Tria launches compact OSM-compliant module powered by NXP
Tria Technologies has launched the OSM-LF-IMX95 module which brings high performance, security, flexibility and power efficiency to next-generation edge platforms. Compliant with the Open Standard Module (OSM) Specification 1.2, the compute module comes in a tiny package of only 45 x 45 mm in size (Size L), yet with the powerful, NXP i.MX 95 SoC, enabling developers and design engineers to increase performance of advanced embedded and edge AI systems.
The module contains the six-core 2GHz Arm Cortex-A55 application processor and two real-time Arm processors, the 800MHz Arm Cortex-M7 and the 333MHz Arm Cortex-M33. Additionally, it features an Arm Mali graphics processing unit (GPU), a 4k decode/encode vision processing unit (VPU), but also NXP’s eIQ Neutron neural processing unit (NPU) and a new image signal processor, delivering powerful AI-accelerated vision processing and enabling Edge AI workloads like predicative maintenance, object classification, production line monitoring, and more.
Tria’s OSM-LF-IMX95 module is suitable for building next-generation low-power edge platforms in sectors that require functional safety, advanced security and high-performance connectivity, for example in industrial automation and robotics, vision systems and mobile devices.
Advanced security features are built-in to the OSM-LF-IMX95 module. For example, an integrated EdgeLock Secure Enclave sub-system simplifies the implementation of security critical functions such as secure boot, cryptography, trust provisioning, run-time attestation, key management services, provision for secure remote management, secure over-the-air updates (OTA) and dedicated cryptographic engine.
Among the module’s other features are a fast up to 16GB LPDDR5 SDRAM with inline ECC support, up to 256GB eMMC Flash memory and high-speed interfaces that include SerDes interface (SGMII up to 10G Ethernet), two Gigabit Ethernet (RGMII interface), USB 3.0 and PCI Express Gen 3. Various standard interfaces for embedded applications such as 3x CAN-FD, dual-channel LVDS, MIPI DSI and dual MIPI CSI-2 camera interface are also available for added flexibility. The QSPI interface enables seamless connectivity to FPGAs on the carrier board and also supports the onboard NOR Flash.
To simplify design-in and evaluation of the OSM-LF-IMX95 module, Tria also provides a development platform and a starter kit. In addition, a Yocto based Linux Board Support Package is available (Android 12 and Windows 10 IoT Enterprise support on request).
