It also provides digital signal processors, AI engines, wireless platforms, cryptography cores and complementary embedded software for sensor fusion, image enhancement, computer vision, spatial audio, voice input and artificial intelligence. 

http://www.ceva-dsp.com 

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Small capacity e.MMC and SD memory cards are cost-efficient for green IIoT

Swissbit has introduced cost-efficient, small capacity e.MMCs and SD memory cards for IIoT and smart city applications. The EM-30 and S-56(u) series are based on 3D TLC NAND and have capacities from 4Gbyte. 

The EM-30 and S-56(u) series are available as an embedded component in the form of an e.MMC or as flexible, interchangeable SD memory cards. They also guarantee  data security said Swissbit.

The EM-30 product series (153 ball BGA) complies with e.MMC-5.1 specifications and is fully backwards compatible. It is designed for an extended temperature range of -40 to +85 degrees C and is suitable for use in harsh environmental conditions. Based on durable industrial-grade 3D-TLC-NAND and with storage capacities ranging from 4.0 to 8Gbyte, the range offers sequential data rates of up to 280Mbyte per second read and 120Mbyte per second write, as well as 11k IOPS random read and 16k IOPS random write.

The S-56(u) SD and microSD memory cards attain sequential read and write data rates of 95Mbytes per second and 74Mbytes per second, respectively. Random read IOPS is 2,200 and random write IOPS is 1,300. Over-provisioning and pSLC technology ensure the S-56 series offers the highest endurance for write-intensive workloads. Combined with up to 100,000 PE cycles, its endurance for small data logging even surpasses that of an SLC card for the first time, reported Swissbit.

The cards are suitable for applications which require minimal storage space, for example green IIoT technologies like charging stations, smart meters, and PV inverters. Only a small amount of memory is required to run boot software or to communicate with cloud applications in these instances. 

The capacities mean they are suitable for use as boot media or for data logging small amounts of data, without sacrificing performance or durability in green IoT applications such as smart meters, controllers for intelligent building management, or generating and using sustainable energy through charging stations. 

Other typical applications for small-capacity flash memory include white goods, payment devices and point-of-sale systems, industrial control systems, and medical diagnostic and patient monitoring devices.

http://www.swissbit.com

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Versal Premium VP1902 is largest FPGA-based adaptive SoC, says AMD

AMD said that the Versal Premium VP1902 is the world’s largest FPGA-based adaptive SoC for emulation and prototyping. It offers twice the capacity of earlier generation FPGAs said the company.

The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Designers can use it to innovate and validate application-specific integrated circuits (ASICs) and SoC designs.

FPGA-based emulation and prototyping allows fast silicon verification and enables developers to begin software development in advance of silicon tape-out. 

As complexity grows in ASIC and SoC designs, coupled with the rapid advancement of AI and ML-based chips, extensive verification of both silicon and software before tape-out is a must, said AMD. The VP1902 delivers 18.5M logic cells for 2X2 higher programmable logic density and 2X4 aggregate I/O bandwidth compared to the previous generation Virtex UltraScale+ VU19P FPGA.  

For both pre-silicon verification and concurrent software development, the VP1902 finds and addresses bugs before tape-out. The Versal architecture, including the programmable network-on-chip, provides up to 8X5 faster debugging compared to the prior generation VU19P FPGA. 

The AMD Vivado ML design suite provides a comprehensive development platform to quickly design, debug and validate applications and technologies to accelerate time to market. New features that support more efficient development on the VP1902 adaptive SoC include automated design closure assistance, interactive design tuning, remote multi-user real-time debugging and enhanced back-end compilation, which enables end users to iterate IC designs faster, said the company.

AMD has collaborated with EDA vendors, including Cadence, Siemens and Synopsys to help designers access an ecosystem of fully-featured and scalable solutions. 

The AMD Versal Premium VP1902 adaptive SoC will begin sampling in Q3 to early access customers with production expected in the first half of 2024.

Kirk Saban, corporate vice president, Product, Software, & Solutions Marketing, Adaptive and Embedded Computing Group, AMD, commented: “Chip designers can confidently emulate and prototype next-generation products using our VP1902 adaptive SoC, accelerating tomorrow’s innovations in AI, autonomous vehicles, Industry 5.0 and other emerging technologies.”

https://www.amd.com

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