Latest Bluetooth module from Panasonic now in mass production and supporting Bluetooth 6.0

Now in mass production, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication.

All 32 pins available on nRF54L15 are routed out on to a hybrid packaging consisting of castellated edges and LGA in a hybrid layout such that a dedicated number of pins positioned at the edge lending for easy prototyping, with the rest of the GPIOs located at the bottom that allows leveraging the full potential of the wireless SoC platform.

The module benefits from very small dimensions of only 10.35 mm × 9.8 mm × 1.9 mm. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.

Based on nRF54L15, the module is shipped with an open embedded application processor based on ARM Cortex-M33 processor clocking up to 128 MHz for high performance embedded applications with a 256 kB RAM. Furthermore, the module has a non-volatile memory of 1.5 MB as available on the SoC.

However, Panasonic adds further features above and beyond those available on the SoC. Pascal Maier, Head of IOT Devices at Panasonic Industry comments: “Our latest PAN B611-1 Bluetooth module is a versatile device that can support a variety of applications – from ultra-low power battery driven solution to very complex applications like Matter, as well as sophisticated algorithm-heavy features like Channel Sounding. This is why we offer different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4 MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”

An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms.

Furthermore, the PAN B611-1 is ideally suited for Matter applications, as dedicated variants exist with additional flash memory, and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. Apart from Matter, the highly versatile module also supports a variety of wireless protocols in the 2.4 GHz spectrum including Bluetooth LE, Bluetooth Mesh and IEEE 802.15.4 – enabling Zigbee and Thread as well as other third-party proprietary technologies, which make it effortless to develop products for smart home standards like Matter and Zigbee and even allow running multiple wireless protocols concurrently.

The PAN B611-1 Bluetooth module is available with an integrated chip antenna (-1C) or as bottom pad version (-1B) to cater to diverse project needs. It is certified for Europe (CE RED), UK (UKCA), USA (FCC), Canada (ISED), Japan (MIC).

https://industry.panasonic.eu

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Infineon introduces 75 mΩ industrial CoolSiC MOSFETs for medium-power applications

Infineon is expanding its CoolSiC MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems. The devices are available in multiple package options, including TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4. As a result, the product family supports both Top Side Cooling (TSC) and Bottom Side Cooling (BSC) approaches and offers developers a high degree of flexibility. The devices are ideal for high- and medium-power switching mode power supplies (SMPS) in different applications, including AI servers, renewable energy, electric vehicle and e-mobility chargers, humanoid robot chargers, televisions, and drives.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation. The different packages offer various advantages: TOLL and ThinTOLL 8×8 packages provide high thermal cycle stability on the PCB and enable compact system designs. When used in SMPS, they reduce the space requirements on the PCB and lower manufacturing costs at the system level. The list of target applications for TOLL and ThinTOLL 8×8 has been expanded, enabling PCB designers to address cost-reduction challenges. The addition of TOLT strengthens Infineon’s growing TSC product family, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos. The TSC variants allow up to 95 percent direct heat dissipation and enable designers to use both sides of the PCB, improving space utilisation and reducing parasitic effects.

https://www.infineon.com

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Murata’s type 2FR hostless Tri-Radio Module for smart and industrial IoT applications

Mouser is now shipping the new Type 2FR Hostless Wi-Fi 6 + Bluetooth LE 5.4 / 802.15.4 tri-radio module from Murata. The Type 2FR module delivers class-leading integration, efficiency, and multiple radio capabilities for smart home, industrial automation, gaming controllers and smart accessory applications. The module is based on the NXP RW612 wireless microcontroller (MCU), powered by a 260MHz Arm Cortex-M33 core with Trustzone-M, 1.2MB of on-chip SRAM, and a Quad SPI interface with an on-the-fly decryption engine for secure external flash access to support dual-band Wi-Fi 6, Bluetooth Low Energy (BLE) 5.4, IEEE 802.15.4, and Ethernet.

“Hostless” means there’s no need for a separate MCU, saving cost and board space with ultra-compact dimensions, making it the smallest module of this type with a built-in MCU. The module also provides Matter Network over Wi-Fi, Thread, or Ethernet, prioritising security with the latest cybersecurity standards and compatibility with the Matter ecosystem. The Murata LBES0ZZ2FR-EVK evaluation kit, available to order from Mouser, provides a proven design to evaluate the Type 2FR module.

https://eu.mouser.com

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Rugged waterproof fanless digital signage player for harsh outdoor environments

IBASE has announced the release of the SW-602-N, a rugged waterproof fanless digital signage player designed for reliable 24/7 operation in outdoor and harsh environments. Powered by 11th Gen Intel Core processors, the SW-602-N delivers exceptional performance and advanced graphics capabilities, addressing the demanding requirements of next-generation outdoor display applications.

Engineered with a robust fanless architecture and an IP65-rated waterproof enclosure, the SW-602-N ensures silent, low-maintenance operation while protecting internal components from dust, rain, and moisture. It supports a wide operating temperature range from -40°C to 70°C and features dual M25 HDMI outputs for driving independent displays. These capabilities make it an ideal solution for outdoor advertising, transit information systems, interactive kiosks, and large-scale video wall installations where reliability and versatility are essential. Its rugged design enables stable operation under harsh conditions, ensuring long-term reliability for mission-critical deployments.

To further enhance durability and connectivity, the SW-602-N is equipped with dual M12 waterproof USB 3.1 ports, a M12 Gigabit LAN interface, and an M.2 M-Key 2280 socket for high-speed data transmission and expansion. Combining rugged construction with versatile functionality, the SW-602-N empowers businesses to deliver high-quality content in both indoor and outdoor environments while minimising downtime and lowering service costs.

https://www.ibase.com.tw/

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