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Ibase announce new ultra-compact rugged embedded edge computer

Thu, Jul 31, 2025

IBASE Technology has released the CP100 ultra-compact rugged embedded edge computer, purpose-built for high-reliability and long-term operation in space-limited environments. Powered by the AMD Ryzen Embedded R2000 Series processor, the CP100 offers three chipset configurations, allowing users to tailor computing performance to specific application needs.

Engineered for minimal footprint, the CP100 adopts a 2.5-inch SBC design with a compact system size of just 94(W) x 133(D) x 51(H)mm, making it ideal for industrial and embedded edge applications requiring efficient, multi-threaded performance in tight spaces. It also supports DIN-rail mounting, enabling easy deployment in various automation systems and equipment architectures.

The CP100 features dual HDMI 2.0 ports, supporting simultaneous dual 4K display output for consistent, high-quality video performance. It supports PDPC (Peripheral Device Power Control) function, optimising power efficiency for connected peripherals. With four configurable RS-232/422/485 serial ports, the system enables seamless connectivity with a wide range of industrial sensors and devices, making it well-suited for smart manufacturing, industrial automation, smart retail, and intelligent logistics applications.

To meet the demands of high-speed networking and flexible storage expansion, the CP100 includes multiple M.2 slots (E-Key and M-Key), supporting WiFi, Bluetooth, LTE/5G wireless modules, and high-performance NVMe storage devices, delivering scalability and future-proofing for evolving system requirements.

Key Features of CP100:

• Powered by AMD Ryzen Embedded R2000 processors with scalable performance options
• Ultra-compact design with DIN-rail support for easy deployment in tight spaces
• Dual HDMI 2.0 outputs for simultaneous 4K video display
• Four configurable COM ports for versatile industrial device integration
• Multiple M.2 expansion slots for wireless connectivity and high-speed storage

http://www.ibase.com.tw

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Battery management technology from TI delivers up to 30% longer run time

Tue, Jul 29, 2025

Texas Instruments has introduced new single-chip battery fuel gauges with first-of-its-kind adaptive Dynamic Z-Track technology for more efficient, reliable operation in battery-powered devices. Compared to traditional gauging methods, the predictive modelling algorithm in TI’s BQ41Z90 and BQ41Z50 gauges achieve industry-leading state-of-charge and state-of-health accuracy within 1% error, helping extend battery run time by up to 30%.

As users demand more power from electronics, such as laptops, e-bikes and portable medical devices, battery management systems (BMSs) must provide precise, accurate, real-time monitoring. The BQ41Z90 and BQ41Z50 fuel gauges with Dynamic Z-Track technology help engineers design electronic devices with accurate battery capacity readings, even under unpredictable loads. With this increased accuracy, engineers can select a battery size with confidence, eliminating the need for oversized batteries.

Battery-powered electronics are becoming more complex, making it even more important to use board space efficiently. The BQ41Z90 is the industry’s first highly integrated fuel gauge, monitor and protector for 3-to-16 lithium-ion (Li-ion) battery cells in series. This single-chip solution enables engineers to reduce complexity and save as much as 25% of board space compared to traditional discrete solutions. The BQ41Z50 supports 2-to-4 cells in series.

https://www.TI.com.

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Renesas introduces 64-bit RZ/G3E MPU for high-performance HMI systems

Tue, Jul 29, 2025

Renesas has announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimised for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm® Cortex-A55 running at up to 1.8GHz with a Neural Processing Unit (NPU), the RZ/G3E brings high-performance edge computing with AI inference for faster, more efficient local processing. With Full HD graphics support and high-speed connectivity, the MPU targets HMI systems for industrial and consumer segments including factory equipment, medical monitors, retail terminals and building automation.

At the heart of the RZ/G3E is a quad-core Arm Cortex-A55, a Cortex-M33 core, and the Ethos-U55 NPU for AI tasks. This architecture efficiently runs AI applications such as image classification, object recognition, voice recognition and anomaly detection while minimising CPU load. Designed for HMI applications, it delivers smooth Full HD (1920×1080) video at 60fps on two independent displays, with output interfaces including LVDS (dual-link), MIPI-DSI, and parallel RGB. A MIPI-CSI camera interface is also available for video input and sensing applications.

The RZ/G3E is equipped with a range of high-speed communication interfaces essential for edge devices. These include PCI Express 3.0 (2 lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual-channel Gigabit Ethernet for seamless connectivity with cloud services, storage, and 5G modules.

Starting with the third-generation RZ/G3S, the RZ/G series includes advanced power management features to significantly reduce standby power. The RZ/G3E maintains sub-CPU operation and peripheral functions while achieving low power consumption around 50mW and around 1mW in deep standby mode. It supports DDR self-refresh mode to retain memory data, enabling quick wake-up from deep standby for running Linux applications.

Renesas continues to offer the Verified Linux Package (VLP) based on the reliable Civil Infrastructure Platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP Plus, including support for the latest LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments.

Renesas has also introduced system-on-module (SoM) solutions featuring the RZ/G3E. A broad range of SoM solutions will be available from Renesas’ ecosystem partners such as a SMARC module from Tria, an OSM (Size-M) from ARIES Embedded, and an OSM (Size-L) from MXT.

https://www.renesas.com/rzg3e

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Infineon’s CoolSiC MOSFET package enable higher power density for industrial applications

Tue, Jul 29, 2025

Infineon has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability, such as electric vehicle chargers, solar inverters, uninterruptible power supplies, motor drives, and solid-state circuit breakers.

The new CoolSiC 1200 V G2 technology offers significant improvements over the previous generation, enabling up to 25 percent lower switching losses for equivalent RDS(on) devices, thereby increasing system efficiency by up to 0.1 percent. Utilising Infineon’s improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower thermal resistance and an 11 percent reduction in MOSFET temperature compared to G1 family products. The outstanding RDS(on) values, ranging from 4 mΩ to 78 mΩ, along with a broad product portfolio enable designers the flexibility to optimise system performance for their target applications. Furthermore, the new technology supports overload operation up to a junction temperature (Tvj) of 200°C and features high robustness against parasitic turn-on, ensuring reliable operation under dynamic and demanding conditions.

The CoolSiC MOSFETs 1200 V G2 are available in two Q-DPAK configurations: a single switch and a dual half-bridge. Both variants are part of Infineon’s broader X-DPAK top-side cooling platform. With a standardised package height of 2.3 mm across all TSC variants – including Q-DPAK and TOLT – the platform offers design flexibility and enables customers to scale and combine different products under a single heatsink assembly. This design flexibility simplifies advanced power system development, making it easier for customers to customise and scale their solutions.

The Q-DPAK package enhances thermal performance by enabling direct heat dissipation from the device’s top surface to the heatsink. This direct thermal path delivers significantly better heat transfer efficiency compared to traditional bottom-side cooled packages, enabling more compact designs. Additionally, the Q-DPAK package layout design allows for minimised parasitic inductance, which is critical for higher switching speeds. This enhances system efficiency and reduces voltage overshoot risk. The small footprint of the package supports compact system designs, while its compatibility with automated assembly processes simplifies manufacturing, ensuring cost-efficiency and scalability.

https://www.infineon.com/coolsic-mosfet-discretes

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