Isolated gate driver IC introduces Allegro’s Power-Thru series

Allegro MicroSystems has introduced the Power-Thru portfolio with the AHV85110 isolated gate driver. Theisolated gate driver is a single package that drives GaN FETs with up to a 50 per cent smaller footprint and a 40 per cent efficiency improvement compared to competitors’ offerings, claimed Allegro.

Wide-bandgap silicon carbide (SiC) and gallium nitride (GaN) field effect transistors (FETs) offer clear efficiency benefits at the system level but there are integration challenges, said the company.

A traditional gate driver implementation requires both an isolated gate driver and a separate isolated power supply. When assembled, connections between the driver, power source and FET can add unwanted noise and create pathways of electromagnetic interference (EMI). Working around these effects can create design complexity, add time and increase the cost of a project. It can also increase a project’s schedule, size and weight, said Allegro.

Its patent protected, highly differentiated Power-Thru AHV85110 gate driver combines the isolated gate driver and the isolated power supply into a single, compact, robust package. Allegro said it minimises EMI pathways and simplifies integration to accelerate time to market, efficiency gains, and production cost savings.

The differentiated Power-Thru technology enables engineers to provide more power, more efficiently, using 50 per cent of the design footprint for PCB savings and reduces bill of materials (BOM) count and production cost.

Another benefit is the elimination of bootstrap circuits and isolated supplies while minimising common-mode capacitance, which reduces EMI filter design efforts and improves overall efficiency, said Allegro.

It also provides a reliable, scalable design process across platforms by eliminating the need to fully redesign a power module when working with multiple GaN FET suppliers, added the company.

https://www.allegromicro.com

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Display Technology introduces DIN rail fanless embedded PC from Aaeon

The BOXER-6751-ADP is Aaeon’s DIN rail fanless embedded box PC. It is rugged and engineered for industry 4.0 environments. It is also compact, measuring 74.3 x 186 x 127mm for low profile deployment in industrial computing applications, including manufacturing and energy sectors.

The BOXER-6751-ADP features 12th Generation Intel Core processors. The compact form factor, combined with a DIN rail mount feature, ensures effortless integration into space-constrained environments, said Display Technology.

The BOXER-6751-ADP is engineered to operate in demanding industrial settings. Its operating temperature range is -20 to +60 degrees C and input range is 9.0 to 36V, making the PC suitable for environments characterised by extreme temperature fluctuations and power source variations. The internal and external heatsink design ensures optimal heat dissipation, mitigating the challenges associated with fan-assisted hardware in factory atmospheres, added Display Technology.

There are two DB-9 ports offering RS-232 / 422 / 485 connectivity to integrate a variety of devices. There is also a DB-15 port which enables digital I/O for equipment inspection sensors, enhancing operational efficiency and precision.

Peripheral ports support two Ethernet ports supporting 2.5GbE Intel I226-LM and GbE Intel I219-LM for seamless integration with cameras and wired networking solutions. The BOXER-6751-ADP also boasts six USB Type-A ports, with three supporting USB 3.2 Gen 2 function and three supporting USB 2.0, as well as dual HDMI 1.4b for display output, ensuring connectivity with a wide array of devices.

Storage capabilities include support for SATA III and NVMe through a 2.5 inch drive bay and an M.2 2280 M-Key slot, respectively. The M.2 2230 E-Key and M.2 3052 B-Key slots provide additional expansion possibilities, accommodating Wi-Fi, Bluetooth, and 5G modules to enhance connectivity and communication options.

http://www.displaytechnology.co.uk

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Starter kit for R-Car S4 speeds up prototyping software development

A development board for automotive gateway systems is now available from Renesas. The R-Car S4 starter kit is an inexpensive, development board for building software using the Renesas R-Car S4 SoC.

The SoC delivers high computing performance and an array of communication features for both cloud communication and safe vehicle control. The starter kit is less expensive than the earlier R-Car S4 reference board, which provides a development environment including an evaluation board and software. Engineers can use the kit to start the initial evaluation of car servers, connected gateways, connectivity modules for rapid application development.

The R-Car S4 starter kit includes essential R-Car S4 interfaces such as Ethernet TSN switch and CAN FD, as well as memory such as 4Gbyte of LPDDR4, 128Gbyte of UFS (Universal Flash Storage), and 64Mbyte of Quad SPI flash memory. Users can expand peripheral functions by using expansion connectors and customise the hardware to meet specific application requirements, advised Renesas.

The R-Car S4 Whitebox software development kit is an open source automotive development environment for the R-Car S4, which can be combined with the R-Car S4 starter kit. The software development kit consists of FoC (free of charge) software and can be used without the need for complicated license agreements. The software development kit (SDK) includes sample software, test programs, and resource monitoring tools for OTA (over-the-air software updates), IPS (intrusion prevention system), and IDS (intrusion detection system) for network security, allowing for various prototyping and evaluation.

There is also sample software which can be used as a base to develop applications. According to Renesas, the kit shortens development time and reduces energy consumption.

The R-Car S4 starter kit is available from major distributors or via a Renesas local sales representative.

The R-Car S4 whitebox SDK will be available by the end of August.

https://www.renesas.com

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High density cryogenic connector delivers quantum computing

The Q-CON high density cryogenic connector has been developed to meet demand for quantum computing, and the development of large-scale high qubit machines which require microwave cables for control and readout lines to the quantum processor.

These have traditionally been individual coaxial cables fitted with SMA connectors which offer limited packaging due to their 8mm hex coupling, explained CryoCoax, a division of Intelliconnect (Europe). The cables also require space in order to provide access for tooling during installation.

CryoCoax has developed high density, multi-way connectors based around the SMPM micro miniature interface. This provides many more coaxial lines in a given space, said the company but also simplifies the installation and customisation within a dilution refrigerator. Typical spacing using SMA connectors is limited to approximately 16mm, whereas the Q-CON high density connectors are designed with a pitch of 4.75mm. The SMPM interface provides a simple push to mate connection only requiring a hex key to tighten the two fasteners.

The connector components are machined from high purity copper and beryllium copper and are gold plated to optimise thermal conductivity. Non-magnetic versions can also be specified if required.

The connectors are compatible with 0.047-inch (1.19mm) size coax, and either semi-rigid, flexible or conformable versions are available. Semi-rigid cables are available in niobium titanium, stainless steel, copper, cupronickel and beryllium copper as well as combinations of these with silver plated conductors, providing a choice in terms of thermal conductivity and attenuation.

To minimise passive heat load, cable materials with low thermal conductivity are normally favoured, however, with the exception of superconductors this typically goes hand in hand with poor electrical conductivity.  Flexible cables with silver plated copper conductors are typically used for connections from the top of the dilution refrigerator to connect the control electronics at room temperature and can be terminated with conventional SMA connectors. Conformable copper coax options are also available and are often used at the lowest stage.

Superconducting niobium titanium cables are often specified in quantum applications this material can be challenging, if not impossible, to solder. To overcome this, CryoCoax developed solderless connections for these high-density connectors as well as the traditional SMA, 2.92 and SMP connectors.

Standard configurations of the Q-CON high-density connectors are eight-way, 16-way and 24-way with either smooth bore or full detent options, connector blocks can be ganged together to potentially give hundreds of coax lines in a dilution refrigerator. Two connector blocks form a mated pair, one having a full detent male SMPM interface, and the other a smooth bore SMPM male interface, are used in conjunction with ‘bullet’ style female to female SMPM adaptors fitted between a pair of connector blocks.

The ‘bullet’ adapters are retained in the full detent connector block.  These can be combined with eight-way, 16-way and 24-way attenuator blocks available in 0dB, 3dB, 6dB, 10dB and 20dB.  CryoCoax worked with an attenuator manufacturer to develop these attenuator blocks to complement the high density connectors. Attenuators are employed to suppress thermal noise and provide thermalisation of the centre conductors.

The company specialises in cryogenic connectivity used for quantum computing, research, test and measurement and medical applications.

https://www.intelliconnectgroup.com

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