Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance
Adlink has announced the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.
Powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is for high-performance battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.
The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).
In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.
The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximises space efficiency without compromising functionality for next-generation edge applications. Adlink offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2nd half of 2025.
