Tria’s new family of compute modules powered by Qualcomm processors

The new family of embedded compute modules from Tria, an Avnet company specialising in manufacturing embedded compute boards, not only have Qualcomm Dragonwing processors on board—they now support different operating systems. These options include Android, Windows 11 IoT Enterprise, and Yocto Linux. The variety of operating systems supported enable the modules to be used for embedded designs in the industrial, medical, agriculture and construction sectors, as well as any embedded application that can benefit from edge computing, machine learning and AI.

At the heart of these modules are high-performance, low-power Qualcomm Dragonwing processors, providing advanced technology in customised solutions. With advanced edge AI and seamless networking capabilities, Qualcomm Dragonwing targets embedded systems for various industries. These processors have been designed for speed, scalability and reliability, enabling customers to achieve smarter decision making, better efficiencies and to reach the market faster.

This means that Tria’s new lineup offers a powerful CPU and AI combination at lowest power consumption, enabling embedded designs to benefit from higher performance and increased capabilities.

Tria also now provides Microsoft Windows with ARM, allowing a transition from the x86 architecture to ARM with the same OS. This transition was previously not possible, since Windows on ARM was not available.

“Our collaboration with Qualcomm Technologies has enabled us to deliver high performance and low power technology with highest quality they are used to receiving from Tria in our new compute modules,” said Christian Bauer, Product Marketing Manager, Tria Technologies. “This family of modules is the only one available to offer compatibility with multiple operating systems at a competitive price.”

“With multi-OS support across Tria’s new modules powered by Qualcomm Dragonwing and Snapdragon platforms, customers gain the flexibility of Windows, Android and Linux across our different platforms”, said Douglas Benitez, Senior Director, Business Development, Qualcomm Europe, Inc. “Our collaboration with Tria is accelerating industrial innovation—delivering high performance, low power compute and accelerated AI at the edge.”

Qualcomm Dragonwing processors are known for their performance, efficiency and advanced AI capabilities, offering powerful performance in multi-core tasks and great GPU performance, but also more efficient power consumption in mobile and portable systems.

https://www.Tria-technologies.com

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ASRock launches industrial motherboards for AI-driven Edge applications

ASRock Industrial has announced its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, Micro-ATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

ASRock industrial’s Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, Micro-ATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

For compact systems, the Mini-ITX models feature two DDR5 4800/5600 MHz memory slots up to 96GB, support quad displays on Q670/W680, triple displays on H610, and offer dual LAN ports—one 2.5G and one 1G. Models with streamlined I/O options include the IMB-1239-WV, IMB-1240-WV, IMB-1244-WV, and IMB-X1240-WV, IMB-X1244-WV, supporting H610, Q670, and W680 chipsets. For applications that require expanded I/O capabilities, additional Mini-ITX options such as the IMB-1237, IMB-1238, and IMB-X1238 are also available with the same chipset support.

In the Micro-ATX lineup, IMB-X1316-10G and IMB-X1316 are powered by the W680 chipset and IMB-1316 with a Q670 chipset support quad-display output, up to 192GB DDR5 4400/5600 MHz memory, multiple PCIe Gen5/Gen4 slots, and advanced networking with 10G (IMB-X1316-10G), 2.5G, and 1G LAN. IMB-1318 and IMB-1315, based on H610, featuring DDR5 4800/5600 MHz memory up to 96GB, triple HDMI (IMB-1318), dual HDMI (IMB-1315) and dual 1G LAN.

For high-performance needs, the ATX models includes IMB-X1714 with W680 chipset, IMB-1714 based on Q670 chipset, and IMB-1713 featuring H610 chipset. These ATX boards offer support up to 192GB DDR5 memory (IMB-1714/IMB-X1714), multiple PCIe Gen5/Gen4 slots, triple displays, and up to triple LAN with 2.5G support (IMB-1714/IMB-X1714). The series is ideal for smart manufacturing, autonomous robotics, AI inference, Retail and advances edge computing.

ASRock Industrial also provides a lineup of DDR4 supported motherboards for Intel Core 200S Series Processors, delivering solutions optimised for AI-enabled industrial environments.

Within the Mini-ITX high-rise I/O category, models such as IMB-1230, IMB-1241, and IMB-1242 are built on the H610 chipset, while IMB-1231 and IMB-X1231 adopt the Q670 and W680 chipsets respectively, supporting up to 64GB DDR4 3200 MHz memory, quad or triple displays outputs, and dual LAN for reliable edge connectivity. For compact thin I/O designs, the Mini-ITX series includes IMB-1232-WV with H610, IMB-1233-WV with Q670, and IMB-X1233-WV with W680, offering wide voltage input, essential I/O, dual LAN and up to quad display support, ideal for space-constrained deployments such as retail automation, kiosks, and edge devices running lightweight AI workloads.

The Micro-ATX models include IMB-1314 with Q670 and IMB-X1314 with W680, providing dual DDR4 3200 MHz memory support up to 128GB, four PCIe Gen4 slots, quad-display output, dual 2.5G LAN (IMB-1314) and triple 2.5G LAN (IMB-X1314), and USB 3.2 Gen2 for smooth data processing and connectivity in AI-assisted manufacturing and system monitoring applications.

In the ATX form factor, IMB-1712 powered by Q670 and IMB-X1712 by W680 offer high expandability with triple 2.5G LAN (IMB-X1712,) and dual 2.5G LAN (IMB-1712), four PCIe Gen4 slots, M.2 and SATA storage interfaces, and triple display output including HDMI, DP and VGA. These platforms are designed for long-life deployment in industrial control, intelligent surveillance, smart retail, and AI-enhanced display centric systems at the edge.

ASRock Industrial’s latest industrial motherboards, now supporting Intel Core 200S series processors (Bartlett Lake-S) through BIOS updates, are engineered to accelerate AI-driven applications at the edge. Offering flexible configuration with DDR5 and DDR4 memory across Mini-ITX, Micro-ATX, and ATX form factors, the series is tailored for smart manufacturing, machine vision, intelligent automation, and industrial AIoT and more.

https://asrockind.com

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TDK InvenSense’s ultrasonic ToF range sensor for ultra-long-range applications

Mouser is now stocking the ICU-30201 ultrasonic time-of-flight (ToF) range sensor from TDK InvenSense. The ICU-30201 is a high-performance ToF sensor for ultra-long-range applications, measuring distances from 30 cm to 9.5 m with millimeter accuracy. The sensor enhances contextual awareness and reliability in diverse environments, including smart homes, robotics, and obstacle avoidance.

The TDK InvenSense ICU-30201 ultrasonic ToF range Sensor delivers accurate measurements in any lighting condition, from full sunlight to complete darkness, and can detect optically transparent surfaces such as glass and clear plastics. The ICU-30201 supports multi-object detection with a customisable field-of-view (FOV) up to 180°. The sensor also features a 53 kHz piezoelectric micro machined ultrasonic transducer (PMUT) — a second-generation ultra-low power System-on-Chip (SoC) — and a 40 MHz integrated CPU for on-chip algorithms including range finding, human presence, and wake-on approach.

The ICU-30201 sensor offers a sample rate of 75 samples per second at two meters and 18 samples per second at nine meters. With ultra-low power consumption (22µA to 318µA depending on the number of samples per second), the ICU-30201 helps extend battery life in devices including smart speakers, meeting room devices, and smart door locks. A single bottom port package for receiving and transmitting allows for easy mechanical integration. The ICU-30201 sensor comes in a compact 5.17 × 2.68 × 0.9 mm LGA package and includes an integrated digital signal processor (DSP). The sensor is compatible with standard surface mount device (SMD) reflow and has an operating temperature range of -40°C to +85°C.

https://www.mouser.com

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ST announces mass production for turnkey Bluetooth/Wi-Fi modules developed with Qualcomm

STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.

The module is the first product of ST’s collaboration with Qualcomm Technologies, announced by the two companies in 2024, to simplify implementing wireless connectivity in systems containing STM32 microcontrollers (MCUs). Their vision, now realised in silicon, fuses ST’s expertise in embedded design and the STM32 ecosystem of microcontrollers, software, and development tools integrated with Qualcomm Technologies’ wireless connectivity technologies.

“Wireless connectivity is a key enabler for the cloud-connected intelligent edge and demand for smart, connected devices continues to expand and accelerate throughout consumer and industrial markets,” said Jerome Vanthournout, Connectivity Business Line Director, STMicroelectronics. “Mastering the complex Wi-Fi and Bluetooth protocols, and bringing that connectivity to devices and IoT applications, are huge challenges. Our modular solution, created with industry-leading knowhow of all aspects, lets product developers focus their resources at the application level and bring new products to market quickly.”

Shishir Gupta, Senior Director, Product Management at Qualcomm Technologies added, “Qualcomm Technologies is thrilled to see the impact of our collaboration with STMicroelectronics through the ST67W module. This module, which contains Qualcomm Technologies’ wireless connectivity components, not only simplifies the integration of Wi-Fi and Bluetooth into a wide range of devices powered by STM32 microcontrollers but also offers incredible flexibility and scalability. This module is a testament to our joint commitment to driving innovation and excellence in the IoT space.”

The ST67W module is ready to integrate with any STM32 MCU and contains a Qualcomm Technologies multiprotocol network coprocessor and 2.4GHz radio. All RF front-end circuitry is built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module comes pre-loaded with Wi-Fi 6 and Bluetooth 5.4 and is pre-certified according to mandatory specifications. Thread and Matter will be supported soon via software update. There is also an optional coaxial antenna or board-level connections for an external antenna. Security is handled with cryptographic accelerators and services including secure boot and secure debug reaching PSA Certified Level 1, making it easy for customers to comply with the upcoming Cyber Resilience Act and RED directives.

Product developers need no RF design expertise to create a working solution using this module. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

Siana Systems is among the first IoT technology companies to explore the opportunities this wireless connectivity module brings to enhance product performance and accelerate time to market.

“The ST67W module expands opportunities to add Wi-Fi to devices powered by various STM32 microcontrollers and worry less about the minimum requirements. We can simply integrate the module and quickly get Bluetooth and Wi-Fi connectivity, with minimal additional engineering, which provides us with a simple go-to solution for our next generation designs,” said Sylvain Bernard, Founder and Solution Architect, Siana Systems. “The module’s RF performance, with the radio and front-end circuitry integrated, is very strong, and the flexible power management with fast wake-up times lets us create extremely energy-efficient new products.”

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. The STM32 family covers a broad spectrum from economical Arm® Cortex®-M0+ devices to variants with high-performing cores like Cortex-M55, Cortex-M4 with DSP extensions, and Cortex-A7 in the STM32MP1/2 MPUs.

http://www.st.com

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