New single board computer from Kontron with 13th Gen Intel Core U-Series processors
Kontron, has announced the latest generation of its 3.5”-SBC product family, named 3.5”-SBC-RPL. The 3.5”-SBC-RPL is a single board computer driven by hybrid-core 13th Gen Intel Core U-Series and Intel U-Series Processors (codenamed Raptor Lake U) which enable an optimal synergy between performance and efficiency. With integrated Intel Iris Xe Graphics, AI acceleration features and real-time computing capability on the same chip, the board can help system developers build a compact edge system that requires excellent graphics, efficient computing, real-time processing and / or AI acceleration for a variety of applications, such as smart manufacturing, healthcare, retail and smart city. Samples will be available to customers in January 2025.
The 3.5”-SBC-RPL leverages hybrid computing architecture, combining performance and efficiency cores within the 13th Gen Intel Core U-Series processors. This enables intelligent workload management by assigning demanding tasks to performance cores and energy-efficient tasks to efficiency cores, optimising performance per watt. The design allows smaller thermal solutions and is ideal for compact systems. The new 3.5”-SBC-RPL Single Board Computer offer multiple embedded controller features and uses advanced technology components.
With integrated Intel Iris Xe Graphics, the 3.5”-SBC-RPL supports 8K resolution at 60 fps via two DisplayPort connectors. It can extend to four displays through additional ports, ideal for video walls and control rooms. An eDP/LVDS combo connector is available for all-in-one systems. The GPU supports up to 96 execution units, enabling AI acceleration for edge devices, alongside Intel Deep Learning Boost and Intel® Gaussian & Neural Accelerator 3.0, delivering cost- and power-efficient AI computing.
The board incorporates two DDR5 SO-DIMM sockets (up to 5200 MHz), dual 2.5 GbE LAN Intel i226 controllers, and four USB 3.2 Gen 2 connectors (10 Gbps). Certain variants feature Intel Time Coordinated Computing (TCC) and IEEE 802.1 Time-Sensitive Networking (TSN), ensuring real-time, low-latency communication within and between systems, critical for real-time AI processing. The configurable TDP (12 W to 28 W) allows flexibility in system design based on cooling solutions.
The 3.5”-SBC-RPL offers three M.2 slots for SSD, WLAN, Bluetooth, WWAN, and other expansions. A board-to-board connector allows developers to add one of the expansion boards, named 3.5″-eIO, for extra I/O ports or features, including additional display (DP & HDMI) connectors and LAN ports. The 3.5″-eIOs support both standard and industrial operating temperature ranges and are compatible with the 3.5”-SBC-RPL, 3.5”-SBC-ADN, 3.5”-SBC-AML as well as previous generations the 3.5″-SBC-EKL and the 3.5″-SBC-TGL. 3.5”-eIO Series expansion boards enable faster time-to-market and reduced development costs.
Designed for harsh environments, the 3.5”-SBC-RPL supports a wide input voltage range (9 V to 36 V) for unstable power conditions and integrates a TPM 2.0 security chip for enhanced hardware-level security, protecting user data, network access, and ensuring operational integrity against cyber threats. Some variants are designed for continuous operation (24/7) under harsh operating conditions and on high system load.
Seven variants are available, in both industrial-grade (-40 °C to 85 °C) and commercial-grade (0 °C to 60 °C) temperature ranges, using Intel® Core™ i7, i5, i3, and U300E processors.
3.5”-SBC-RPL ensures an extended long-term availability of up to 10 years from the release date, due to embedded key components and is CE, FCC, ICES, UKCA & UR (UL Recognised) compliant.
