IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing

IDS Imaging is expanding its 3D portfolio with Nion, an industrial ToF camera featuring 1.2-megapixel resolution and integrated depth processing. It provides high-resolution and temporally stable depth information at 30 fps, even during rapid movements and in changing lighting conditions. This makes it suitable for applications such as logistics, automation and robotics, where precise 3D data is required at real-world process speeds.

The Nion captures moving objects with virtually no blurring. Its high resistance to stray light ensures reproducible measurement results both indoors and outdoors. The measuring range of 0.3 to 7.5 metres covers typical industrial scenarios. The robust IP67-rated housing allows it to be used in more demanding environments. Power over Ethernet (PoE) reduces installation effort and cabling.

Compared to standard ToF cameras on the market, the onsemi AR0130 depth sensor offers higher resolution, lower noise, more stable results in ambient light and improved motion stability. This enables the Nion to achieve high depth accuracy even when objects are moving quickly and under variable lighting conditions.

ids-imaging.en

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Rohm launches new lineup of 17 high-performance Op Amps

Rohm has added the new CMOS op amp series “TLRx728” and “BD728x“ to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems.

In recent years, demand for high-accuracy op amps has been rapidly increasing as automotive and industrial systems become more sophisticated, demanding faster speed, better precision, and higher efficiency. In applications requiring amplification of sensor outputs, minimising signal error and delay is essential. To meet these requirements, a well-balanced set of key characteristics is needed, including Input Offset Voltage, Noise, and Slew Rate.

These new products are high-performance op amps that offer a low input offset voltage, low noise, and high slew rate. TLRx728 features an input offset voltage of 150 µV (typ.), while the BD728x offers 1.6 mV (typ.). Both series have a noise voltage density of 12 nV/√Hz at 1kHz and a slew rate of 10 V/µs. They are therefore suitable for a wide range of precision applications, including sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems. Both series are designed to balance versatility and high performance rather than being limited to specific applications.

Rail-to-Rail input/output capability allows maximum utilisation of the power supply voltage range, ensuring a wide dynamic range.

Furthermore, in addition to 1 channel, 2 channels, and 4 channels configurations, a diverse range of packages is available, enabling optimal product selection based on application and board size.

rohm.com

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Power‑management optimized ICs for STM32 microprocessors in industrial applications

ST’s STPMIC1L and STPMIC2L power-management ICs (PMICs) help designers leverage the embedded-processing muscle of ST’s Arm Cortex-A microprocessors (MPUs) in performance-oriented industrial applications.

Tailored for the 32-bit STM32MP1x and 64-bit STM32MP2x series, the new PMICs deliver cost-effective power and protection while saving board space, simplifying hardware design, and minimising the bill of materials. With multiple fixed and adjustable LDOs and DC/DC buck converters for all MPU power rails, each PMIC also contains an LDO suited to powering external DDR DRAM.

The PMICs target equipment such as point-of-sale (POS) terminals, network gateways, home-automation systems, edge-processing platforms, printers, barcode scanners, and metering systems. With their extended junction temperature rating from -40°C to 125°C, the devices withstand harsh environments in applications like industrial controls, thermostats, and smart-factory devices.

The STPMIC1L for the STM32MP1 series has two DC/DC buck converters and four LDOs, one LDO for DRAM, and two external pins for power control. The STPMIC2L for the STM32MP2 series has three DC/DC buck converters and seven LDOs for the 64-bit MCUs, one DRAM LDO, and three pins for power control. Each has a large input voltage range, from 2.8V to 5.5V, easing the design of equipment powered from a low-voltage AC/DC wall adaptor, USB outlet, or Li-ion or Li-Po batteries.

The buck converters of these PMICs implement adaptive constant on-time (COT) to ensure fast transient response, as well as supporting dynamic voltage scaling for optimal efficiency. Safety and protection include programmable output discharge modes, selectable overcurrent protection (OCP), and power-rail monitoring. The PMICs also handle power-up/down sequencing and meet the MPUs’ accuracy and settling-time specifications.

Two evaluation boards, STEVAL-PMIC1LKV1 and STEVAL-PMIC2LKV1, are available to help engineers kick-start their projects and accelerate development. Each has a dedicated graphical user interface that eases configuring and monitoring the PMIC on the evaluation board and setting up the NVM parameters.

Both STPMIC1L and STPMIC2L are fully supported by the STM32 MPU ecosystem, in OpenSTLinux.

www.st.com/STPMIC1L-2L

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Wireless modules for embedded systems now available from Tria Technologies

Tria Technologies, an Avnet company has announced the availability of two new wireless modules, the SPB611 and SPB209. These modules support multiple short-range protocols and help speed the development of wireless-enabled embedded systems.

The SPB611 supports Wi-Fi 6 (802.11ax 80 MHz) dual-band and Bluetooth 5.2, while the SPB209 offers Wi-Fi 5 (802.11ac) and Bluetooth 4.2. The SPB611 (Wi-Fi 6) module also offers a tri-radio option to add 802.15.4-2020 (Thread and ZigBee) mesh networking capabilities. Both modules can be supplied with an LTE filter and PCB antenna to reduce system size.

These 3.3V modules are supplied in a compact 14 x 14 mm (196 mm2) 41-pin form factor. A 4-bit SDIO 3.0 and HS-UART provide the external interface for WLAN and Bluetooth data respectively, supported by extensive DMA hardware to minimise the processing load on the host CPU. Sleep and standby modes enhance the low power design, and the broad temperature operating range of -40 to +85°C makes the modules ideal for a wide range of industrial applications.

Both modules were previously available in custom Tria System Solutions and pre-integrated on Tria SMARC compute modules. Now they are also offered as stand-alone products under the Tria brand, providing engineers complete flexibility to meet wireless connectivity needs using SMARC compute modules, custom Tria system or by deploying the modules as stand-alone devices on their own hardware or custom carrier board.

“As the only leading embedded compute board manufacturer that also designs and manufactures wireless modules, we are uniquely positioned to provide unified software and support for both compute and RF components,” said Thomas Staudinger, President of Tria. “The benefits to customers of buying from a single supplier include simplified software upgrades, ensured software compatibility and direct support to help engineers comply with security requirements such as the RED DA and the Cyber Resilience Act (CRA). Working with Tria also ensures that the wireless module lifecycle will match the compute module, eliminating the expense of wireless modules reaching end of life before the compute board.”

The modules also benefit from Tria bringing over 10 years of experience in integrating RF connectivity for embedded compute. They are pre-certified, fast-tracking time to market and reducing certification costs. A BlueZ software stack qualification avoids test effort and ensures full compliance, facilitating a much faster and cost-effective listing and logo license.

tria-technologies.com

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