Rohm develops new compact surface-mount near-infrared LEDs

Rohm has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with new compact top-view types. They are optimised for applications such as VR/AR devices, industrial optical sensors, and human detection sensors.

The demand for advanced sensing technologies utilising near-infrared (NIR) has grown in recent years, particularly in VR/AR equipment and biosensing devices. These technologies are used in applications such as eye tracking, iris recognition, and blood flow/oxygen saturation measurements that require high accuracy. At the same time, miniaturisation, energy efficiency, and design flexibility are becoming increasingly important. In industrial equipment, near-infrared LEDs are playing a greater role with the rise of precise printer control and automation systems. In response, Rohm is expanding customer options by developing a lineup of compact packages and wavelengths that offer greater design flexibility, while contributing to higher precision and power savings by achieving high radiant intensity.

The new lineup consists of six models in three package configurations, including two ultra-compact (1.0mm × 0.6mm), ultra-thin (t=0.2mm) products as part of the PICOLED series: SML-P14RW and SML-P14R3W. In addition, there are four variants in the industry-standard (1.6mm × 0.8mm) size, featuring a narrow beam circular lens package (CSL0902RT, CSL0902R3T) and flat lens design that emits light over a wide range (CSL1002RT, CSL1002R3T). Each package is available in two wavelengths, 850nm (860nm for the SML-P14RW) and 940nm, allowing customers various options for their specific application needs. The 850nm wavelength is ideal for phototransistors and camera sensors, making it suitable for high-sensitivity applications such as eye tracking and object detection in VR/AR. At the same time, the 940nm wavelength is less affected by sunlight and does not appear red when emitting light, making it suitable for motion sensors. It is also widely used in biosensing applications such as pulse oximeters to measure blood flow and oxygen saturation (SpO2).

The light source incorporates an NIR element with an optimised emission layer structure utilising proprietary technology developed through in-house manufacturing expertise. This has made it possible to achieve industry-leading radiant intensity in a compact package, which was previously considered difficult. For example, compared to a standard 1006 size product, the SML-P14RW delivers approx. 1.4 times the radiant intensity at the same current. In other words, the SML-P14RW consumes 30% less power to achieve the same radiation intensity. This technology improves sensing accuracy and power savings for the entire system.

https://www.rohm.com

> Read More

Silanna launches industry’s smallest laser driver platform

Silanna Semiconductor has launched the FirePower series of laser driver ICs that reduce the size and increase the peak power of LiDAR applications.

FirePower Laser Driver ICs are the first to combine charging and firing on a single chip. This enables a significant reduction in size and losses as well as the removal of several components from the PCB to reduce the component count and BOM cost.

The integration also creates the ability to develop high-performance laser-based applications that deliver unmatched pulse power and precision. For example, using the IC enables a 400 W quad EEL (Edge-Emitting Laser) module to shrink from 400 mm2 to 80 mm2 (an 80% improvement), while enabling a 73% improvement in VIN-to-laser efficiency.

The first product to be launched in the FirePower family is the SL2001, a 14-pin 3.5 mm2 IC with a sub-2 ns FWHM laser pulse and dual drive for peak-power outputs of up to 1000 W.

The device has high charging efficiency and operates from a supply range of 3 V to 24 V to fire either EEL diodes or VCSELs (Vertical Cavity Surface Emitting Laser) with a pulse repetition frequency of over 10 MHz.

The SL2001 also has a differential Laser Fire output indication with a sub 0.1 ns Peak-to-Peak jitter. Built in laser output power sensing and control enables the SL2001 to meet eye-safety requirements. The device also uniquely implements programmability via an I2C interface and multi-time-programmable ROM, removing the need for an on-PCB MCU. The SL2001 can track and respond to both input voltage and resonant capacitor voltage.

The IC is targeted at LiDAR and other time-of-flight sensing systems used in industrial manufacturing, and automotive systems.

Product Marketing Director Ken Boyden said: “LiDAR and similar laser-based applications have traditionally relied on third party power supply regulators to meet the high voltage requirements of resonant pulsed laser systems. The FirePower family is the first to consolidate both highly efficient high voltage charging and high-power firing on a single chip. As the first product in the FirePower family, the SL2001 sets new benchmarks for performance and efficiency, while reducing component count and BOM cost.”

https://silannasemi.com

> Read More

u-blox launches first triple-band GNSS module for fast-scaling robotics

u-blox has expanded its ZED form-factor portfolio with the launch of the ZED-F20P, a new L1/L2/L5 triple-band GNSS module designed for high precision applications in ground and air robotics. The ZED-F20P provides OEMs deploying fleets of ground robots, drone light shows, and other dynamic autonomous platforms with centimetre-level RTK and PPP-RTK positioning, fast convergence times, and integrated security features.

It delivers deterministic, centimetre-level RTK and PPP-RTK accuracy tailored to the needs of lightweight and dynamic platforms. Its end-to-end silicon-to-firmware architecture supports 25 Hz update rates, robust security features, and low power consumption in a streamlined design. These capabilities combine to deliver industrial-grade reliability and enable smooth scaling from proof-of-concept to high-volume deployment without increasing system cost, power consumption, or integration complexity.

Compatible with the established ZED footprint and UBX protocol, the ZED-F20P fits directly into existing layouts. The expanded ZED portfolio now covers dual-, triple-, and all-band GNSS options, giving developers the flexibility to select the best fit while reusing the same board layout. This enables both flexible design choices and a straightforward upgrade from earlier products. The ZED-F20P pairs with the u-blox ANN-MB2 all-band high precision antenna to ensure optimal RF performance, offering a one-stop solution for streamlined evaluation and integration.

When combined with u-blox PointPerfect Flex and Live GNSS correction services, the ZED-F20P becomes a complete, production-ready GNSS solution that delivers centimetre-level accuracy in seconds, without the need for a local base station. The triple-band L1/L2/L5 architecture ensures rapid convergence and resilience in challenging environments, while PointPerfect provides reliable corrections across key regions.

https://www.u-blox.com/en/product/zed-f20p-module

> Read More

Renesas extends RZ/A MPU line-up with RZ/A3M advanced HMI solutions

Renesas has introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280×800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems.

Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory.

The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M’s BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimising layout constraints.

Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development.

https://www.renesas.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration