Aetina introduces Edge AI platform for physical AI and robotics

Aetina has announced the AIB-AT series, a next- generation edge AI platform powered by NVIDIA Jetson Thor modules. Designed to meet the rapidly growing demand for high-performance, low-latency edge intelligence in emerging Physical AI applications, the AIB- AT series marks a significant expansion of Aetina’s DeviceEdge portfolio and represents a major step forward in delivering production-ready computing platforms for Physical AI and robotics.

The AIB-AT series includes the AIB-AT78 powered by NVIDIA Jetson T5000 module and the AIB-AT68 powered by NVIDIA Jetson T4000 module. Built on the NVIDIA Blackwell GPU architecture, both platforms deliver AI compute density in a compact 140 mm × 165 mm form factor. This design enables deployment in space-constrained systems such as humanoid robots, autonomous warehouse vehicles, surgical robots, agricultural drones, and utility inspection robots.

The AIB-AT series, leveraging the advanced NVIDIA Jetson Thor platforms, unlocks real-time reasoning for general robotics and physical AI with a high level of performance. With up to 2070 FP4 TFLOPS of AI compute and 128 GB of memory, the platform delivers up to 7.5X higher AI performance compared to the previous generation, supporting complex workloads such as multimodal perception, sensor fusion, and generative AI inference.

This level of performance allows developers and system integrators to build sophisticated robotic systems—including humanoids, advanced medical devices, and autonomous machines—that require deterministic, low-latency processing at the edge.

Aetina has engineered the AIB-AT series specifically for the demanding requirements of industrial robotics and autonomous systems. A defining differentiator of the AIB-AT series is its native engineered with dual RJ45 10GbE ports, enabling high-throughput and low-latency AI data exchange, and with one dedicated RJ45 1GbE EtherCAT support for deterministic motion control, Aetina enables robotics developers to consolidate perception, decision-making, and control into one compact, production-ready system.

Beyond control convergence, the AIB-AT series delivers sensor and expansion support tailored for physical AI workloads. High-speed QSFP28 connectivity, optimised for NVIDIA Holoscan, enables stable, low-latency sensor streaming, while a 120-pin MIPI interface supports up to 8x GMSL cameras for advanced multi-view perception. Additional M.2 expansion slots provide PCIe Gen5 NVMe storage, wireless connectivity, and optional 4G/5G with 1PPS function for precision navigation and global time synchronisation.

Designed for real-world industrial deployment, the platform supports a 9–48 V wide input voltage range and operates reliably across –25°C to 80°C, ensuring consistent performance in demanding environments such as factories, warehouses, healthcare facilities, and outdoor autonomous systems.

NVIDIA Jetson Thor represents a new class of robotic computing platforms, purpose-built for generative reasoning and multimodal sensor processing. The AIB-AT series supports the full NVIDIA AI’s open models, open-source frameworks and libraries, including NVIDIA Isaac, NVIDIA Metropolis, and NVIDIA Holoscan, as well as agentic AI workflows such as NVIDIA Blueprint for video search and summarisation (VSS). From Vision Language Action (VLA) models like the open NVIDIA Isaac GR00T N robot foundation models to open, reasoning VLMs like NVIDIA Cosmos Reason, the AIB-AT series provides developers with a powerful platform foundation, enabling a seamless cloud-to-edge deployment experience and accelerating the implementation of physical AI innovations.

www.aetina.com

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Bosch Sensortec launches BMI5 motion sensor platform at CES

At CES 2026, Bosch Sensortec introduces the BMI5 platform, a new generation of inertial sensors designed to provide consistent, high-precision performance across multiple device classes. Built on a shared hardware foundation and adapted through intelligent software, the platform launches with three variants – BMI560, BMI563 and BMI570.

At the core of the BMI5 platform is Bosch’s latest MEMS architecture, which defies thermo-mechanical stress effects, provides ultra-low noise, vibration robustness and twice the full-scale range of the previous generation. A latency of below 0.5 ms, combined with a time increment of approximately 0.6 µs and a timing resolution of 1 ns, ensures responsive and reliable motion tracking in highly dynamic environments. A compact industry-standard LGA package further simplifies integration. A programmable Edge-AI classification engine supports always-on functionality by analysing motion patterns directly on the sensor, reducing system power consumption and accelerating customer-specific use cases.

The BMI560 is optimised for XR headsets and glasses, where low noise, low latency and precise time synchronisation enable natural head motion, frame prediction and intuitive 3D interaction. For smartphones and action cameras, its advanced OIS+ performance helps capture stable, high-quality footage even in dynamic environments.

The BMI563 combines an extended Full Scale Range (FSR) with the platform’s vibration robustness, supporting Simultaneous Localisation and Mapping (SLAM), high-dynamic XR motion tracking and motion-based automatic scene tagging in action cameras. Its design ensures reliable data acquisition under demanding robotic motion profiles.

The BMI570 provides dependable activity tracking, advanced gesture recognition and accurate head-orientation data for spatial audio. Its robustness under dynamic sports and everyday movements makes it a strong fit for next-generation wearables and hearables.

Across all variants, the BMI5 platform meets Bosch Sensortec’s highest ecological standards to date, combining technical performance with responsible innovation. This unified architecture enables device makers to streamline development across product lines, while supporting future edge-AI and ML-enabled enhancements.

www.bosch-sensortec.com

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Nordic Semiconductor simplifies edge AI for billions of IoT devices

Nordic Semiconductor is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated edge AI intelligence – combining energy efficiency with unmatched ease of use for developers.

“AI factories train intelligence, but Nordic deploys it – on device, at the edge, where the world happens – said Vegard Wollan, CEO at Nordic Semiconductor. “Edge AI is no longer optional – it’s the only way to deliver safety, privacy, and sustainability at scale. Nordic’s edge AI solution enables millisecond decisions without round-trip latency to the cloud, ensures compliance through local processing, and delivers radically improved battery life for billions of connected devices. This is the new standard for ultra-low-power edge AI and Nordic is defining it.”

In 2023, Nordic acquired Atlazo and its Axon technology. The nRF54LM20B SoC is the first large-memory member of the nRF54L Series, integrating the Axon Neural Processing Unit (NPU), an ultra-efficient AI hardware accelerator, to supercharge demanding edge AI workloads. Axon delivers up to 7 times faster performance and up to 8 times higher energy efficiency versus competing solutions for tasks such as sound classification, keyword spotting, and image-based detection.

The nRF54LM20B SoC pairs the Axon NPU with 2 MB NVM, 512 KB RAM, a 128 MHz Arm Cortex-M33 plus RISC-V coprocessor, high-speed USB, up to 66 GPIOs, and Nordic’s fourth-generation ultra-low-power 2.4 GHz radio supporting Bluetooth® LE, Bluetooth Channel Sounding, Matter over Thread, and more.

The Neuton models are ultra-tiny, CPU-run edge AI models that are typically under 5 KB and up to 10 times smaller, faster, and more efficient than other CPU-run models. Nordic Edge AI Lab helps developers generate custom Neuton models for anomaly detection, activity and gesture recognition, biometric monitoring, and more – delivering privacy-preserving, real-time intelligence on tiny batteries and constrained memory, without cloud dependency.

With Nordic Edge AI Lab and Neuton models, intelligence moves from concept to reality without complexity. One recent deployment illustrates this: A global supply chain solution upgraded its smart tracking devices with AI models created in Nordic Edge AI Lab effortlessly, enabling detection of real handling events such as shock, shaking, and transportation directly on an nRF54L Series SoC. These AI-driven insights were rolled out across an entire fleet without operational disruption, thanks to Nordic’s nRF Cloud lifecycle services.

“With Nordic Edge AI Lab, Neuton models, and the Axon NPU, Nordic makes advanced on-device AI practical for every embedded developer,” said Oyvind Strom, EVP Short-Range BU at Nordic Semiconductor. “Developers get the simplicity to move fast, and the disruptive performance to scale from wearables to industrial sensing – all enabled within Nordic’s trusted ultra-low-power hardware solutions.”

As intelligence moves to the edge, the need for OTA management and deep observability is growing. At the same time, cloud-based lifecycle services remain critical for device management, embedded observability, and location services. Manufacturers increasingly need continuous insight into device performance – not just to improve products in real time, but to meet growing regulatory and customer requirements. Using data from deployed devices enhances features and optimises performance without disrupting the user experience. This ensures connected products can evolve securely and efficiently throughout their lifecycle.

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ST scales STM32 microprocessors for cost-efficient, low-power, and flexible performance

ST has introduced STM32MP21 microprocessors (MPUs) for cost-aware edge applications in smart factories, smart homes, and smart cities, combining advanced cores and peripherals with strong security targeting SESIP Level 3 and PCI pre-certification.

Extending ST’s STM32MP2 series, the new MPUs with a 1.5GHz 64-bit Arm Cortex-A35 core and advanced 32-bit Cortex-M33 at 300MHz ensure fast execution times with flexibility. The two cores handle complex tasks and real-time control, adding the opportunity for boot processing on the Cortex-M33 to launch services quickly and accelerate system wake-up from power-saving modes.

Bringing a focused feature set, STM32MP21 MPUs integrate MIPI CSI-2 and image signal processing (ISP) pipeline for machine-vision applications such as industrial inspection and barcode or QR-code readers. Also, two Gigabit Ethernet ports with Time-Sensitive Networking (TSN) support applications that need determinism, low latency, jitter-free communication, synchronisation, and scheduling, including industrial automation, robotics, functional safety, and sensor-data capture.

On top of DDR4/LPDDR4 DRAM support, the series supports DDR3L memory, enabling designers to optimise system performance, footprint and BoM, while maintaining competitive pricing and secure supply amid ongoing DDR4/LPDDR4 shortages and price surges.

The security architecture shared throughout the STM32MP2 series is built to comply with increasingly strengthened regulations worldwide, including the incoming EU Cyber Resilience Act (CRA). The MPUs’ SESIP Level 3 security-assurance target aligns with CRA implementation guidelines that specify AVA_VAN.2 or AVA_VAN.3 resistance for Important (Class II) products and at least AVA_VAN.4 for Critical products. Customers’ applications are protected even before delivery with ST’s in-factory secure secret provisioning (SSP) to load the unique identity and immutable passwords for authentication and attestation. A secure hardware cryptographic accelerator inhibits physical attacks, while supporting secure boot and applicative needs. Code isolation with Arm TrustZone protects startup and sensitive processes, completed with hardware protection of memory and peripherals leveraging ST’s proprietary resource isolation framework (RIF) to prevent tampering.

Product developers can take advantage of the STM32 ecosystem that provides extensive software and tools for building and testing MPU applications. These include ST Edge AI desktop and cloud tools, OpenSTLinux and software expansion packages, as well as evaluation boards, the STM32MP215F-DK Discovery kit, and adapter boards. On top of the well-established OpenSTLinux distribution, with Yocto and Buildroot flavors, a bare metal offer will be available for the STM32MP2 series in 2026, as presented previously for the STM32MP13 series.

The new STPMIC2L power-management IC (PMIC) provides the power supplies needed for the STM32MP21 and DRAM, to simplify system design and minimise circuit footprint. Additional PMICs are available, suited to other combinations of STM32 MPU and peripherals, and are described online at ST’s website. CAD resources in the STM32 MPU product pages give access to Altium projects for the most commonly used configurations to further accelerate customers’ designs.

STM32MP21 package options include 8mm x 8mm 225-pin and 10mm x 10mm 361-pin VFBGAs suited to 6-layer high-density interconnect (HDI) boards. In addition, a 11mm x 11mm 273-pin VFBGA and 14mm x 14mm 289-pin TFBGA are available for cost-conscious 4-layer boards. The 10mm x 10mm VFBGA361 is pin-to-pin compatible across the entire STM32MP2 series.

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