Two-phase power stage for VRM has small footprint

The BMR511 is a two-phase power stage for voltage regulator modules (VRMs). The integrated VRM power stage provides up to 140A peak and has a small footprint of 90mm2 and 8mm high, said Flex Power Modules.

The halogen-free BMR511 is available with LGA or solder-bump terminations and is optimised for bottom-side cooling. It joins Flex’s BMR510 which is optimised for top-side cooling.

The BMR511 operates over a 5.0 to 15V input range and delivers an adjustable 0.5 to 1.8V output, which can be set by a user-defined external controller via tri-state PWM inputs. Each device can supply a current of 80A continuous total and 140A peak, at high efficiency peaking at 94.5 per cent. Parts can be directly paralleled for even higher current outputs, advise Flex. The input voltage range of the BMR511 makes it compatible with several unregulated front-end Intermediate bus converters which operate with typical input to output ratios of 3:1 up to 7:1.

Operating temperature range is -40 to +125 degrees C on a defined reference point. Thermal derating data is available for a range of airflow rates and cold plate/host board temperatures.

The two power stage phases can be separately enabled/disabled and the part provides feedback to the external controller of device temperature and individual phase currents. Fault reporting and over-current protection is also included.

Its size lends itself to power rail requirements of modern CPUs, GPUs, IPUs and high performance ASICs advised Flex Power Modules.

The BMR511 is now available for sampling and volume production.

Flex Power Modules is a business line of Flex, and is a manufacturer of scalable DC/DC power converters primarily serving the data processing, communications, industrial and transportation markets. It offers a range of both isolated and non-isolated solutions and digitally-enabled DC/DC converters with PMBus compatibility supported by Flex Power Designer design software.

http://www.flexpowermodules.com  

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High density source measure unit accelerates semiconductor characterisation

The PZ2100 series is high density precision source measure unit (SMU) that accelerates time to market with flexible software options, said Keysight. It provides 20 precision SMU channels within a 1U rack space to speed the characterisation of IC designs.

Designing a semiconductor component or device and delivering it to market remains a time-intensive, technical process, observed Keysight. Digital development engineers must connect and test multiple ports on a single device under test (DUT) throughout the design cycle to troubleshoot and characterise the performance of the IC. High density, automated characterisation prevents engineers slowing their delivery timelines as they validate with complex, multi-port designs using complicated and low density test setups, the company continued.

The PZ2100 series SMU is scalable to 20 SMU channels in a 1U rack configuration. Cooling spacers are not required when stacked. There are five SMU module options available that are configurable and upgradeable.

Keysight said time is saved by simplifying channel stacking and synchronisation to remove integration and coding complexity. The graphic user interface (GUI) accelerates test prototyping, debugging, and troubleshooting. The PathWave IV Curve Measurement software enables quick measurements and synchronisation without programming.

The all-in-one SMU module also reduces cost by integrating pulser and digitiser functions with conventional SMU functions, such as precise DC voltage and current sourcing and measuring. According to Keysight, it meets emerging requirements without additional instruments.

Keysight specialises in design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. It serves customers in communications, industrial automation, aerospace and defence, automotive, semiconductor, and general electronics markets.

http://www.keysight.com

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Isolated gate driver IC introduces Allegro’s Power-Thru series

Allegro MicroSystems has introduced the Power-Thru portfolio with the AHV85110 isolated gate driver. Theisolated gate driver is a single package that drives GaN FETs with up to a 50 per cent smaller footprint and a 40 per cent efficiency improvement compared to competitors’ offerings, claimed Allegro.

Wide-bandgap silicon carbide (SiC) and gallium nitride (GaN) field effect transistors (FETs) offer clear efficiency benefits at the system level but there are integration challenges, said the company.

A traditional gate driver implementation requires both an isolated gate driver and a separate isolated power supply. When assembled, connections between the driver, power source and FET can add unwanted noise and create pathways of electromagnetic interference (EMI). Working around these effects can create design complexity, add time and increase the cost of a project. It can also increase a project’s schedule, size and weight, said Allegro.

Its patent protected, highly differentiated Power-Thru AHV85110 gate driver combines the isolated gate driver and the isolated power supply into a single, compact, robust package. Allegro said it minimises EMI pathways and simplifies integration to accelerate time to market, efficiency gains, and production cost savings.

The differentiated Power-Thru technology enables engineers to provide more power, more efficiently, using 50 per cent of the design footprint for PCB savings and reduces bill of materials (BOM) count and production cost.

Another benefit is the elimination of bootstrap circuits and isolated supplies while minimising common-mode capacitance, which reduces EMI filter design efforts and improves overall efficiency, said Allegro.

It also provides a reliable, scalable design process across platforms by eliminating the need to fully redesign a power module when working with multiple GaN FET suppliers, added the company.

https://www.allegromicro.com

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Display Technology introduces DIN rail fanless embedded PC from Aaeon

The BOXER-6751-ADP is Aaeon’s DIN rail fanless embedded box PC. It is rugged and engineered for industry 4.0 environments. It is also compact, measuring 74.3 x 186 x 127mm for low profile deployment in industrial computing applications, including manufacturing and energy sectors.

The BOXER-6751-ADP features 12th Generation Intel Core processors. The compact form factor, combined with a DIN rail mount feature, ensures effortless integration into space-constrained environments, said Display Technology.

The BOXER-6751-ADP is engineered to operate in demanding industrial settings. Its operating temperature range is -20 to +60 degrees C and input range is 9.0 to 36V, making the PC suitable for environments characterised by extreme temperature fluctuations and power source variations. The internal and external heatsink design ensures optimal heat dissipation, mitigating the challenges associated with fan-assisted hardware in factory atmospheres, added Display Technology.

There are two DB-9 ports offering RS-232 / 422 / 485 connectivity to integrate a variety of devices. There is also a DB-15 port which enables digital I/O for equipment inspection sensors, enhancing operational efficiency and precision.

Peripheral ports support two Ethernet ports supporting 2.5GbE Intel I226-LM and GbE Intel I219-LM for seamless integration with cameras and wired networking solutions. The BOXER-6751-ADP also boasts six USB Type-A ports, with three supporting USB 3.2 Gen 2 function and three supporting USB 2.0, as well as dual HDMI 1.4b for display output, ensuring connectivity with a wide array of devices.

Storage capabilities include support for SATA III and NVMe through a 2.5 inch drive bay and an M.2 2280 M-Key slot, respectively. The M.2 2230 E-Key and M.2 3052 B-Key slots provide additional expansion possibilities, accommodating Wi-Fi, Bluetooth, and 5G modules to enhance connectivity and communication options.

http://www.displaytechnology.co.uk

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