TME adds Raytac BLE modules for IoT and industrial designs
TME has expanded its wireless connectivity catalogue with Raytac Bluetooth Low Energy (BLE) modules designed to simplify the development of connected products for the Internet of Things (IoT), medical electronics and industrial automation.
Based on Nordic Semiconductor system-on-chips (SoCs), the ready-made modules integrate the radio system, microcontroller and peripheral components required for wireless communication. This allows designers to implement connectivity without having to develop the complete RF section from scratch.
Nordic SoCs support BLE and multiple wireless protocols
Depending on the model, Raytac modules use Nordic SoCs with Arm Cortex-M4F or Cortex-M33 processor cores. Program memory ranges from 192 kB to 1.5 MB, while RAM capacity reaches up to 256 kB, providing resources for both wireless communication and the main application.
The modules support Bluetooth Low Energy versions from 4.0 to 6.2, with data rates of up to 2 Mbit/s. Bluetooth Long Range modes support data rates of 500 kbit/s and 125 kbit/s.
Selected modules based on nRF54 devices also support proprietary 2.4 GHz transmission at data rates of up to 4 Mbit/s. Depending on the model, maximum transmitter output power is 4, 6 or 8 dBm, while receiver sensitivity can reach -103 dBm.
In addition to Bluetooth, selected hardware platforms support ANT+, Thread and Zigbee, as well as the IEEE 802.15.4 standard, giving designers options for different wireless architectures and applications.
Security and flexible embedded interfaces
The modules incorporate AES-128 encryption using a cryptographic coprocessor to help protect transmitted data in security-conscious applications.
They operate from a 1.7–5.5 V DC supply and are specified for temperatures from -40°C to +105°C. This operating range makes the modules suitable for applications ranging from consumer and household equipment to industrial and outdoor systems.
Depending on the model, Raytac modules provide between eight and 48 configurable I/O lines, together with multiple analogue-to-digital converter (ADC) channels. Supported interfaces include UART, I²C, I²S, SPI, QSPI, PDM, USB and NFC, allowing the SoC to connect directly to sensors, memory, displays and other peripherals.
Compact modules simplify RF integration
Each Raytac module is supplied on a compact PCB designed for surface mounting within a host device. Modules within the same series maintain a common pin layout, although antenna implementation can vary between models.
Depending on the module, the antenna may be integrated as a chip antenna, implemented on the module PCB or connected externally through a dedicated u.FL connector. Pin layouts can differ between separate Raytac series.
“Designing an RF path from scratch involves costly and time-consuming testing procedures,” said Marcin Cichomski, head of the Semiconductor Product Group at TME. “By making pre-tested and certified Raytac modules readily available in our catalogue, we enable engineers to streamline their design phase, bypass complex radio certification hurdles and bring robust connected products to market faster.”
