Next-Generation of optical ethernet PHY transceivers from Microchip

The rise of smart factories, remote monitoring and connected infrastructure are increasing the demand for advanced networking systems that can operate over long distances and in challenging environments. To address the need for reliable and secure connectivity solutions, Microchip has announced its new portfolio of Optical Ethernet PHY transceivers, available in 25 Gbps and 10 Gbps versions, featuring IEEE 1588 Precision Time Protocol (PTP) and Media Access Control Security (MACsec) encryption.

Microchip’s optical Ethernet PHY transceivers provide a secure, deterministic and scalable alternative to traditional copper-based Ethernet solutions. They support link lengths of up to 10 kilometres over single-mode fibre for seamless deployments over dispersed infrastructure such as company and college campuses or warehouses. The integration of PTP time stamping delivers sub-nanosecond (<1ns) synchronisation accuracy across distributed nodes. This level of timing precision is essential for time-sensitive applications such as industrial automation, telecommunications and robotics.

“Design engineers are looking for solutions that simplify complex networking systems, adding PTP or MACsec could mean a complete overhaul of an existing design, our solution helps preserve our customers’ core-processing investment,” said Charlie Forni, corporate vice president of Microchip’s networking and connectivity solutions business. “We’ve integrated these capabilities into our transceivers, enabling bolt-on functionality to help engineers build smarter, more secure and scalable networks.”

The new variants support Ethernet speeds ranging from 1 Gbps to 25 Gbps, enabling higher bandwidth for data-intensive applications such as data centers, campus area networks, and robotic / industrial automation. Designers can easily scale their networks by selecting the appropriate data rate and media (Optical or DAC – Direct Attach Copper) to match their application requirements.

To help safeguard sensitive data in connected environments, security is integrated at the silicon level with support for MACsec (IEEE 802.1AE) encryption. This hardware-based implementation protects against network data breaches by encrypting traffic between Ethernet devices. MACsec is designed to thwart common cyberattacks including man-in-the-middle attacks, denial-of-service (DoS), eavesdropping and spoofing, to ensure data integrity across the network.

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Rutronik expands its wireless portfolio with Wi-Fi 7 solutions from Intel

Rutronik is offering two solutions for modern, high-speed wireless communications with the Intel Wi-Fi 7 modules BE200 and BE202. Thanks to their support for the latest IEEE 802.11be standard (Wi-Fi 7), they enable data rates of up to 5.8 Gbit / s, particularly low latencies and stable connections – even when multiple frequency bands are used in parallel. The modules are ideal for networked applications in industry, medicine, transportation and consumer electronics.

The Intel BE200 and BE202 modules mark the next step in the evolution of wireless data transmission. Based on the Wi-Fi 7 standard (IEEE 802.11be), they offer extremely high bandwidths and deterministic latency, making them the ideal choice for all applications where speed and reliability are critical.

The BE200 module achieves transfer rates of up to 5.8 Gbit / s, while the BE202 module is designed for data rates of up to 2.4 Mbit / s. Both modules feature a channel bandwidth of 320 MHz, 4K QAM modulation and multi-link operation (MLO) capability, allowing two frequency bands to be used simultaneously, which can improve connection quality.

With frequency bands of 2.4 GHz, 5 GHz and 6 GHz, 2 x 2 TX/RX streams and integrated Bluetooth 5.4, the BE200 and BE202 series combine high performance with flexible integration. They are available as both a pluggable M.2 2230 version and a solderable M.2 1216 variant and support Windows 10, Windows 11 and Linux.

Maximum security is ensured by WPA3 encryption, which also guarantees a high level of protection in critical industrial or medical applications. Combined with their energy efficiency and compatibility with existing platforms, the modules offer an ideal solution for current and future IIoT, transport and smart device designs

rutronik.com

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u-blox introduces the NORA-B27 Bluetooth LE module

u-blox has introduced the NORA-B27, the latest addition to their NORA-B2 family of Bluetooth Low Energy modules. Designed with u-connectXpress for scalability and ease of integration, the NORA-B27 provides a cost-optimised solution ideal for battery-powered, high-volume IoT applications such as sensor hubs, beacons, cable-replacement links, and mobile device companions.

Built on Nordic Semiconductor’s nRF54L05 chipset and pre-flashed with u-blox u-connectXpress software, the NORA-B27 streamlines wireless integration through a familiar AT-command interface—minimising the need for deep Bluetooth expertise. This enables faster prototyping and time-to-market while maintaining performance, security, and low power consumption.

Qualified against Bluetooth Core 6.0 and for industrial temperature ranges from −40 °C to +85 °C, the NORA-B27 delivers stable and secure connectivity in demanding environments across diverse markets, including industrial automation, smart buildings, healthcare, and asset tracking.

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NXP improves battery health monitoring with EIS capable battery management chipset

NXP Semiconductors has announced its industry-first Electrochemical Impedance Spectroscopy (EIS) battery management chipset with hardware-based nanosecond-level synchronisation of all devices. The new system solution is designed to enhance safety, longevity, and performance in electric vehicles and energy storage systems. It integrates EIS measurement directly into three battery management system (BMS) chipset units, enabling carmakers to gain deeper insights into battery health and behaviour.

OEMs today face increasing pressure to deliver safe and faster charging, longer battery life, and safer battery energy storage systems – all while keeping costs and design complexity in check. Traditional, software-based battery monitoring methods often struggle to precisely detect dynamic, millisecond level events that serve as early indicators of failure. To ensure safe and fast charging, these systems frequently require additional sensors and software.

NXP’s new chipset tackles these challenges by embedding EIS directly into the hardware, consisting of three BMS units: the BMA7418 cell sensing device, the BMA6402 gateway, and the BMA8420 battery junction box controller. It enables real-time, high-frequency monitoring without the need for extra components or costly redesigns. The hardware-based solution operates in highly precise synchronisation to deliver highly accurate impedance measurements with directly in-chip integrated discrete Fourier transformation, helping OEMs better manage safe and fast charging, detect early signs of battery failure, and reduce system complexity.

“The EIS solution brings a powerful lab-grade diagnostic tool into the vehicle. It simplifies system design by reducing the need for additional temperature sensors and supports the shift toward faster, safer and more reliable charging without compromising battery health”, said Naomi Smit, VP and GM, Drivers and Energy System at NXP. “The chipset also offers a low-barrier upgrade path, with pin-to-pin compatible packages that can be directly upgraded to on cell module and battery junction box control units.”

The technology of Electrochemical Impedance Spectroscopy is based on sending controlled electrical excitation signals through the entire battery. NXP’s system solution includes an electrical excitation signal generator, which both pre-charges the high-voltage circuit and produces the excitation signal. This setup allows the DC link capacitors to act as a secondary energy storage—alongside the battery—making the excitation process more energy efficient.

By measuring how the cells respond across different frequencies to the current excitation, the responses reveal subtle changes in the cell’s internal condition, such as temperature gradients, ageing effects, or micro short circuits. Unlike traditional time-based measurements, EIS provides a fast and reliable way to assess the impedance of each cell and distinguish from capacity fade, to estimate battery health even during dynamic conditions like charging or load shifts.

https://www.nxp.com

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